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公开(公告)号：US20150170787A1
公开(公告)日：2015-06-18
申请号：US14411937
申请日：2013-08-30
Applicant: BOREALIS AG
Inventor： Takashi Uematsu , Christer Svanberg , Niklas Thorn , Karl-Michael Jager , Asa Linder , Lars Westling
IPC: H01B1/24
CPC classification number: H01B1/24 , C08K5/005 , C08L23/06 , C08L23/0869 , C08L2203/202 , Y10T428/294
Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.
Abstract translation: 本发明涉及一种新的半导体组合物，其包含50至98重量百分比（wt％）的聚合物共混物，2至50重量％的导电填料和0.05至2重量％的抗氧化剂; 其中所述聚合物共混物包含10至99重量％的多峰高密度聚烯烃，该高密度聚烯烃的密度为930至970kg / m 3，熔体流动速率（MFR 2 @ 190℃）根据ISO 1133 （190℃，2.16kg）小于1.6g / 10min，和1〜90wt％的热塑性弹性体，半导体组合物的制造方法以及包含半导体组合物的半导体护套，以及功率 电缆，包括半导体护套或包含半导体组合物，或在例如电力电缆中使用半导体护套或半导体组合物。
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公开(公告)号：US10290390B2
公开(公告)日：2019-05-14
申请号：US15120721
申请日：2015-02-20
Applicant: BOREALIS AG
Inventor： Takashi Uematsu , Ola Fagrell , Asa Hermansson , Asa Linder
Abstract: This invention relates to silane moisture curable polymer composition and more particularly, to such a polymer composition that is highly diluted by a non-silane containing component, while retaining good high temperatures properties. The invention is a polymer composition comprising a base resin comprising less than 59 wt % of a silane crosslinkable polyethylene (A), an thermoplastic polyolefin free from silane groups (B) wherein the polymer composition comprise a filler with a BET Nitrogen Surface Area larger than 3 m2/g (C). The invention also relates to a cable layer of such polymer composition suitably a semiconducting layer of a power cable.
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公开(公告)号：US09728295B2
公开(公告)日：2017-08-08
申请号：US14411937
申请日：2013-08-30
Applicant: BOREALIS AG
Inventor： Takashi Uematsu , Christer Svanberg , Niklas Thorn , Karl-Michael Jager , Asa Linder , Lars Westling
CPC classification number: H01B1/24 , C08K5/005 , C08L23/06 , C08L23/0869 , C08L2203/202 , Y10T428/294
Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.
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