-
1.发明授权Dark-field defect inspecting method, dark-field defect inspecting apparatus, aberration analyzing method, and aberration analyzing apparatus 有权暗场缺陷检查方法，暗场缺陷检查装置，像差分析方法和像差分析装置公开(公告)号：US08681328B2
公开(公告)日：2014-03-25
申请号：US13142328
申请日：2010-01-20
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N21/21 , G01N21/47 , G01N21/4788 , G01N21/93 , G01N21/94 , G01N21/956 , G01N2021/8822
摘要： By including an illumination system and a detection system, an information collecting function of monitoring an environment, such as temperature and atmospheric pressure, and an apparatus state managing function having a feedback function of comparing the monitoring result and a design value, a theoretical calculation value or an ideal value derived from simulation results and calibrating an apparatus so that the monitoring result is brought close to the ideal value, a unit for keeping the apparatus state and apparatus sensitivity constant is provided. A control unit 800 is configured to include a recording unit 801, a comparing unit 802, a sensitivity predicting unit 803, and a feedback control unit 804. In the comparing unit 802, the monitoring result transmitted from the recording unit 801 and an ideal value stored in a database 805 are compared with each other. When a difference between the ideal value and the monitoring result exceeds a predetermined threshold, the feedback control unit 804 corrects the illumination system and the detection system.
摘要翻译： 通过包括照明系统和检测系统，监视诸如温度和大气压力之类的环境的信息收集功能，以及具有比较监视结果和设计值的反馈功能的设备状态管理功能，理论计算值 或者从模拟结果导出的理想值，并且对设备进行校准，使得监视结果接近理想值，提供用于保持设备状态和设备灵敏度恒定的单元。 控制单元800被配置为包括记录单元801，比较单元802，灵敏度预测单元803和反馈控制单元804.在比较单元802中，从记录单元801发送的监视结果和理想值 存储在数据库805中进行比较。 当理想值与监视结果之间的差异超过预定阈值时，反馈控制单元804校正照明系统和检测系统。
-
2.发明申请公开(公告)号：US20110286001A1
公开(公告)日：2011-11-24
申请号：US13142328
申请日：2010-01-20
IPC分类号： G01N21/55
CPC分类号： G01N21/9501 , G01N21/21 , G01N21/47 , G01N21/4788 , G01N21/93 , G01N21/94 , G01N21/956 , G01N2021/8822
摘要： By including an illumination system and a detection system, an information collecting function of monitoring an environment, such as temperature and atmospheric pressure, and an apparatus state managing function having a feedback function of comparing the monitoring result and a design value, a theoretical calculation value or an ideal value derived from simulation results and calibrating an apparatus so that the monitoring result is brought close to the ideal value, a unit for keeping the apparatus state and apparatus sensitivity constant is provided. A control unit 800 is configured to include a recording unit 801, a comparing unit 802, a sensitivity predicting unit 803, and a feedback control unit 804. In the comparing unit 802, the monitoring result transmitted from the recording unit 801 and an ideal value stored in a database 805 are compared with each other. When a difference between the ideal value and the monitoring result exceeds a predetermined threshold, the feedback control unit 804 corrects the illumination system and the detection system.
摘要翻译： 通过包括照明系统和检测系统，监视诸如温度和大气压力之类的环境的信息收集功能，以及具有比较监视结果和设计值的反馈功能的设备状态管理功能，理论计算值 或者从模拟结果导出的理想值，并且对设备进行校准，使得监视结果接近理想值，提供用于保持设备状态和设备灵敏度恒定的单元。 控制单元800被配置为包括记录单元801，比较单元802，灵敏度预测单元803和反馈控制单元804.在比较单元802中，从记录单元801发送的监视结果和理想值 存储在数据库805中进行比较。 当理想值与监视结果之间的差异超过预定阈值时，反馈控制单元804校正照明系统和检测系统。
-
3.发明授权Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统公开(公告)号：US06897956B2
公开(公告)日：2005-05-24
申请号：US10235656
申请日：2002-09-06
申请人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
发明人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
CPC分类号： G01B11/272 , H05K1/0269 , H05K3/4638
摘要： An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured, comprising: an XY stage running in a direction x and in a direction y while mounting the substrate; an illumination optical system for illuminating each of the alignment mark portions in a state where the XY stage runs in a direction x which is a direction of arranging the chips; a detecting optical system having an objective lens for collecting a reflection light in the running state obtained from the overlaid alignment marks, a focusing optical system for focusing the reflection light in the running state obtained from the objective lens, a scanning optical system for scanning reflection light image in the running state focused by the focusing optical system in a direction opposite to that of the running and a linear image sensor receiving reflection light image substantially in a static state being scanned in the opposite direction by the scanning optical system and converting them into image signal; and an alignment accuracy calculation device for measuring the alignment accuracy between the overlaid alignment marks at least for a direction perpendicular to the running direction based on the image signal converted by the linear image sensor.
