公开(公告)号：US20130281559A1

公开(公告)日：2013-10-24

申请号：US13924877

申请日：2013-06-24

申请人： Baek Soung Park ,  Ki Tae SONG ,  Dong Seon UH ,  In Hwan KIM

发明人： Baek Soung Park ,  Ki Tae SONG ,  Dong Seon UH ,  In Hwan KIM

IPC分类号： C09J163/00

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J7/00 ,  C09J7/10 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/73215 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/92165 ,  H01L2224/94 ,  H01L2225/06506 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/27 ,  H01L2924/05442 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C.

摘要翻译： 用于半导体的粘合剂组合物在65℃和350℃之间具有两个放热峰，并且在150℃下固化10分钟然后在150℃下测量的空隙面积比小于10％ 30分钟，然后在175℃下成型60秒。 第一个放热峰出现在65°C和185°C之间，第二个放热峰出现在155°C和350°C之间。

公开(公告)号：US09109147B2

公开(公告)日：2015-08-18

申请号：US13924877

申请日：2013-06-24

申请人： Baek Soung Park ,  Ki Tae Song ,  Dong Seon Uh ,  In Hwan Kim

发明人： Baek Soung Park ,  Ki Tae Song ,  Dong Seon Uh ,  In Hwan Kim

IPC分类号： C09J163/00 ,  H01L23/00 ,  C09J7/00 ,  C08L63/00 ,  H01L25/065 ,  H01L25/00

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J7/00 ,  C09J7/10 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48145 ,  H01L2224/73215 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/92165 ,  H01L2224/94 ,  H01L2225/06506 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/27 ,  H01L2924/05442 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive composition for a semiconductor has two exothermic peaks between 65° C. and 350° C. and has an area ratio of voids of less than 10%, measured after curing at 150° C. for 10 minutes and then at 150° C. for 30 minutes, and then molding at 175° C. for 60 seconds. A first exothermic peak appears between 65° C. and 185° C. and a second exothermic peak appears between 155° C. and 350° C.

摘要翻译： 用于半导体的粘合剂组合物在65℃和350℃之间具有两个放热峰，并且在150℃下固化10分钟然后在150℃下测量的空隙面积比小于10％ 30分钟，然后在175℃下成型60秒。 第一个放热峰出现在65°C和185°C之间，第二个放热峰出现在155°C和350°C之间。

公开(公告)号：US08946343B2

公开(公告)日：2015-02-03

申请号：US13571574

申请日：2012-08-10

申请人： Baek Soung Park ,  Ki Tae Song ,  In Hwan Kim

发明人： Baek Soung Park ,  Ki Tae Song ,  In Hwan Kim

IPC分类号： C09J163/00

CPC分类号： C09J9/00 ,  C08G59/50 ,  C08G59/621 ,  C08G59/688 ,  C08L33/00 ,  C09J163/00 ,  H01L23/293 ,  H01L24/29 ,  H01L24/32 ,  H01L25/0657 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83191 ,  H01L2224/92247 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0503

摘要： An adhesive composition for semiconductors, an adhesive film prepared using the adhesive composition, and a semiconductor device including the adhesive film, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein a first exothermic peak appears at a lower temperature than a second exothermic peak, and the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1: Curing rate=[(Heating value upon 0 cycle−Heating value after 1 cycle)/Heating value upon 0 cycle]×100.

摘要翻译： 一种用于半导体的粘合剂组合物，使用该粘合剂组合物制备的粘合剂膜和包含该粘合剂膜的半导体器件，该粘合剂组合物在65℃至350℃的温度范围内显示两个放热峰，其中第一放热峰 出现在比第二放热峰低的温度下，并且粘合剂组合物在第一放热峰区域中具有约70％至100％的固化速率，如由等式1计算的：固化速率= [（[0循环时的加热值] 1循环后的加热值）/ 0循环的加热值×100。

公开(公告)号：US09957425B2

公开(公告)日：2018-05-01

申请号：US14204128

申请日：2014-03-11

申请人： Jun Woo Lee ,  Sung Min Kim ,  In Hwan Kim ,  Baek Soung Park ,  Su Mi Lim ,  Jae Won Choi

发明人： Jun Woo Lee ,  Sung Min Kim ,  In Hwan Kim ,  Baek Soung Park ,  Su Mi Lim ,  Jae Won Choi

IPC分类号： C09J163/00 ,  H01L23/00 ,  C09J7/00 ,  C08L63/00 ,  C08K5/00 ,  C08K5/3445

CPC分类号： C09J163/00 ,  C08K5/0025 ,  C08K5/3445 ,  C08L63/00 ,  C09J7/00 ,  C09J7/10 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2224/48 ,  H01L2924/05442 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.

