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    DATA CENTER COOLING METHOD
    1.
    发明申请
    DATA CENTER COOLING METHOD 有权
    数据中心冷却方法

    公开(公告)号：US20140020885A1

    公开(公告)日：2014-01-23

    申请号：US13551929

    申请日：2012-07-18

    申请人： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

    发明人： Timothy J. Chainer ,  Hien P. Dang ,  Pritish R. Parida ,  Mark D. Schultz ,  Arun Sharma

    IPC分类号： G05D23/00

    CPC分类号： H05K7/20836 ,  G06F1/206

    摘要： A method aspect for removing heat from a data center may use liquid coolant cooled without vapor compression refrigeration on a liquid cooled information technology equipment rack. The method may also include regulating liquid coolant flow to the data center through a range of liquid coolant flow values with a controller-apparatus based upon information technology equipment temperature threshold of the data center.

    摘要翻译： 从数据中心去除热量的方法方面可以使用液体冷却剂冷却而不进行蒸气压缩制冷在液冷信息技术设备机架上。 该方法还可以包括通过使用基于数据中心的信息技术设备温度阈值的控制器装置通过一定范围的液体冷却剂流量来调节流向数据中心的液体冷却剂流。

    Color indicator dosimeter for measurement of ionizing radiation
    4.
    发明授权
    Color indicator dosimeter for measurement of ionizing radiation 失效
    用于测量电离辐射的颜色指示剂剂量计

    公开(公告)号：US07884339B2

    公开(公告)日：2011-02-08

    申请号：US12250981

    申请日：2008-10-14

    申请人： Sumit Gupta ,  Suchandra Chatterjee ,  Prasad S. Variyar ,  Arun Sharma

    发明人： Sumit Gupta ,  Suchandra Chatterjee ,  Prasad S. Variyar ,  Arun Sharma

    IPC分类号： G01N21/78

    CPC分类号： G01T1/00

    摘要： The present invention provides a color indicator dosimeter system to detect and quantify a dosage of ionizing radiation in a wide range wherein said system comprises phenolic glycoside as one of the components. The present invention also relates to a method for using dosimeter system as described hereinabove for detecting and quantifying a dosage of ionizing radiation in a wide range.

    摘要翻译： 本发明提供了一种颜色指示剂剂量计系统，用于检测和量化广泛范围内的电离辐射剂量，其中所述系统包含酚糖苷作为组分之一。 本发明还涉及一种如上所述使用剂量计系统来检测和量化广泛范围内的电离辐射剂量的方法。

    Packaging substrate having pattern-matched metal layers
    6.
    发明授权
    Packaging substrate having pattern-matched metal layers 失效
    具有图案匹配金属层的包装基板

    公开(公告)号：US07759787B2

    公开(公告)日：2010-07-20

    申请号：US11935834

    申请日：2007-11-06

    申请人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    发明人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    IPC分类号： H01L23/053 ,  H01L23/12

    CPC分类号： H05K1/0271 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0005 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/09227 ,  H05K2203/1572 ,  Y10T29/49004 ,  Y10T29/49155 ,  H01L2924/00

    摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.

    摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。

    PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS
    7.
    发明申请
    PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS 失效
    包装与图案匹配的金属层的衬底

    公开(公告)号：US20090114429A1

    公开(公告)日：2009-05-07

    申请号：US11935834

    申请日：2007-11-06

    申请人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    发明人： Sri M. Sri-Jayantha ,  Hien P. Dang ,  Vijayeshwar D. Khanna ,  Arun Sharma

    IPC分类号： H05K1/03 ,  G06F17/50 ,  H05K3/00

    CPC分类号： H05K1/0271 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0005 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/09227 ,  H05K2203/1572 ,  Y10T29/49004 ,  Y10T29/49155 ,  H01L2924/00

    摘要： A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished.

    摘要翻译： 提供具有匹配的热膨胀系数的前金属互连层和背金属互连层的图案匹配对，用于经缩短的经向包装基板。 首先开发了包含高密度布线和复杂图案的金属互连层，使得用于信号传输的互连结构被优化用于电性能。 然后修改包含低密度布线和相对简单图案的金属互连层，以匹配位于芯的相对侧上的镜像金属互连层的图案和与芯相距相同数量的金属互连层。 在这种模式匹配过程中，具有低密度布线的金属层中的电连接的连续性可能会被破坏。 通过额外的设计步骤来治愈中断，其中重新建立低密度电连接的邻接性。