摘要翻译： 一种用于测量在布置在待测量基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置，包括：沿x方向和y方向运行的XY台， 安装基板; 照明光学系统，用于在XY台在作为排列芯片的方向的方向x上行进的状态下照亮每个对准标记部分; 一种检测光学系统，具有用于收集从重叠的对准标记获得的运行状态的反射光的物镜，用于将反射光聚焦在从物镜获得的运行状态的聚焦光学系统，用于扫描反射的扫描光学系统 聚焦光学系统以与行进方向相反的方向聚焦的运行状态的光图像和接收基本处于静止状态的反射光图像的线性图像传感器被扫描光学系统沿相反方向扫描并将其转换成 图像信号; 以及对准精度计算装置，用于根据由线性图像传感器转换的图像信号，至少对垂直于行进方向的方向测量重叠的对准标记之间的对准精度。
-
4.发明授权Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统公开(公告)号：US07271908B2
公开(公告)日：2007-09-18
申请号：US11131378
申请日：2005-05-18
申请人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
发明人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
IPC分类号： G01B11/00
CPC分类号： G01B11/272 , H05K1/0269 , H05K3/4638
摘要： An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured includes an XY stage movable X and Y directions while mounting the substrate, an illumination system for illuminating each of the alignment mark portions, a detecting system having a lens for collecting a reflection light, a focusing system for focusing the reflection light, a scanning system for scanning a reflection light image and an image sensor receiving reflection light image for conversion into an image signal. An alignment accuracy calculator measures the alignment accuracy between the overlaid alignment marks.
摘要翻译： 用于测量在布置在被测定的基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置包括XY台可移动X和Y方向，同时安装基板，照明系统 用于照亮每个对准标记部分，具有用于收集反射光的透镜的检测系统，用于聚焦反射光的聚焦系统，用于扫描反射光图像的扫描系统和接收反射光图像的图像传感器转换成 图像信号。 对准精度计算器测量重叠对准标记之间的对准精度。
-
5.发明申请Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device 失效用于测量对准精度的装置和方法，以及用于制造半导体器件的方法和系统公开(公告)号：US20050206898A1
公开(公告)日：2005-09-22
申请号：US11131378
申请日：2005-05-18
申请人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
发明人： Minori Noguchi , Masahiko Nakada , Takahiko Suzuki , Taketo Ueno , Toshihiko Nakata , Shunji Maeda
CPC分类号： G01B11/272 , H05K1/0269 , H05K3/4638
摘要： An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured includes an XY stage movable X and Y directions while mounting the substrate, an illumination system for illuminating each of the alignment mark portions, a detecting system having a lens for collecting a reflection light, a focusing system for focusing the reflection light, a scanning system for scanning a reflection light image and an image sensor receiving reflection light image for conversion into an image signal. An alignment accuracy calculator measures the alignment accuracy between the overlaid alignment marks.
