公开(公告)号：US5407557A

公开(公告)日：1995-04-18

申请号：US201325

申请日：1994-02-24

申请人： Atsuko Iida ,  Hiroshi Odaira ,  Yoshizumi Sato ,  Yuichi Yamamoto

发明人： Atsuko Iida ,  Hiroshi Odaira ,  Yoshizumi Sato ,  Yuichi Yamamoto

IPC分类号： H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/05 ,  H05K3/02 ,  H05K3/20 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  C25D5/02

CPC分类号： H01L21/4857 ,  H01L23/49866 ,  H01L23/5387 ,  H05K1/056 ,  H05K3/027 ,  H05K3/242 ,  H05K3/388 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0112 ,  H05K2201/0326 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2203/107 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4635 ,  Y10S205/917

摘要： A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least of two conductive layers. The first conductive layer formed on the insulating layer is made of a non-metallic conductor and the first wiring pattern is formed by a laser beam. The second conductive layer is an electroplated layer formed on the first wiring pattern. The first and second conductive layers have different reflectance for a beam. The wiring board is manufactured by integrally laminating a plastic conductive supporting plate wound in a roll shape and an insulating film similarly wound in a roll shape; forming a through hole in a predetermined position of the insulating film; forming the first conductive layer on the laminated body provided with the through hole; forming the first wiring pattern by a laser beam; and forming the electroplated layer on the first wiring pattern.

摘要翻译： 叠层有多个布线基板的多层布线基板。 布线板包括具有通孔的柔性绝缘层和形成在柔性绝缘层上的布线图案。 布线图案至少由两个导电层组成。 形成在绝缘层上的第一导电层由非金属导体制成，并且第一布线图案由激光束形成。 第二导电层是形成在第一布线图案上的电镀层。 第一和第二导电层对于束具有不同的反射率。 通过将卷绕成卷状的塑料导电支撑板和类似地卷绕成卷状的绝缘膜整体地层叠而制造布线板; 在绝缘膜的预定位置形成通孔; 在设置有通孔的层叠体上形成第一导电层; 通过激光束形成第一布线图案; 以及在所述第一布线图案上形成所述电镀层。

公开(公告)号：US5310966A

公开(公告)日：1994-05-10

申请号：US724

申请日：1993-01-05

申请人： Atsuko Iida ,  Hiroshi Odaira ,  Yoshizumi Sato ,  Yuichi Yamamoto

发明人： Atsuko Iida ,  Hiroshi Odaira ,  Yoshizumi Sato ,  Yuichi Yamamoto

IPC分类号： H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K1/05 ,  H05K3/02 ,  H05K3/20 ,  H05K3/24 ,  H05K3/38 ,  H05K3/40 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46

CPC分类号： H01L21/4857 ,  H01L23/49866 ,  H01L23/5387 ,  H05K1/056 ,  H05K3/027 ,  H05K3/242 ,  H05K3/388 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K2201/0112 ,  H05K2201/0326 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2203/107 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4635 ,  Y10S205/917

摘要： A multi-layer wiring board where a plurality of wiring boards are laminated. The wiring board comprises a flexible insulating layer having a through hole and a wiring pattern formed on the flexible insulating layer. The wiring pattern is composed at least of two conductive layers. The first conductive layer formed on the insulating layer is made of a non-metallic conductor and the first wiring pattern is formed by a laser beam. The second conductive layer is an electroplated layer formed on the first wiring pattern. The first and second conductive layers have different reflectance for a beam. The wiring board is manufactured by integrally laminating a plastic conductive supporting plate wound in a roll shape and an insulating film similarly wound in a roll shape; forming a through hole in a predetermined position of the insulating film; forming the first conductive layer on the laminated body provided with the through hole; forming the first wiring pattern by a laser beam; and forming the electroplated layer on the first wiring pattern.