公开(公告)号：US09287217B2

公开(公告)日：2016-03-15

申请号：US14315495

申请日：2014-06-26

申请人： Baek Soung Park ,  Jae Won Choi ,  Sung Min Kim ,  In Hwan Kim ,  Jun Woo Lee ,  Su Ml Im

发明人： Baek Soung Park ,  Jae Won Choi ,  Sung Min Kim ,  In Hwan Kim ,  Jun Woo Lee ,  Su Ml Im

IPC分类号： H01L23/544 ,  H01L21/70 ,  C09J7/02 ,  H01L21/683 ,  H01L23/00

CPC分类号： H01L23/544 ,  C09J7/20 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2203/326 ,  H01L21/6836 ,  H01L21/70 ,  H01L24/27 ,  H01L2221/68327 ,  H01L2224/83191

摘要： A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein.

摘要翻译： 一种切割芯片接合薄膜和一种在切割芯片接合薄膜中形成凹槽的方法，该薄膜包括一个基膜; 叠层在基膜上的压敏粘合剂层; 以及层叠在所述粘合剂层上的接合层，其中，所述压敏粘合剂层包括与所述接合层重叠的第一区域和与所述接合层不重叠的第二区域，所述第二区域包括与所述接合层相邻的第三区域 所述第一区域和与所述第三区域相邻并且在其中形成有凹槽的第四区域。

公开(公告)号：US09240364B2

公开(公告)日：2016-01-19

申请号：US14202006

申请日：2014-03-10

申请人： Baek Soung Park ,  Jae Won Choi ,  In Hwan Kim ,  Gyu Seok Song ,  Su Mi Lim

发明人： Baek Soung Park ,  Jae Won Choi ,  In Hwan Kim ,  Gyu Seok Song ,  Su Mi Lim

IPC分类号： H01L23/48 ,  H01L23/373 ,  H01L23/36 ,  H01L21/48 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L23/3737 ,  H01L21/4882 ,  H01L23/3121 ,  H01L23/36 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01049 ,  H01L2924/01004 ,  H01L2924/00012

摘要： A heat dissipation adhesive film, a semiconductor device including the same, and a method of fabricating the semiconductor device, the heat dissipation adhesive film being placeable between a protective layer encasing a semiconductor element therein and a heat dissipation metal layer on the protective layer to bond the protective layer to the heat dissipation metal layer, wherein an adhesive strength between the heat dissipation adhesive film and the protective layer and an adhesive strength between the heat dissipation adhesive film and the heat dissipation metal layer are each about 3 kgf/25 mm2 or greater.

摘要翻译： 散热粘合膜，包含该半导体装置的半导体装置以及制造该半导体装置的方法，散热粘合剂膜可放置在其中包围半导体元件的保护层与保护层上的散热金属层之间 散热金属层的保护层，其中散热粘合剂膜和保护层之间的粘合强度以及散热粘合剂膜和散热金属层之间的粘合强度分别为约3kgf / 25mm 2或更大 。

公开(公告)号：US20120171481A1

公开(公告)日：2012-07-05

申请号：US13279564

申请日：2011-10-24

申请人： Kyoung Jin Ha ,  Baek Soung Park ,  Ji Ho Kim ,  Min Kyu Hwang ,  Kil Sung Lee

发明人： Kyoung Jin Ha ,  Baek Soung Park ,  Ji Ho Kim ,  Min Kyu Hwang ,  Kil Sung Lee

IPC分类号： B32B7/12 ,  B32B27/36 ,  C09J143/02 ,  C09J137/00 ,  C09J143/04 ,  C09J11/06

CPC分类号： C09J7/02 ,  C08F8/30 ,  C09J7/20 ,  C09J133/08 ,  C09J133/10 ,  C09J133/14 ,  C09J143/02 ,  C09J143/04 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/6836 ,  H01L2221/68336 ,  H01L2224/8085 ,  H01L2224/80855 ,  H01L2224/8385 ,  H01L2224/83855 ,  Y10T428/2848 ,  Y10T428/31786 ,  C08F2220/1858 ,  C08F220/20 ,  C08F220/32 ,  C08F2220/325 ,  C08F230/02 ,  C08F220/06

摘要： An optically clear adhesive, a dicing die bonding film, and a semiconductor device, the optically clear adhesive including a curing agent; and an acrylic copolymer, the acrylic copolymer including an alkyl group, a hydroxyl group, and at least one of a phosphate group and a silane group.