摘要翻译： 用于测量在布置在被测定的基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置包括XY台可移动X和Y方向，同时安装基板，照明系统 用于照亮每个对准标记部分，具有用于收集反射光的透镜的检测系统，用于聚焦反射光的聚焦系统，用于扫描反射光图像的扫描系统和接收反射光图像的图像传感器转换成 图像信号。 对准精度计算器测量重叠对准标记之间的对准精度。
-
公开(公告)号：US20120128230A1
公开(公告)日：2012-05-24
申请号：US13362151
申请日：2012-01-31
申请人： Shunji Maeda , Kenji Oka , Yukihiro Shibata , Minoru Yoshida , Chie Shishido , Yuji Takagi , Atsushi Yoshida , Kazuo Yamaguchi
发明人： Shunji Maeda , Kenji Oka , Yukihiro Shibata , Minoru Yoshida , Chie Shishido , Yuji Takagi , Atsushi Yoshida , Kazuo Yamaguchi
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G01N21/9501 , G01N21/95607 , G06T7/0004 , G06T2207/30148
摘要： An inspection method, including: illuminating a light on a wafer on which plural chips having identical patterns are formed; imaging corresponding areas of two chips formed on the wafer to obtain inspection images and reference images with an image sensor; and processing the obtained inspection image and the reference image to produce a difference image which indicates a difference between the inspection image and the reference image and detect a defect by comparing the difference image with a threshold, wherein a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging peripheral portion of the wafer is different from a threshold applied to a difference image which is produced by comparing the inspection image and the reference image obtained by imaging central portion of the wafer.
摘要翻译： 一种检查方法，包括：在其上形成有多个具有相同图案的芯片的晶片上照射光; 对形成在晶片上的两个芯片的对应区域进行成像，以获得具有图像传感器的检查图像和参考图像; 并且处理所获得的检查图像和参考图像以产生指示检查图像和参考图像之间的差异的差异图像，并且通过将差异图像与阈值进行比较来检测缺陷，其中应用于差分图像的阈值是 通过比较检查图像和通过对晶片的周边部分进行成像获得的参考图像而产生的参考图像与通过比较检查图像和通过对晶片的中心部分进行成像而获得的参考图像而产生的差分图像的阈值不同。
-
公开(公告)号：US20100208249A1
公开(公告)日：2010-08-19
申请号：US12771216
申请日：2010-04-30
申请人： Yukihiro Shibata , Shunji Maeda
发明人： Yukihiro Shibata , Shunji Maeda
IPC分类号： G01N21/62
CPC分类号： G01N21/94 , G01N21/21 , G01N21/4788 , G01N21/9501 , G01N21/95623 , G01N2021/8822 , G01N2021/9513
摘要： A defect inspection apparatus and method includes a darkfield illumination optical system which conducts darkfield illumination upon the surface of a sample with irradiation light having at least one of wavelength band, a darkfield detection optical system which includes a reflecting objective lens for converging the light scattered from the surface of the sample that has been darkfield-illuminated with the irradiation light having the at least one wavelength band, and imaging optics for imaging onto a light-receiving surface of an image sensor the scattered light that the reflecting objective lens has converged, and an image processor which, in accordance with an image signal obtained from the image sensor of the darkfield detection optical system, discriminates defects or defect candidates present on the surface of the sample.
摘要翻译： 缺陷检查装置和方法包括：暗场照明光学系统，其使用具有波长带中的至少一个的照射光对样品的表面进行暗场照明，暗视场检测光学系统包括用于会聚来自 已经用具有至少一个波长带的照射光进行暗场照射的样品的表面，以及用于在图像传感器的光接收表面上成像以用于反射物镜会聚的散射光的成像光学器件;以及 根据从暗场检测光学系统的图像传感器获得的图像信号，鉴别存在于样品表面上的缺陷或缺陷候选物的图像处理器。
-
公开(公告)号：US20090141264A1
公开(公告)日：2009-06-04
申请号：US12363856
申请日：2009-02-02
申请人： Yukihiro Shibata , Shunji Maeda , Kazuo Yamaguchi , Minoru Yoshida , Atsushi Yoshida , Kenji Oka , Kenji Watanabe
发明人： Yukihiro Shibata , Shunji Maeda , Kazuo Yamaguchi , Minoru Yoshida , Atsushi Yoshida , Kenji Oka , Kenji Watanabe
CPC分类号： G01N21/21 , G01N21/9501 , G01N21/956 , G01N21/95607 , G02B21/0016
摘要： A defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.