摘要翻译： 叠层有多个布线基板的多层布线基板。 布线板包括具有通孔的柔性绝缘层和形成在柔性绝缘层上的布线图案。 布线图案至少由两个导电层组成。 形成在绝缘层上的第一导电层由非金属导体制成，并且第一布线图案由激光束形成。 第二导电层是形成在第一布线图案上的电镀层。 第一和第二导电层对于束具有不同的反射率。 通过将卷绕成卷状的塑料导电支撑板和类似地卷绕成卷状的绝缘膜整体地层叠而制造布线板; 在所述绝缘膜的预定位置形成通孔; 在设置有通孔的层叠体上形成第一导电层; 通过激光束形成第一布线图案; 以及在所述第一布线图案上形成所述电镀层。

公开(公告)号：US5333379A

公开(公告)日：1994-08-02

申请号：US863904

申请日：1992-04-06

申请人： Hiroshi Odaira ,  Yoshizumi Sato

发明人： Hiroshi Odaira ,  Yoshizumi Sato

IPC分类号： B29C33/14 ,  B29C44/18 ,  B29C45/14 ,  B29L31/34 ,  H05K1/02 ,  H05K3/00 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46 ,  B29C67/22 ,  H05K3/30

CPC分类号： H05K3/205 ,  B29C44/18 ,  H05K3/0014 ,  H05K2201/09118 ,  H05K2203/0726 ,  Y10T29/4913 ,  Y10T29/49146

摘要： Small projections are arranged on a molding surface of at least one of an upper die half and a lower die half constituting a molding die, and a predetermined number of conductor circuits each including small projections are formed on the molding surface by electrically plating. A predetermined number of conductor circuits are formed on the molding surface of other die half in the same manner. Subsequently, the molding surfaces of both the die halves are brought in pressure contact with each other so that the electrically plated layers each including small projections on the molding surface are connected electrically. Thereafter, the hollow space between both the die halves is filled with a predetermined resin, whereby the conductor circuits are reversely secured to the resultant molded product to complete production of a three-dimensional wiring board. After electronic components are assembled on the three-dimensional wiring board, the resin is removed from the molded product by dissolving the resin. Consequently, a hollow three-dimensional wiring structure is formed. Thus, three-dimensional conductor circuits which are electrically connected to each other at predetermined positions are formed on the front and rear surfaces of molded product. Thus, the three-dimensional wiring board can be produced at a high efficiency without any necessity for complicated steps and actuation. An electronic circuit module produced by assembling electronic components on the three-dimensional wiring board assures that signals can be processed at a high speed.

摘要翻译： 在构成成型模具的上模半模和下模半部中的至少一个的成形面上配置有小突起，通过电镀在成形面上形成规定数量的具有小突起的导体电路。 以相同的方式在其他半模的成型表面上形成预定数量的导体电路。 随后，两个半模的成型表面彼此压力接触，使得在成型表面上各包括小突起的电镀层电连接。 此后，两个半模之间的中空空间填充有预定的树脂，由此导体电路与所得模制产品反向固定，从而完成三维布线板的制造。 将电子元件组装在三维布线板上之后，树脂通过溶解树脂而从成形品中除去。 因此，形成中空的三维布线结构。 因此，在模制品的前表面和后表面上形成在预定位置彼此电连接的三维导体电路。 因此，可以高效率地制造三维接线板，而不需要复杂的步骤和致动。 通过在三维布线板上组装电子部件而制造的电子电路模块确保能够高速地处理信号。

公开(公告)号：US4395109A

公开(公告)日：1983-07-26

申请号：US156866

申请日：1980-06-05

申请人： Shunichi Nakajima ,  Hiroshi Odaira

发明人： Shunichi Nakajima ,  Hiroshi Odaira

IPC分类号： G03G15/20

CPC分类号： G03G15/2053

摘要： An electronic duplicator machine heats a toner attached to a copying paper and a fixing device fixes the toner to the paper. The fixing device includes a heat generating roller which includes a supporting body having a journal portion on either end surface and rotatably supported by the journal portion; a heat insulating layer formed on the outer circumferential surface of the supporting body to prevent the transmission of heat to the supporting body; a resistance heater layer through which a current flows to heat the toner and which covers the outer circumferential surface of the heat insulating layer.

