公开(公告)号：US09728295B2

公开(公告)日：2017-08-08

申请号：US14411937

申请日：2013-08-30

Applicant: BOREALIS AG

Inventor： Takashi Uematsu ,  Christer Svanberg ,  Niklas Thorn ,  Karl-Michael Jager ,  Asa Linder ,  Lars Westling

IPC: H01B1/24 ,  C08L23/06 ,  C08L23/08 ,  C08K5/00

CPC classification number: H01B1/24 ,  C08K5/005 ,  C08L23/06 ,  C08L23/0869 ,  C08L2203/202 ,  Y10T428/294

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

公开(公告)号：US20220306845A1

公开(公告)日：2022-09-29

申请号：US17641959

申请日：2020-09-08

Applicant: Borealis AG

Inventor： Daniel Nilsson ,  Niklas Thorn ,  Annika Smedberg ,  Fredrik Skogman

IPC: C08L23/08 ,  C08L23/06

Abstract: The invention provides a semiconductive polymer composition comprising (a) a base polymer of ethylene vinyl acetate copolymer, (b) at least 25 wt % carbon black; and (c) 1 to 15 wt % of a polyethylene wax.

公开(公告)号：US12234349B2

公开(公告)日：2025-02-25

申请号：US17640559

申请日：2020-09-14

Applicant: BOREALIS AG

Inventor： Daniel Nilsson ,  Niklas Thorn ,  Annika Smedberg ,  Fredrik Skogman

IPC: C08L23/08 ,  C08K3/04 ,  C08L23/0853 ,  C08L91/06

Abstract: The invention provides a semiconductive polymer composition comprising (a) a base polymer of ethylene vinyl acetate copolymer, (b) at least 25 wt % carbon black; and (c) at least 1 wt % of an ethylene vinyl acetate wax.

公开(公告)号：US20150170787A1

公开(公告)日：2015-06-18

申请号：US14411937

申请日：2013-08-30

Applicant: BOREALIS AG

Inventor： Takashi Uematsu ,  Christer Svanberg ,  Niklas Thorn ,  Karl-Michael Jager ,  Asa Linder ,  Lars Westling

IPC: H01B1/24

CPC classification number: H01B1/24 ,  C08K5/005 ,  C08L23/06 ,  C08L23/0869 ,  C08L2203/202 ,  Y10T428/294

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

Abstract translation: 本发明涉及一种新的半导体组合物，其包含50至98重量百分比（wt％）的聚合物共混物，2至50重量％的导电填料和0.05至2重量％的抗氧化剂; 其中所述聚合物共混物包含10至99重量％的多峰高密度聚烯烃，该高密度聚烯烃的密度为930至970kg / m 3，熔体流动速率（MFR 2 @ 190℃）根据ISO 1133 （190℃，2.16kg）小于1.6g / 10min，和1〜90wt％的热塑性弹性体，半导体组合物的制造方法以及包含半导体组合物的半导体护套，以及功率 电缆，包括半导体护套或包含半导体组合物，或在例如电力电缆中使用半导体护套或半导体组合物。