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    Structure for preventing adhesive bleed onto surfaces
    1.
    发明授权
    Structure for preventing adhesive bleed onto surfaces 失效
    用于防止粘合剂渗透到表面上的结构

    公开(公告)号：US06252307B1

    公开(公告)日：2001-06-26

    申请号：US09537959

    申请日：2000-03-28

    申请人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    发明人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    IPC分类号： H01L2100

    CPC分类号： B82Y30/00 ,  B82Y10/00 ,  H01L21/4864 ,  H01L23/49894 ,  H01L24/80 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14

    摘要： A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface. The hydrocarbon segment presents a surface on the noble metal that has the characteristics of the hydrocarbon portion of the molecule which has a low surface tension, and, thus, prevents wetting of the noble metal by an epoxy adhesive component. The SAMs, once they provide protection from the bleed of the die attach adhesives, self desorb during the wire bonding or soldering temperatures.

    摘要翻译： 提供了一种方法和结构，用于当将I / C芯片附着到基板上时，防止粘合剂（例如环氧树脂）在电介质基板的表面上的贵金属线接合焊盘上的润湿或渗出。 该方法包括用化学成分处理引线接合焊盘，该化学组合物防止由环氧树脂的部件渗透到引线接合焊盘的表面上。 化学成分是一种在金表面提供“自组装单层”（SAM）的化学成分。 这些组合物的特征在于具有连接到烃部分如（CH 2）x链的至少一个基团的硫醇或二硫化物的分子。 与贵金属化学键合的分子的硫醇或含硫部分的亲和性提供了分子与金属表面相对较强的附着。 烃段在贵金属上呈现具有低分子表面张力的分子的特征的表面，并且因此防止了环氧粘合剂组分对贵金属的润湿。一旦它们提供 防止裸片的泄漏附着粘合剂，在引线接合或焊接温度期间自身解吸。

    Method for preventing adhesive bleed onto surfaces
    2.
    发明授权
    Method for preventing adhesive bleed onto surfaces 失效
    防止粘合剂渗透到表面上的方法

    公开(公告)号：US06420253B2

    公开(公告)日：2002-07-16

    申请号：US09881466

    申请日：2001-06-14

    申请人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    发明人： Bernd K. Appelt ,  Gary A. Johansson ,  Gerald W. Jones ,  Luis J. Matienzo ,  Yenloan H. Nguyen ,  Konstantinos I. Papathomas

    IPC分类号： H01L2144

    CPC分类号： B82Y30/00 ,  B82Y10/00 ,  H01L21/4864 ,  H01L23/49894 ,  H01L24/80 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14

    摘要： A method and structure is provided for preventing wetting or bleed of an adhesive, such as an epoxy, onto noble metal wire bond pads on the surface of a dielectric substrate when attaching an I/C chip to the substrate. The method includes treating the wire bond pads with a chemical composition which prevents bleeding onto the surfaces of the wire bond pads by a component of the epoxy. The chemical composition is a chemical which will provide “Self-Assembled Monolayers” (SAMs) on the surface of the gold. These compositions are characterized by a molecule having at least one group, such as a mercaptan or disulfide, connected to a hydrocarbon moiety, such as a (CH2)x chain. The affinity of the thiol or sulfur-containing portion of the molecule chemically bonding with the noble metal provides a relatively strong attachment of the molecule to the metal surface. The hydrocarbon segment presents a surface on the noble metal that has the characteristics of the hydrocarbon portion of the molecule which has a low surface tension, and, thus, prevents wetting of the noble metal by an epoxy adhesive component. The SAMs, once they provide protection from the bleed of the die attach adhesives, self desorb during the wire bonding or soldering temperatures.

    摘要翻译： 提供了一种方法和结构，用于当将I / C芯片附接到基板时，防止粘合剂（例如环氧树脂）在电介质基板的表面上的贵金属引线接合焊盘上的润湿或渗出。 该方法包括用化学成分处理引线接合焊盘，该化学组合物防止由环氧树脂的部件渗透到引线接合焊盘的表面上。 化学成分是一种在金表面提供“自组装单层”（SAM）的化学成分。 这些组合物的特征在于具有连接到烃部分如（CH 2）x链的至少一个基团的硫醇或二硫化物的分子。 与贵金属化学键合的分子的硫醇或含硫部分的亲和性提供了分子与金属表面相对较强的附着。 碳氢化合物段在贵金属上呈现具有低分子表面张力的分子的特征的表面，从而防止了环氧粘合剂组分对贵金属的润湿。 SAMs一旦提供防止裸片附着胶粘剂的泄漏，在引线接合或焊接温度期间自解吸。

    Method for photoselective seeding and metallization of three-dimensional materials
    9.
    发明授权
    Method for photoselective seeding and metallization of three-dimensional materials 失效
    三维材料的光选播种和金属化方法

    公开(公告)号：US06210781B1

    公开(公告)日：2001-04-03

    申请号：US09459850

    申请日：1999-12-13

    申请人： Thomas H. Baum ,  Luis J. Matienzo ,  Cindy Reidsema Simpson ,  Joseph E. Varsik

    发明人： Thomas H. Baum ,  Luis J. Matienzo ,  Cindy Reidsema Simpson ,  Joseph E. Varsik

    IPC分类号： B32B900

    CPC分类号： B32B9/00 ,  C23C18/14 ,  H01L2924/0002 ,  H05K3/0082 ,  H05K3/105 ,  H05K3/185 ,  H05K3/403 ,  H05K2201/09645 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2924/00

    摘要： A method is provided for selectively metallizing one or more three-dimensional materials in an electronic circuit package comprising the steps of forming a layer of seeding solution on a surface of the three-dimensional material of interest, exposing this layer to light of appropriate wavelength, resulting in the formation of metal seed on regions of the three-dimensional material corresponding to the regions of the layer of seeding solution exposed to light; removing the unexposed regions of the layer of seeding solution by subjecting the exposed and unexposed regions of the layer of seeding solution to an alkaline solution. Thereafter, additional metal is deposited, e.g., plated, onto the metal seed using conventional techniques. Significantly, this method does not involve the use of a photoresist, or of a corresponding chemical developer or photoresist stripper. Of additional significance, this method is ideal for plating three-dimensional materials such as cone-shaped connectors used in electronic circuit packages.

    摘要翻译： 提供了一种用于在电子电路封装中选择性地金属化一种或多种三维材料的方法，包括以下步骤：在感兴趣的三维材料的表面上形成接种溶液层，将该层暴露于适当波长的光， 导致在与暴露于光的接种溶液层的区域相对应的三维材料的区域上形成金属种子; 通过使接种溶液层的暴露和未曝光区域经受碱溶液来除去接种溶液层的未曝光区域。 此后，使用常规技术将另外的金属沉积，例如电镀到金属种子上。 重要的是，该方法不涉及光致抗蚀剂或相应的化学显影剂或光致抗蚀剂剥离剂的使用。 具有其他意义的是，该方法对于电子电路封装中使用的锥形连接器等三维材料的电镀是理想的。