公开(公告)号：US12266551B2

公开(公告)日：2025-04-01

申请号：US18317347

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Srinivasa Rao Yedla

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/683

Abstract: Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.

公开(公告)号：US12217982B2

公开(公告)日：2025-02-04

申请号：US18585505

申请日：2024-02-23

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra Savandaiah ,  Nitin Bharadwaj Satyavolu ,  Srinivasa Rao Yedla ,  Bhaskar Prasad ,  Thomas Brezoczky

IPC: H01L21/67 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34

Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.

公开(公告)号：US12195314B2

公开(公告)日：2025-01-14

申请号：US17165427

申请日：2021-02-02

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Srinivasa Rao Yedla

IPC: B66F3/36 ,  B66F3/24 ,  B66F13/00 ,  H01J37/02

Abstract: A method and apparatus for lifting a process station from a processing module is described herein. The apparatus includes a lift assembly disposed on the processing module, a lift cage, and one or more guide pins. The lift assembly is disposed to be capable of reaching each of the process stations disposed within the processing module. The lift assembly is used for replacement and maintenance of the process stations and further enables the automated removal and placement of the process stations within the processing module. Maintenance methods enabled by the lift assembly are additionally disclosed herein.

公开(公告)号：US11955355B2

公开(公告)日：2024-04-09

申请号：US17185360

申请日：2021-02-25

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra Savandaiah ,  Nitin Bharadwaj Satyavolu ,  Srinivasa Rao Yedla ,  Bhaskar Prasad ,  Thomas Brezoczky

IPC: H01L21/67 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34

CPC classification number: H01L21/67126 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32513 ,  H01J37/32715 ,  H01J37/3405 ,  H01J37/3426 ,  H01J2237/2007 ,  H01J2237/332 ,  H01L21/67167 ,  H01L21/67207

Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.

公开(公告)号：US11170982B2

公开(公告)日：2021-11-09

申请号：US16529211

申请日：2019-08-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Anantha K. Subramani ,  Praburam Raja ,  Steven V. Sansoni ,  John Forster ,  Philip Kraus ,  Yang Guo ,  Prashanth Kothnur ,  Farzad Houshmand ,  Bencherki Mebarki ,  John Joseph Mazzocco ,  Thomas Brezoczky

IPC: H01J37/34 ,  B08B7/00 ,  H01L21/033

Abstract: Methods and apparatus for low angle, selective plasma deposition on a substrate. A plasma chamber uses a process chamber having an inner processing volume, a three dimensional (3D) magnetron with a sputtering target with a hollow inner area that overlaps at least a portion of sides of the sputtering target and moves in a linear motion over a length of the sputtering target, a housing surrounding the 3D magnetron and the sputtering target such that at least one side of the housing exposes the hollow inner area of the sputtering target, and a linear channel interposed between the housing and a wall of the process chamber.

公开(公告)号：US11674227B2

公开(公告)日：2023-06-13

申请号：US17166762

申请日：2021-02-03

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra Savandaiah ,  Srinivasa Rao Yedla ,  Nitin Bharadwaj Satyavolu ,  Ganesh Subbuswamy ,  Devi Raghavee Veerappan ,  Thomas Brezoczky

IPC: C23C16/40 ,  C23C16/455 ,  C23C14/22 ,  C23C14/34

CPC classification number: C23C16/45574 ,  C23C14/228 ,  C23C14/34 ,  C23C16/45544

Abstract: Aspects of the present disclosure provide systems and apparatuses for a substrate processing assembly with a laminar flow cavity gas injection for high and low pressure. A dual gas reservoir assembly is provided in a substrate processing chamber, positioned within a lower shield assembly. A first gas reservoir is in fluid communication with a processing volume of the substrate processing assembly via a plurality of gas inlet, positioned circumferentially about the processing volume. A second gas reservoir is positioned circumferentially about the first gas reservoir, coupled therewith via one or more reservoir ports. The second gas reservoir is in fluid communication with a first gas source. A recursive path gas assembly is positioned in an upper shield body adjacent to an electrode to provide one or more gases to a dark space gap.

公开(公告)号：US11600507B2

公开(公告)日：2023-03-07

申请号：US17016030

申请日：2020-09-09

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Srinivasa Rao Yedla ,  Nitin Bharadwaj Satyavolu ,  Thomas Brezoczky

IPC: H01L21/683 ,  H01L21/68 ,  B65G47/92 ,  H01L21/687 ,  H01L21/67

Abstract: A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source. Each of the first pins comprises an interface element, and a compliance element supporting the interface element. Second pins are coupled to the substrate support, configured to mate with second terminals of the electrostatic chuck, and configured to couple to a second power source. Alignment elements are coupled to the substrate support and are configured to interface with centering elements of the electrostatic chuck. The flexible element is coupled to the substrate support, configured to interface with a passageway of the electrostatic chuck, and configured to be coupled to a gas source.

公开(公告)号：US12080571B2

公开(公告)日：2024-09-03

申请号：US16923792

申请日：2020-07-08

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra Savandaiah ,  Srinivasa Rao Yedla ,  Thomas Brezoczky

IPC: H01L21/67 ,  C23C14/35 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67184 ,  C23C14/35 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707

Abstract: Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting portion from a first location to a shutter stack in a first direction, retrieving the workpiece from the shutter stack, and moving the supporting portion to a second location. The transfer chamber assembly and method allows for moving workpieces to and from the shutter stack to the two process stations. A central transfer robot of the substrate processing module is configured to grip both substrates and shutter discs, allowing for one robot when typically two robots would be required.

公开(公告)号：US11817331B2

公开(公告)日：2023-11-14

申请号：US16940058

申请日：2020-07-27

Applicant: Applied Materials, Inc.

Inventor： Srinivasa Rao Yedla ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Bhaskar Prasad ,  Nitin Bharadwaj Satyavolu

IPC: H01L21/67 ,  B65G29/00 ,  B25J15/00

CPC classification number: H01L21/67196 ,  B25J15/009 ,  B25J15/0019 ,  B65G29/00 ,  H01L21/67167 ,  B65G2201/0297 ,  B65G2814/0313

Abstract: A shutter disc for use in a cluster tool assembly having a processing chamber and a transfer arm includes an inner disc and an outer disc configured to be disposed on the inner disc. The inner disc includes a plurality of locating features configured to mate with locating pins of a transfer arm of a cluster tool assembly and a plurality of centering features configured to mate with alignment elements of a substrate support disposed in the processing chamber of the cluster tool assembly.

公开(公告)号：US11749542B2

公开(公告)日：2023-09-05

申请号：US16939629

申请日：2020-07-27

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Srinivasa Rao Yedla

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/683

CPC classification number: H01L21/67248 ,  H01L22/12 ,  H01L21/6833

Abstract: Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.