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公开(公告)号:US20150017802A1
公开(公告)日:2015-01-15
申请号:US14329975
申请日:2014-07-13
发明人: Joanne Yim , Jeff Miller , Michael Jura , Marcie R. Black , Joanne Forziati , Brian Murphy , Adam Standley
IPC分类号: H01L21/324 , H01L21/48
CPC分类号: C23F1/30 , C30B29/06 , C30B29/60 , H01L21/02603 , H01L21/30604 , H01L21/308 , H01L21/3081 , H01L21/3086 , H01L21/3088 , H01L21/4885 , H01L29/0669 , H01L29/0676 , H01L29/413 , H01L35/10 , H01L2924/0002 , H01M4/0426 , H01M4/134 , H01M4/386 , H01M10/0525 , H01M2004/027
摘要: In an aspect of this disclosure, a method is provided comprising the steps of: (a) providing a silicon-containing substrate, (b) depositing a first metal on the substrate, (c) etching the substrate produced by step (b) using a first etch, and (d) etching the substrate produced by step (c) using a second etch, wherein the second etch is more aggressive towards the deposited metal than the first etch, wherein the result of step (d) comprises silicon nanowires. The method may further comprise, for example, steps (b1) subjecting the first metal to a treatment which causes it to agglomerate and (b2) depositing a second metal.
摘要翻译: 在本公开的一方面,提供了一种方法,包括以下步骤:(a)提供含硅衬底,(b)在衬底上沉积第一金属,(c)使用步骤(b)制备的衬底 第一蚀刻,和(d)使用第二蚀刻蚀刻由步骤(c)制备的衬底,其中所述第二蚀刻比所述第一蚀刻对所沉积的金属更具侵蚀性,其中步骤(d)的结果包括硅纳米线。 该方法还可以包括例如步骤(b1)使第一金属经受使其凝聚的处理和(b2)沉积第二金属。
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公开(公告)号:US08852981B2
公开(公告)日:2014-10-07
申请号:US13622864
申请日:2012-09-19
发明人: Marcie R. Black , Joanne Forziati , Michael Jura , Jeff Miller , Brian Murphy , Adam Standley
IPC分类号: H01L21/00 , H01L21/283 , H01L21/285 , H01L29/06 , H01L29/41 , H01L31/0224 , H01L31/0352
CPC分类号: H01L31/02366 , H01L21/283 , H01L21/28506 , H01L29/0676 , H01L29/413 , H01L31/02167 , H01L31/02168 , H01L31/0224 , H01L31/022425 , H01L31/02363 , H01L31/035218 , H01L31/035227 , H01L31/068 , H01L31/18 , Y02E10/50 , Y02E10/547
摘要: A process is provided for contacting a nanostructured surface. In that process, a substrate is provided having a nanostructured material on a surface, the substrate being conductive and the nanostructured material being coated with an insulating material. A portion of the nanostructured material is at least partially removed. A conductor is deposited on the substrate in such a way that it is in electrical contact with the substrate through the area where the nanostructured material has been at least partially removed.
摘要翻译: 提供了一种使纳米结构化表面接触的方法。 在该过程中,提供在表面上具有纳米结构材料的基底,该基底是导电的,并且纳米结构材料被涂覆有绝缘材料。 至少部分地去除纳米结构材料的一部分。 导体以这样的方式沉积在基板上,使得其通过至少部分去除纳米结构材料的区域与基板电接触。
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公开(公告)号:US09136410B2
公开(公告)日:2015-09-15
申请号:US14467029
申请日:2014-08-24
发明人: Faris Modawar , Marcie R. Black , Brian Murphy , Jeff Miller , Mike Jura
IPC分类号: H01L31/00 , H01L31/0352 , H01L31/028 , H01L31/0288 , H01L31/18
CPC分类号: H01L31/035227 , H01L31/02167 , H01L31/028 , H01L31/0284 , H01L31/0288 , H01L31/068 , H01L31/1804 , H01L31/1868 , Y10S977/762
摘要: Another aspect of the present disclosure relates to a device including a substrate, having a top surface and a bottom surface; an array of nanowires having a base and a top surface, the base contacting the top surface of the substrate; a contacting structure including the same material as the substrate having a non-nanostructured surface of a dimension suitable for forming an electrical contact, located on the same side of the substrate as the array of silicon nanowires; wherein the contacting structure is doped with a greater impurity concentration than the nanowire array, thereby forming a selective emitter.
