公开(公告)号：US09728295B2

公开(公告)日：2017-08-08

申请号：US14411937

申请日：2013-08-30

Applicant: BOREALIS AG

Inventor： Takashi Uematsu ,  Christer Svanberg ,  Niklas Thorn ,  Karl-Michael Jager ,  Asa Linder ,  Lars Westling

IPC: H01B1/24 ,  C08L23/06 ,  C08L23/08 ,  C08K5/00

CPC classification number: H01B1/24 ,  C08K5/005 ,  C08L23/06 ,  C08L23/0869 ,  C08L2203/202 ,  Y10T428/294

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

公开(公告)号：US11920018B2

公开(公告)日：2024-03-05

申请号：US16178243

申请日：2018-11-01

Applicant: BOREALIS AG

Inventor： Takashi Uematsu ,  Christer Svanberg ,  Karl-Michael Jäger ,  Fredrik Skogman ,  Koenraad Noyens ,  Peter Walter ,  Malin Johansson

IPC: C08K3/04 ,  B29B9/10 ,  B29B9/12 ,  B29K23/00 ,  B29K105/16 ,  H01B7/02 ,  B29K507/04

CPC classification number: C08K3/04 ,  B29B9/10 ,  B29B9/12 ,  H01B7/0216 ,  B29K2023/0633 ,  B29K2105/16 ,  B29K2507/04 ,  B29K2995/0005 ,  C08L2203/202 ,  C08K3/04 ,  C08L23/0846

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

公开(公告)号：US20150170787A1

公开(公告)日：2015-06-18

申请号：US14411937

申请日：2013-08-30

Applicant: BOREALIS AG

Inventor： Takashi Uematsu ,  Christer Svanberg ,  Niklas Thorn ,  Karl-Michael Jager ,  Asa Linder ,  Lars Westling

IPC: H01B1/24

CPC classification number: H01B1/24 ,  C08K5/005 ,  C08L23/06 ,  C08L23/0869 ,  C08L2203/202 ,  Y10T428/294

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

Abstract translation: 本发明涉及一种新的半导体组合物，其包含50至98重量百分比（wt％）的聚合物共混物，2至50重量％的导电填料和0.05至2重量％的抗氧化剂; 其中所述聚合物共混物包含10至99重量％的多峰高密度聚烯烃，该高密度聚烯烃的密度为930至970kg / m 3，熔体流动速率（MFR 2 @ 190℃）根据ISO 1133 （190℃，2.16kg）小于1.6g / 10min，和1〜90wt％的热塑性弹性体，半导体组合物的制造方法以及包含半导体组合物的半导体护套，以及功率 电缆，包括半导体护套或包含半导体组合物，或在例如电力电缆中使用半导体护套或半导体组合物。