Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes
    1.
    发明授权
    Laser systems and methods using triangular-shaped tailored laser pulses for selected target classes 失效
    激光系统和方法使用三角形定制的激光脉冲进行选定的目标等级

    公开(公告)号:US08476552B2

    公开(公告)日:2013-07-02

    申请号:US12753659

    申请日:2010-04-02

    IPC分类号: B23K26/00

    摘要: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. At least one of the predefined temporal pulse profiles may be triangular. The target class may include, for example unpassivated electrically conductive links or other bare metal structures. Based on the target class associated with the selected target, a laser pulse is generated having a triangular temporal pulse profile. The generated laser pulse is used to process the selected structure.

    摘要翻译: 使用激光加工诸如半导体晶片或其他材料的工件包括选择对应于与预定义的时间脉冲轮廓相关联的目标类别的目标。 预定义的时间脉冲轮廓中的至少一个可以是三角形的。 目标类可以包括例如未激活的导电链路或其他裸机构。 基于与所选择的目标相关联的目标类别,产生具有三角形时间脉冲分布的激光脉冲。 所产生的激光脉冲用于处理所选择的结构。

    LASER SYSTEMS AND METHODS USING TRIANGULAR-SHAPED TAILORED LASER PULSES FOR SELECTED TARGET CLASSES
    2.
    发明申请
    LASER SYSTEMS AND METHODS USING TRIANGULAR-SHAPED TAILORED LASER PULSES FOR SELECTED TARGET CLASSES 失效
    激光系统和使用三角形定制激光脉冲的选择目标类的方法

    公开(公告)号:US20100276405A1

    公开(公告)日:2010-11-04

    申请号:US12753659

    申请日:2010-04-02

    IPC分类号: B23K26/00

    摘要: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. At least one of the predefined temporal pulse profiles may be triangular. The target class may include, for example unpassivated electrically conductive links or other bare metal structures. Based on the target class associated with the selected target, a laser pulse is generated having a triangular temporal pulse profile. The generated laser pulse is used to process the selected structure.

    摘要翻译: 使用激光加工诸如半导体晶片或其他材料的工件包括选择对应于与预定义的时间脉冲轮廓相关联的目标类别的目标。 预定义的时间脉冲轮廓中的至少一个可以是三角形的。 目标类可以包括例如未激活的导电链路或其他裸机构。 基于与所选择的目标相关联的目标类别,产生具有三角形时间脉冲分布的激光脉冲。 所产生的激光脉冲用于处理所选择的结构。