摘要翻译： 光学透明粘合剂，切割芯片接合膜和半导体器件，光学透明粘合剂包括固化剂; 和丙烯酸共聚物，所述丙烯酸共聚物包括烷基，羟基和磷酸酯基和硅烷基中的至少一个。

公开(公告)号：US20090075008A1

公开(公告)日：2009-03-19

申请号：US12230427

申请日：2008-08-28

申请人： Yong Ha Hwang ,  Chang Bum Chung ,  Gyu Seok Song ,  Baek Soung Park ,  Seung Jip Choi ,  Kyoung Jin Ha

发明人： Yong Ha Hwang ,  Chang Bum Chung ,  Gyu Seok Song ,  Baek Soung Park ,  Seung Jip Choi ,  Kyoung Jin Ha

IPC分类号： B32B33/00 ,  C08L33/00

CPC分类号： C09J133/14 ,  Y10T428/1471

摘要： A photocurable composition for a pressure-sensitive adhesive layer includes a pressure-sensitive adhesive binder, a reactive acrylate having a silicone backbone, a thermal curing agent, and a photoinitiator. The pressure-sensitive adhesive binder includes a copolymer of acrylic monomers, and a low molecular weight acrylate bonded to the copolymer, the low molecular weight acrylate having at least one pendent carbon-carbon double bond.

摘要翻译： 用于粘合剂层的可光固化组合物包括压敏粘合剂粘合剂，具有硅氧烷骨架的反应性丙烯酸酯，热固化剂和光引发剂。 压敏粘合剂粘合剂包括丙烯酸单体和与共聚物结合的低分子量丙烯酸酯的共聚物，低分子量丙烯酸酯具有至少一个侧链碳 - 碳双键。

公开(公告)号：US09133367B2

公开(公告)日：2015-09-15

申请号：US13279564

申请日：2011-10-24

申请人： Kyoung Jin Ha ,  Baek Soung Park ,  Ji Ho Kim ,  Min Kyu Hwang ,  Kil Sung Lee

发明人： Kyoung Jin Ha ,  Baek Soung Park ,  Ji Ho Kim ,  Min Kyu Hwang ,  Kil Sung Lee

IPC分类号： C09J7/02 ,  C09J143/02 ,  C09J133/10 ,  C09J133/08 ,  C09J143/04 ,  H01L21/683 ,  C08F8/30 ,  C09J133/14

CPC分类号： C09J7/02 ,  C08F8/30 ,  C09J7/20 ,  C09J133/08 ,  C09J133/10 ,  C09J133/14 ,  C09J143/02 ,  C09J143/04 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2433/00 ,  H01L21/6836 ,  H01L2221/68336 ,  H01L2224/8085 ,  H01L2224/80855 ,  H01L2224/8385 ,  H01L2224/83855 ,  Y10T428/2848 ,  Y10T428/31786 ,  C08F2220/1858 ,  C08F220/20 ,  C08F220/32 ,  C08F2220/325 ,  C08F230/02 ,  C08F220/06

摘要： An optically clear adhesive, a dicing die bonding film, and a semiconductor device, the optically clear adhesive including a curing agent; and an acrylic copolymer, the acrylic copolymer including an alkyl group, a hydroxyl group, and at least one of a phosphate group and a silane group.

摘要翻译： 光学透明粘合剂，切割芯片接合膜和半导体器件，光学透明粘合剂包括固化剂; 和丙烯酸共聚物，所述丙烯酸共聚物包括烷基，羟基和磷酸酯基和硅烷基中的至少一个。

公开(公告)号：US20110159223A1

公开(公告)日：2011-06-30

申请号：US12977664

申请日：2010-12-23

申请人： Baek Soung Park ,  Min Kyu Hwang ,  Ji Ho Kim

发明人： Baek Soung Park ,  Min Kyu Hwang ,  Ji Ho Kim

IPC分类号： B32B7/12 ,  B44C1/17 ,  B32B37/06

CPC分类号： H01L24/29 ,  H01L21/6836 ,  H01L24/27 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T156/1092 ,  Y10T428/14 ,  Y10T428/1462 ,  Y10T428/2809 ,  H01L2924/00

摘要： A die-attach film and a method of manufacturing the same, the method including providing a dicing film layer with the attach layer thereon, the dicing film layer being prepared from a photocurable adhesive composition and including an attach layer region overlapping the attach layer such that the attach layer blocks inflow of oxygen into the attach layer region, and a ring frame region, the ring frame region having an upper surface that is adjacent to the attach layer and is exposed to air or an oxygen atmosphere such that oxygen flows into the ring frame region; and irradiating UV light to a back side of the dicing film layer to induce photocuring of the attach layer region, the oxygen in the ring frame region acting as a radical scavenger and suppressing photocuring of the ring frame region.

摘要翻译： 芯片附着膜及其制造方法，该方法包括在其上提供具有附着层的切割膜层，所述切割膜层由光固化粘合剂组合物制备并且包括与附着层重叠的附着层区域，使得 附着层阻止氧进入附着层区域的流入，以及环形框架区域，环形框架区域具有与附着层相邻的上表面并暴露于空气或氧气氛，使得氧气流入环 框架区域 并将UV光照射到切割膜层的背面，引起附着层区域的光固化，作为自由基清除剂的环状区域中的氧，抑制环形框架区域的光固化。