摘要翻译： 电子复印机加热附着在复印纸上的调色剂，并且定影装置将调色剂固定在纸上。 定影装置包括发热辊，该发热辊包括支撑体，该支撑体在任一端面具有轴颈部分，并由轴颈部分可旋转地支撑; 绝热层，形成在所述支撑体的外周面上，以防止向所述支撑体传递热量; 电阻加热器层，电流流过该电阻加热器层以加热调色剂并覆盖绝热层的外周表面。

公开(公告)号：US20050097727A1

公开(公告)日：2005-05-12

申请号：US10450844

申请日：2002-03-27

申请人： Tomoo Iijima ,  Yoshiro Kato ,  Hiroshi Odaira ,  Masayuki Ohsawa ,  Inetaro Kurosawa ,  Kazuo Sakuma ,  Toshihiko Asano ,  Kimitaka Endo

发明人： Tomoo Iijima ,  Yoshiro Kato ,  Hiroshi Odaira ,  Masayuki Ohsawa ,  Inetaro Kurosawa ,  Kazuo Sakuma ,  Toshihiko Asano ,  Kimitaka Endo

IPC分类号： B24B1/00 ,  B24B7/22 ,  B24B37/04 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H01R3/00 ,  B23P19/00

CPC分类号： H05K3/4614 ,  B24B1/00 ,  B24B7/228 ,  B24B37/04 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0384 ,  H05K2203/061 ,  Y10T29/5313

摘要： A plurality of multi-layer metal plates (1) each being composed of a bump forming metal layer (2), an etching stop layer (3), and a wiring film forming metal layer (4), and in which a wiring film (4a) is formed from the wiring film forming metal layer and a bump 2a is formed from the bump forming metal layer are prepared, and on a bump forming surface of a multi-layer metal plate, a wiring film of another multi-layer metal plate is overlapped. Such lamination process is repeated in succession for multi-layering. In addition, a polishing machine for multi-layer wiring board (11a) which includes metal plate holding means (13) for holding a metal plate (1a), cutter holding means (25) for holding a cutter (26) above the metal plate, height adjustment mechanism (20) for adjusting the height of the cutter holding means, and cutter parallel moving mechanism (15) for relatively moving the cutter holding means in parallel to the surface of the metal plate is used to conduct polishing.

摘要翻译： 多个多层金属板（1）各自由凸块形成金属层（2），蚀刻停止层（3）和布线膜形成金属层（4）构成，其中布线膜 由凸极形成金属层形成由布线膜形成金属层形成的凸块2a，并且在多层金属板的凸块形成表面上形成另一多层的布线膜 金属板重叠。 这样的层压方法被连续重复进行多层。 另外，包括用于保持金属板（1a）的金属板保持装置（13）的多层布线板（11a）的抛光机，用于将切割器（26）保持在其上方的切割器保持装置（25） 金属板，用于调节刀具保持装置的高度的高度调节机构（20）以及用于使刀具保持装置平行于金属板的表面相对移动的刀具平行移动机构（15）进行抛光。

公开(公告)号：US5955780A

公开(公告)日：1999-09-21

申请号：US63270

申请日：1998-04-21

申请人： Etsuji Suzuki ,  Hiroshi Odaira ,  Eiji Imamura

发明人： Etsuji Suzuki ,  Hiroshi Odaira ,  Eiji Imamura

IPC分类号： H01L21/3205 ,  H01L23/12 ,  H01L23/29 ,  H01L23/485 ,  H01L23/52 ,  H01L23/48

CPC分类号： H01L24/10 ,  H01L23/293 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044

摘要： A contact converting structure of a semiconductor chip comprises a semiconductor chip with a group of electrodes arranged on a surface of one side thereof. A liquid crystal polymer film is bonded to the surface in such a manner as to cover the electrodes group, and a group of external contacts is arranged on the other surface of the semiconductor chip. The external contacts group is connected to the electrodes group through the liquid crystal polymer film. A process for manufacturing a semiconductor chip having such a contact converting structure is also disclosed.

