Apparatus for providing RF return current path control in a semiconductor wafer processing system
    1.
    发明授权
    Apparatus for providing RF return current path control in a semiconductor wafer processing system 有权
    用于在半导体晶片处理系统中提供RF返回电流路径控制的装置

    公开(公告)号:US06221221B1

    公开(公告)日:2001-04-24

    申请号:US09192872

    申请日:1998-11-16

    IPC分类号: C23C1434

    CPC分类号: H01J37/32577

    摘要: Apparatus providing a low impedance RF return current path between a shield member and a pedestal in a semiconductor wafer processing chamber. The return path reduces RF voltage drop between the shield member and the pedestal during processing. The return path comprises a conductive strap connected to the pedestal and a conductive bar attached to the strap. A toroidal spring makes multiple parallel electrical connections between the conductive bar and the shield member. A support assembly, attached to a collar on the chamber wall, supports the conductive bar.

    摘要翻译: 一种在半导体晶片处理室中提供屏蔽构件和基座之间的低阻抗RF返回电流路径的装置。 返回路径在处理期间降低了屏蔽构件和基座之间的RF电压降。 返回路径包括连接到基座的导电带和附接到带的导电条。 环形弹簧在导电棒和屏蔽构件之间形成多个平行的电连接。 附接到室壁上的套环的支撑组件支撑导电棒。