BACK-SURFACE FIELD STRUCTURES FOR MULTI-JUNCTION III-V PHOTOVOLTAIC DEVICES
    3.
    发明申请
    BACK-SURFACE FIELD STRUCTURES FOR MULTI-JUNCTION III-V PHOTOVOLTAIC DEVICES 审中-公开
    多功能III-V光伏器件的后表面场结构

    公开(公告)号:US20130092218A1

    公开(公告)日:2013-04-18

    申请号:US13274938

    申请日:2011-10-17

    IPC分类号: H01L31/0264 H01L31/18

    摘要: A multi-junction III-V photovoltaic device is provided that includes at least one top cell comprised of at least one III-V compound semiconductor material; and a bottom cell in contact with a surface of the at least one top cell. The bottom cell includes a germanium-containing layer in contact with the at least one top cell, at least one intrinsic hydrogenated silicon-containing layer in contact with a surface of the germanium-containing layer, and at least one doped hydrogenated silicon-containing layer in contact with a surface of the at least one intrinsic hydrogenated silicon-containing layer. The intrinsic and doped silicon-containing layers can be amorphous, nano/micro-crystalline, poly-crystalline or single-crystalline.

    摘要翻译: 提供了多结III-V光伏器件,其包括至少一个由至少一个III-V化合物半导体材料构成的顶部电池; 以及与所述至少一个顶部单元的表面接触的底部单元。 底部电池包括与至少一个顶部电池接触的含锗层,与含锗层的表面接触的至少一个本征氢化含硅层和至少一个掺杂氢化含硅层 与所述至少一个本征氢化含硅层的表面接触。 本征和掺杂的含硅层可以是无定形,纳米/微晶,多晶或单晶。

    CONTACT FOR SILICON HETEROJUNCTION SOLAR CELLS
    10.
    发明申请
    CONTACT FOR SILICON HETEROJUNCTION SOLAR CELLS 审中-公开
    联系太阳能电池太阳能电池

    公开(公告)号:US20120325304A1

    公开(公告)日:2012-12-27

    申请号:US13604198

    申请日:2012-09-05

    IPC分类号: H01L31/04

    摘要: A photovoltaic device and method include a substrate coupled to an emitter side structure on a first side of the substrate and a back side structure on a side opposite the first side of the substrate. The emitter side structure or the back side structure include layers alternating between wide band gap layers and narrow band gap layers to provide a multilayer contact with an effectively increased band offset with the substrate and/or an effectively higher doping level over a single material contact. An emitter contact is coupled to the emitter side structure on a light collecting end portion of the device. A back contact is coupled to the back side structure opposite the light collecting end portion.

    摘要翻译: 光电器件和方法包括耦合到衬底的第一侧上的发射极侧结构的衬底和与衬底的第一侧相对的一侧的背侧结构。 发射极侧结构或背面结构包括在宽带隙层和窄带隙层之间交替的层,以提供与衬底有效增加的带偏移和/或在单个材料接触上有效地更高的掺杂水平的多层接触。 发射极触点耦合到器件的光收集端部上的发射极侧结构。 背面接触件与与光收集端部相对的背面结构耦合。