摘要翻译： 半导体芯片的接触转换结构包括具有布置在其一侧的表面上的一组电极的半导体芯片。 液晶聚合物膜以覆盖电极组的方式结合到表面，并且一组外部触点布置在半导体芯片的另一个表面上。 外部触点组通过液晶聚合物膜与电极组连接。 还公开了一种具有这种接触转换结构的半导体芯片的制造方法。

公开(公告)号：US20080264678A1

公开(公告)日：2008-10-30

申请号：US11662024

申请日：2005-09-06

申请人： Tomoo lijima ,  Hiroshi Odaira ,  Tomokazu Shimada ,  Akifumi Iijima

发明人： Tomoo lijima ,  Hiroshi Odaira ,  Tomokazu Shimada ,  Akifumi Iijima

IPC分类号： H05K1/00 ,  H05K3/02

CPC分类号： H05K3/462 ,  H05K1/036 ,  H05K3/06 ,  H05K3/4038 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/066 ,  H05K2203/1189 ,  H05K2203/1461 ,  Y10T29/49156

摘要： The connection resistance between a metal bump (8) and a metal layer (10) for forming a wiring film deposited later is further decreased, the connection stability is enhanced, the wiring path passing through the metal bump (8) is further shortened, the planarity is enhanced, and the metal bump (8) does not come out easily. A wiring film interconnecting member wherein a plurality of pillar-like metal bumps (8) composed of copper and having a cross-sectional area of the top surface smaller than that of the bottom surface and interconnecting the wiring films of a multilayer wiring board are buried in an interlayer insulation film (10) in such a way that at least one end projects. The upper surface of the interlayer insulation film (10) is so curved as to be high at a part in contact with the metal bump (8) and lower gradually as being farther therefrom.

摘要翻译： 金属凸块（8）和用于形成稍后沉积的布线膜的金属层（10）之间的连接电阻进一步降低，连接稳定性提高，穿过金属凸块（8）的布线路径进一步缩短， 平坦度提高，并且金属凸块（8）不容易脱出。 一种布线膜互连构件，其中埋设有由铜构成的多个柱状金属凸块（8），其顶表面的横截面积小于底面的横截面面积并且互连多层布线板的布线膜 在层间绝缘膜（10）中，至少一个端部突出。 层间绝缘膜（10）的上表面弯曲成与金属凸块（8）接触的部分高，并且随着其越远逐渐下降。

公开(公告)号：US5973395A

公开(公告)日：1999-10-26

申请号：US848585

申请日：1997-04-29

申请人： Etsuji Suzuki ,  Akira Yonezawa ,  Hidehisa Yamazaki ,  Hiroshi Odaira

发明人： Etsuji Suzuki ,  Akira Yonezawa ,  Hidehisa Yamazaki ,  Hiroshi Odaira

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/4985 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/181

摘要： An IC package is provided that has a flexible wiring sheet, including an upper portion, a lower portion and a side portion which is wound around a base member over an upper surface, side surfaces and a lower surface of the base member. An IC is loaded on an upper surface of the upper flexible wiring sheet covering the upper surface of the base member. The IC is connected to an electrode provided on an upper lead pattern portion laid along the upper surface of the flexible wiring sheet. The lead pattern is extended from the upper flexible wiring sheet to the lower flexible wiring sheet via the side surfaces of the flexible wiring sheet covering side surfaces of the base member. An electrode to be connected with an object is arranged on the lower lead pattern portion which is formed on the lower flexible wiring sheet, and overall the IC or an IC connection portion is sealed on the upper surface of the upper flexible wiring sheet.

