摘要:
Disclosed herein are systems, apparatuses, and methods for providing a proximity coupling without Ohmic contact. Such a system includes a plurality of wireless-enabled components (WECs) that are wirelessly coupled to each other. Each WEC includes a metal-based element, a substrate, and a semiconductor layer that separates the metal-based element from the substrate. A signal is configured to be transmitted via a proximity coupling (e.g., a magnetic coupling, an electric coupling, and/or an electromagnetic coupling) between the metal-based element and the substrate without an Ohmic contact between the metal-based element and the substrate. In an example, a first subset of the plurality of the WECs is co-located on a first chip, and a second subset of the plurality of the WECs is co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.
摘要:
Embodiments of the present invention are directed to a wire-free data center/server. The data center/server is wire-free in the sense that communication within a data unit of the data center/server (i.e., intra-data unit), between data units of the data center/server (inter-data unit), and between the data units and the backplane of the data center/server is performed wirelessly.
摘要:
Embodiments of the present invention are directed to a wireless resource borrowing environment enabled by a wireless bus comprising a plurality of wireless-enabled components (WECs). In an embodiment, the WECs use the wireless bus to share resource information (including resource availability information) among each others. For example, a WEC may share with other WECs information regarding its processing and memory resources. The WEC may then use the shared resource information to identify resources at other WECs that it may borrow to perform certain tasks. In an embodiment, resource borrowing is performed according to a cost-based method which optimizes resource borrowing according to a cost function. The cost function may be designed to optimize resource borrowing according to any combination of one or more factors, including power consumption, processing speed, delay, interference, error rate, reliability, load at the lender WEC, computing capability at the lender WEC, etc.
摘要:
Disclosed herein are systems, apparatuses, and methods for establishing wireless communications among a plurality of wireless-enabled components (WECs), and applications thereof. Such a system includes a plurality of WECs, each configured to transmit and receive over a wireless bus. The wireless bus includes (i) a first channel to identify proximally located WECs and (ii) a second channel to support communications among the proximally located WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips across multiple devices.
摘要:
Disclosed herein are systems, apparatuses, and methods for wirelessly coupling functional resources. Such a system includes a plurality of co-located, wireless-enabled functional units of a first type and a plurality of co-located, wireless-enabled functional units of a second type. At least one of the wireless-enabled functional units of the first type is wirelessly coupled with one or more of the wireless-enabled functional units of the second type. The wireless-enabled functional units of the first type may be wireless-enabled processing units, and the wireless-enabled functional units of the second type may be wireless-enabled memory units. In an example, the plurality of wireless-enabled functional units of the first type are co-located on a first chip, and the plurality of wireless-enabled functional units of the second type are co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.
摘要:
Methods and apparatus are disclosed for wirelessly communicating among integrated circuits and/or functional modules within the integrated circuits. A semiconductor device fabrication operation uses a predetermined sequence of photographic and/or chemical processing steps to form one or more functional modules onto a semiconductor substrate. The functional modules are coupled to an integrated waveguide that is formed onto the semiconductor substrate and/or attached thereto to form an integrated circuit. The functional modules communicate with each other as well as to other integrated circuits using a multiple access transmission scheme via the integrated waveguide. One or more integrated circuits may be coupled to an integrated circuit carrier to form Multichip Module. The Multichip Module may be coupled to a semiconductor package to form a packaged integrated circuit.
摘要:
A low profile Planar Inverted-F Antenna (PIFA) comprises a radiating strip, an inductive tuning portion, a vertical feed portion, and a retracted ground plane. The radiating strip is approximately parallel to the ground plane and is suspended above the ground plane by the feed element at a certain distance. Further, the radiating strip, in part or entirely, overhangs the ground plane. In this way, the radiating strip may be suspended very close to the ground plane, but yet exhibits a large bandwidth.