摘要翻译: 本公开的另一方面涉及包括具有顶表面和底表面的基底的装置; 具有基底和顶表面的纳米线阵列,所述基底接触所述基底的顶表面; 接触结构包括与衬底相同的材料,其具有适于形成电接触的尺寸的非纳米结构化表面,位于与硅纳米线阵列相同的衬底侧; 其中所述接触结构被掺杂有比所述纳米线阵列更大的杂质浓度,由此形成选择性发射极。
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公开(公告)号:US20150136212A1
公开(公告)日:2015-05-21
申请号:US14468219
申请日:2014-08-25
发明人: Marcie R. Black , Joanne Forziati , Michael Jura , Jeff Miller , Brian Murphy , Adam Standley
IPC分类号: H01L31/0236 , H01L31/0216 , H01L31/0352 , H01L31/18
CPC分类号: H01L31/02366 , H01L21/283 , H01L21/28506 , H01L29/0676 , H01L29/413 , H01L31/02167 , H01L31/02168 , H01L31/0224 , H01L31/022425 , H01L31/02363 , H01L31/035218 , H01L31/035227 , H01L31/068 , H01L31/18 , Y02E10/50 , Y02E10/547
摘要: A process is provided for contacting a nanostructured surface. In that process, a substrate is provided having a nanostructured material on a surface, the substrate being conductive and the nanostructured material being coated with an insulating material. A portion of the nanostructured material is at least partially removed. A conductor is deposited on the substrate in such a way that it is in electrical contact with the substrate through the area where the nanostructured material has been at least partially removed.
摘要翻译: 提供了一种使纳米结构化表面接触的方法。 在该过程中,提供在表面上具有纳米结构材料的基底,该基底是导电的,并且纳米结构材料被涂覆有绝缘材料。 至少部分地去除纳米结构材料的一部分。 导体以这样的方式沉积在基板上,使得其通过至少部分去除纳米结构材料的区域与基板电接触。
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公开(公告)号:US20140332068A1
公开(公告)日:2014-11-13
申请号:US14338752
申请日:2014-07-23
发明人: Michael Jura , Marcie R. Black , Jeff Miller , Joanne Yim , Joanne Forziati , Brian Murphy , Richard Chleboski
IPC分类号: H01L31/0236 , H01L31/0368 , H01L31/18 , H01L31/0216 , H01L31/0224 , H01L31/0312 , H01L31/0376
CPC分类号: H01L31/02363 , B82Y30/00 , H01L29/0673 , H01L31/02167 , H01L31/022425 , H01L31/022433 , H01L31/0312 , H01L31/035227 , H01L31/03682 , H01L31/03762 , H01L31/1868 , Y02E10/50
摘要: A process is provided for contacting a nanostructured surface. The process may include (a) providing a substrate having a nanostructured material on a surface, (b) passivating the surface on which the nanostructured material is located, (c) screen printing onto the nanostructured surface and (d) firing the screen printing ink at a high temperature. In some embodiments, the nanostructured material compromises silicon. In some embodiments, the nanostructured material includes silicon nanowires. In some embodiments, the nanowires are around 150 nm, 250 nm, or 400 nm in length. In some embodiments, the nanowires have a diameter range between about 30 nm and about 200 nm. In some embodiments, the nanowires are tapered such that the base is larger than the tip. In some embodiments, the nanowires are tapered at an angle of about 1 degree, about 3 degrees, or about 10 degrees. In some embodiments, a high temperature can be approximately 700C, 750C, 800C, or 850C.
摘要翻译: 提供了一种使纳米结构化表面接触的方法。 该方法可以包括(a)在表面上提供具有纳米结构材料的基材,(b)钝化纳米结构材料所在的表面,(c)丝网印刷到纳米结构表面上,和(d)将丝网印刷油墨 在高温下。 在一些实施例中,纳米结构材料损害硅。 在一些实施例中,纳米结构材料包括硅纳米线。 在一些实施方案中,纳米线长度为约150nm,250nm或400nm。 在一些实施方案中,纳米线具有在约30nm至约200nm之间的直径范围。 在一些实施例中,纳米线是锥形的,使得基部大于尖端。 在一些实施例中,纳米线以约1度,约3度或约10度的角度逐渐变细。 在一些实施方案中,高温可以为约700℃,750℃,800℃或850℃。
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