摘要翻译： 提供了一种IC封装，其具有柔性布线片，该布线片包括上部，下部和在基底部件的上表面，侧表面和下表面上缠绕在基底构件上的侧部。 IC被装载在覆盖基材的上表面的上柔性布线板的上表面上。 IC连接到设置在沿着柔性布线板的上表面放置的上引线图案部分上的电极。 引线图案通过覆盖基材的侧表面的柔性布线板的侧表面从上柔性布线片延伸到下柔性布线片。 与物体连接的电极被布置在形成在下柔性布线板上的下引线图案部分上，并且IC或IC连接部分整体被密封在上柔性布线片的上表面上。

公开(公告)号：US20100242270A1

公开(公告)日：2010-09-30

申请号：US12658926

申请日：2010-02-16

申请人： Tomoo Iijima ,  Kimitaka Endo ,  Kazuo Ikenaga ,  Hiroshi Odaira ,  Naoto Minari ,  Takashi Kato

发明人： Tomoo Iijima ,  Kimitaka Endo ,  Kazuo Ikenaga ,  Hiroshi Odaira ,  Naoto Minari ,  Takashi Kato

IPC分类号： H01K3/08

CPC分类号： H05K1/115 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K1/113 ,  H05K1/167 ,  H05K3/06 ,  H05K3/062 ,  H05K3/108 ,  H05K3/3457 ,  H05K3/363 ,  H05K3/4038 ,  H05K3/4617 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10T29/49124 ,  Y10T29/49213 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A manufacturing method for a wiring circuit board includes the steps of: forming a board on a surface of a metal layer directly or indirectly through an etching barrier layer; forming an insulating film on the surface of the metal layer; polishing the insulating film to an extent to which a top face of the bump is exposed; and forming a solder ball on the top face of the bump.

摘要翻译： 一种布线电路板的制造方法，包括以下步骤：通过蚀刻阻挡层直接或间接地在金属层的表面上形成基板; 在金属层的表面上形成绝缘膜; 将绝缘膜抛光到凸起的顶面暴露的程度; 以及在所述凸起的顶面上形成焊球。

公开(公告)号：US6010769A

公开(公告)日：2000-01-04

申请号：US875093

申请日：1997-07-16

申请人： Kenji Sasaoka ,  Hiroshi Odaira ,  Madoka Fujiwara ,  Fumitoshi Ikegaya ,  Takahiro Mori

发明人： Kenji Sasaoka ,  Hiroshi Odaira ,  Madoka Fujiwara ,  Fumitoshi Ikegaya ,  Takahiro Mori

IPC分类号： H01L21/48 ,  H01L23/538 ,  H05K1/09 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  B32B3/00

CPC分类号： H01L24/16 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/17 ,  H05K1/116 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4647 ,  H05K3/4652 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K1/095 ,  H05K2201/0355 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K2201/09863 ,  H05K2203/1189 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

摘要： A multilayered wiring board using conductive pillars for the interconnection of wiring layers. Since through holes are bored in the via lands of the wiring layers of the multilayered wiring board, the stress applied between the conductive pillars and wiring layers can be released at the time of connecting the conductive pillars to the via lands. Since the external side face of each conductive pillar smoothly continues to the surface of the via land at the contact section between the conductive pillar and the via land, the notch effect is relieved. Therefore, the reliability of the interconnection is secured even when a stress is applied to the connections during the manufacturing of the multilayered wiring board, and the mounting of electronic elements, etc.

摘要翻译： PCT No.PCT / JP96 / 03378 Sec。 371日期1997年7月16日 102（e）日期1997年7月16日PCT 1996年11月18日PCT公布。 第WO97 / 19579号公报 日期1997年5月29日一种使用导电柱的多层布线板用于布线层的互连。 由于通孔在多层布线板的布线层的通孔焊盘中钻孔，所以在将导电柱连接到通孔焊盘时，可以释放在导电柱和布线层之间施加的应力。 由于每个导电柱的外侧面在导电柱和通孔焊盘之间的接触部处平滑地延续到通路接合面的表面，所以能够消除切口效果。 因此，即使在制造多层布线基板期间对连接件施加应力并且安装电子元件等时也确保互连的可靠性。