公开(公告)号：US20090114885A1

公开(公告)日：2009-05-07

申请号：US12092453

申请日：2006-10-31

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

IPC分类号： H01B1/12

CPC分类号： C09J9/02 ,  H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2203/0425

摘要： The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

摘要翻译： 本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料 颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。

公开(公告)号：US07785500B2

公开(公告)日：2010-08-31

申请号：US12092453

申请日：2006-10-31

申请人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

发明人： Atsushi Yamaguchi ,  Hidenori Miyakawa ,  Takayuki Higuchi ,  Koso Matsuno ,  Hideyuki Tsujimura

IPC分类号： H01B1/22 ,  C09J9/02

CPC分类号： C09J9/02 ,  H01B1/22 ,  H05K3/321 ,  H05K2201/0218 ,  H05K2201/0272 ,  H05K2203/0425

摘要： The present invention provides an electrically conductive adhesive which prevents migration and sulfuration of a metal component in electronic component mounting. The electrically conductive adhesive includes a thermosetting resin and metal filler particles dispersed in the thermosetting resin. It is possible to use, as the metal filler particles, metal filler particles having a composition including an alloy of Ag with at least one metal selected from the group consisting of Sn, Cu, In, Bi and Ni, a mixture of such metal filler particles and Ag filler particles, and metal filler particles including Ag filler particles and a coating layer formed on the surface of the Ag filler particles using a metal such as Sn.

摘要翻译： 本发明提供一种导电粘合剂，其防止电子部件安装中的金属成分的迁移和硫化。 导电粘合剂包括热固性树脂和分散在热固性树脂中的金属填料颗粒。 作为金属填料颗粒，可以使用包含Ag合金和至少一种选自Sn，Cu，In，Bi和Ni的金属的组成的金属填料颗粒，将这种金属填料 颗粒和Ag填料颗粒，以及包括Ag填料颗粒的金属填料颗粒和使用Sn等金属在Ag填料颗粒的表面上形成的涂层。

公开(公告)号：US08344268B2

公开(公告)日：2013-01-01

申请号：US12496017

申请日：2009-07-01

申请人： Hideyuki Tsujimura ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Hiroe Kowada ,  Koso Matsuno

发明人： Hideyuki Tsujimura ,  Hidenori Miyakawa ,  Atsushi Yamaguchi ,  Hiroe Kowada ,  Koso Matsuno

IPC分类号： H05K1/11

CPC分类号： H05K3/288 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/284 ,  H05K2201/09872 ,  H05K2201/0989 ,  H05K2203/0783 ,  H05K2203/1322 ,  Y10T29/49146 ,  H01L2224/0401

摘要： An electronic component packaging structure includes a circuit board, electronic components mounted on the circuit board and a moisture-proof coating layer covering the electronic components. The moisture-proof coating layer is constituted from a polymer material coating having at least two layers of a lower layer and an upper layer, and the polymer material forming the lower layer has higher swelling property and/or solubility to a repairing solvent that is selected from among hydrocarbon-based solvents than the polymer material forming the upper layer.

摘要翻译： 电子部件封装结构包括电路板，安装在电路板上的电子部件和覆盖电子部件的防潮涂层。 防潮涂层由具有至少两层下层和上层的聚合物材料涂层构成，形成下层的聚合物材料具有较高的溶胀性和/或对所选择的修补溶剂的溶解性 与烃类溶剂相比，形成上层的聚合物材料。

公开(公告)号：US08664773B2

公开(公告)日：2014-03-04

申请号：US13477524

申请日：2012-05-22

申请人： Atsushi Yamaguchi ,  Hideyuki Tsujimura ,  Hiroe Kowada ,  Ryo Kuwabara ,  Naomichi Ohashi

发明人： Atsushi Yamaguchi ,  Hideyuki Tsujimura ,  Hiroe Kowada ,  Ryo Kuwabara ,  Naomichi Ohashi

IPC分类号： H01L21/58 ,  H01L21/60 ,  H01L23/488

CPC分类号： H01L23/315 ,  H01L23/3157 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2224/16238 ,  H01L2224/29017 ,  H01L2224/29035 ,  H01L2224/29082 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/30155 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2224/9221 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/0665

摘要： A manufacturing method for a mounting structure of a semiconductor package component, including: applying a first adhesive with viscosity η1 and a thixotropy index T1 at a position on the substrate, which is on an outer side of the mounted semiconductor package component; applying, on the first adhesive, a second adhesive with viscosity η2 and a thixotropy index T2 so that the second adhesive gets in contact with an outer periphery part of the semiconductor package component; and forming, through a subsequent reflow process, a first adhesive part of the hardened first adhesive and a second adhesive part of the hardened second adhesive, wherein the first and second adhesives satisfy 30≦η2≦η1≦300 (Pa·s) and 3≦T2≦T1≦7, and sectional area S1 of the first adhesive part and sectional area S2 of the second adhesive part with respect to a direction perpendicular to a mounting surface of the substrate satisfy a relation S1≦S2.

摘要翻译： 一种半导体封装件的安装结构的制造方法，包括：在安装的半导体封装部件的外侧的基板上的位置处施加粘度eta1和触变指数T1的第一粘合剂; 在第一粘合剂上施加具有粘度eta2和触变指数T2的第二粘合剂，使得第二粘合剂与半导体封装部件的外周部分接触; 并且通过随后的回流工艺形成所述硬化的第一粘合剂的第一粘合部分和所述硬化的第二粘合剂的第二粘合部分，其中所述第一和第二粘合剂满足30（Pa·s）和3 @ T2 @ T1 @ 7，第一粘合部分的截面面积S1和第二粘合部分相对于垂直于基板的安装表面的方向的截面面积S2满足关系S1 @ S2。