摘要:
The present invention relates to easily processable polyamide moulding materials with very good mechanical and electrical properties based on calcium magnesium carbonate hydrate as the flame-retardant additive.
摘要:
The invention relates to thermally stable and UV-stable polyamide molding compounds containing colloidal copper formed in situ and to a process for their production.
摘要:
The invention relates to readily processible polyamide molding compounds which have very good mechanical and electrical properties as well as high surface quality and are based on polyamide, magnesium hydroxide and polyhydroxy compounds of the Novolak type.
摘要:
The present invention relates to colored polymer moulding materials which give rise to colored markings on a dark background with a very high contrast ratio on the absorption of laser energy.
摘要:
This invention relates to readily processable polyamide molding compounds combining very good mechanical and electrical properties with high surface quality based on copolyamides and magnesium hydroxide.
摘要:
The invention relates to a process for the production of caprolactam by thermal depolymerization of polyamide in the presence of small quantities of potassium carbonate at 250.degree. to 320.degree. C. and to a process for purifying the resulting caprolactam.
摘要:
A coolant containing 35-65 wt. % polyethylene glycol and 65-35 wt. % ethylene glycol, which is especially useful for cooling motor vehicle engines.
摘要:
The invention relates to polyamide molding compounds with increased viscosity, high thermal stability and favorable mechanical properties, to a process for their production and to their use.
摘要:
Thermoplastic moulding compounds containing A) 30 to 99 parts by wt. of polyalkyleneterephthalate B) 0 to 50 parts by wt. of polycarbonate C) 0 to 30 parts by wt. of a graft polymer D) 0.1 to 20 parts by wt. of an oligomeric phosphorus compound of the formula (Ia) or 0.1 to 20 parts by weight of a mixture of an oligomeric phosphorus compound of the formula (Ia) and a phosphorus compound of the formula (Ib) where the amount of phosphorus compound of the formula (Ib) in the mixture of phosphorus compounds is 1 to 50% by weight (relative to 100% by weight of phosphorus compound of the formula (Ia) and (Ib), E1) 1 to 60 parts by wt. of mineral filler and E2) 0 to 30 parts by wt. of fillers and reinforcing materials which differ from E1).