摘要翻译： 缺陷检查装置包括用于安装样品的样品安装装置; 照明和检测装置，用于照亮安装在安装件上的图案样品，并检测由其获得的反射光的光学图像。 还包括用于显示由该照明和检测装置检测的光学图像的显示器; 用于在显示器上设置和显示照明和检测装置的光学参数的光学参数设置装置; 以及光学参数调整装置，用于根据由所述光学参数设定装置设定的光学参数来调整对所述照明和检测装置设定的光学参数; 用于存储比较图像数据的存储装置; 以及缺陷检测装置，用于通过将由光学图像检测装置检测的光学图像与存储在存储器中的比较图像数据进行比较来检测在样本上形成的图案的缺陷。
-
公开(公告)号：US07499162B2
公开(公告)日：2009-03-03
申请号：US11475667
申请日：2006-06-26
申请人： Yukihiro Shibata , Shunji Maeda , Kazuo Yamaguchi , Minoru Yoshida , Atsushi Yoshida , Kenji Oka , Kenji Watanabe
发明人： Yukihiro Shibata , Shunji Maeda , Kazuo Yamaguchi , Minoru Yoshida , Atsushi Yoshida , Kenji Oka , Kenji Watanabe
IPC分类号： G01J4/00
CPC分类号： G01N21/21 , G01N21/9501 , G01N21/956 , G01N21/95607 , G02B21/0016
摘要： A defect inspecting apparatus includes a sample mounting device for mounting a sample; lighting and detecting apparatus for illuminating a patterned sample mounted on a mount and detecting the optical image of the reflected light obtained therefrom. Also included is a display for displaying the optical image detected by this lighting and detecting apparatus; an optical parameter setting device for setting and displaying optical parameters for the lighting and detecting apparatus on the display; and optical parameter adjusting apparatus for adjusting optical parameters set for the lighting and detecting apparatus according to the optical parameters set by the optical parameter setting apparatus; a storage device for storing comparative image data; and a defect detecting device for detecting defects from patterns formed on the sample by comparing the optical image detected by the optical image detecting apparatus with the comparative image data stored in the storage.
摘要翻译： 缺陷检查装置包括用于安装样品的样品安装装置; 照明和检测装置，用于照亮安装在安装件上的图案样品，并检测由其获得的反射光的光学图像。 还包括用于显示由该照明和检测装置检测的光学图像的显示器; 用于在显示器上设置和显示照明和检测装置的光学参数的光学参数设置装置; 以及光学参数调整装置，用于根据由所述光学参数设定装置设定的光学参数来调整对所述照明和检测装置设定的光学参数; 用于存储比较图像数据的存储装置; 以及缺陷检测装置，用于通过将由光学图像检测装置检测的光学图像与存储在存储器中的比较图像数据进行比较来检测在样本上形成的图案的缺陷。
-
10.发明授权Method and apparatus for detecting defects of a sample using a dark field signal and a bright field signal 失效使用暗场信号和亮场信号来检测样本的缺陷的方法和装置公开(公告)号：US07463350B2
公开(公告)日：2008-12-09
申请号：US10981721
申请日：2004-11-05
IPC分类号： G01N21/00
CPC分类号： G01N21/95684
摘要： Disclosed is a method and apparatus for inspecting defects of patterns of a sample at high speed and with high sensitivity while damage of the sample arising from high-power pulsed light is reduced. Light emitted from a pulsed laser light source is transmitted through a pseudo continuous-wave forming optical system having an optical system capable of reducing energy per pulse and yet maintaining the entire amount of light of the pulsed light, a beam formation optical system, and a coherence reduction optical system, and a beam deflected by a deformation illumination optical system is made to reflect on a PBS to be irradiated on a wafer. The apparatus is configured so that the diffracted light from the wafer is focused by an objective lens, transmitted through light modulation units, focused to form a plurality of images on a plurality of image sensors in a visual-field divided parallel detection unit 12, and then defects are detected by a signal processing unit.
摘要翻译： 公开了一种用于在高功率脉冲光下产生的样品损坏的情况下高速且高灵敏度地检查样品的图案的缺陷的方法和装置。 从脉冲激光光源发出的光通过伪连续波形成光学系统传输，该光学系统具有能够减少每脉冲能量并且仍保持脉冲光的光量，光束形成光学系统和 相干降低光学系统和由变形照明光学系统偏转的光束在PBS上反射以照射在晶片上。 该装置被配置为使得来自晶片的衍射光被物镜聚焦，透镜通过光调制单元被聚焦以在视野分割并行检测单元12中的多个图像传感器上形成多个图像，以及 那么由信号处理单元检测到缺陷。
-
-
-
-
-
-
-
-
-
搜索结果
274 条记录 (耗时 0.029 秒)