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    INKJET HEAD MANUFACTURING METHOD
    1.
    发明申请
    INKJET HEAD MANUFACTURING METHOD 审中-公开
    喷墨头制造方法

    公开(公告)号：US20100107411A1

    公开(公告)日：2010-05-06

    申请号：US12469278

    申请日：2009-05-20

    申请人： Boum-Seock KIM ,  Jae-Woo JOUNG ,  Ju-Hwan YANG ,  Jae-Hun KIM ,  Young-Seuck YOO

    发明人： Boum-Seock KIM ,  Jae-Woo JOUNG ,  Ju-Hwan YANG ,  Jae-Hun KIM ,  Young-Seuck YOO

    IPC分类号： B21D53/76

    CPC分类号： B41J2/161 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1632 ,  Y10T29/49401

    摘要： An inkjet head manufacturing method is disclosed. The method of manufacturing an inkjet bead including a plurality of chambers, configured to contain ink; and an actuator, configured to provide pressure to the chamber, which includes forming a piezoelectric element on one side of the inkjet head that is adjacent to the chambers; forming the actuator(s) by dicing the piezoelectric element such that the piezoelectric element is divided and placed corresponding to a position of the chamber(s); and etching one side of the inkjet head such that a part of the piezoelectric element remaining between the adjacent actuators, can manufacture an inkjet head having a thin-film actuator reducing the cross talk by removing a part of the piezoelectric element remaining between the actuators of the inkjet head.

    摘要翻译： 公开了一种喷墨头制造方法。 制造包括多个室的喷墨珠的制造方法，所述多个室被构造成容纳油墨; 以及致动器，被配置为向所述腔室提供压力，所述致动器包括在所述喷墨头的与所述腔室相邻的一侧上形成压电元件; 通过切割压电元件来形成致动器，使得压电元件相应于腔室的位置被分开和放置; 并且蚀刻喷墨头的一侧，使得保持在相邻致动器之间的压电元件的一部分可以制造具有薄膜致动器的喷墨头，通过去除残留在致动器之间的压电元件的一部分来减少串扰 喷墨头。

    INK-JET HEAD
    2.
    发明申请
    INK-JET HEAD 审中-公开
    喷墨头

    公开(公告)号：US20100182376A1

    公开(公告)日：2010-07-22

    申请号：US12503451

    申请日：2009-07-15

    申请人： Boum-Seock KIM ,  Jae-Woo JOUNG ,  Ju-Hwan YANG ,  Young-Seuck YOO

    发明人： Boum-Seock KIM ,  Jae-Woo JOUNG ,  Ju-Hwan YANG ,  Young-Seuck YOO

    IPC分类号： B41J2/14

    CPC分类号： B41J2/14233 ,  B41J2002/14475

    摘要： An ink-jet head is disclosed. The ink-jet head can include a chamber for holding ink, an actuator that can provide pressure to the chamber, and a nozzle that includes a multiple number of channels for ejecting the ink. Certain embodiments of the invention can reduce the surface tension of the ink droplets and thereby reduce the capacity requirement of the actuators.

    摘要翻译： 公开了一种喷墨头。 喷墨头可以包括用于保持墨水的腔室，可向腔室提供压力的致动器以及包括用于喷射墨水的多个通道的喷嘴。 本发明的某些实施例可以降低墨滴的表面张力，从而降低致动器的容量要求。

    METHOD OF MANUFACTURING INK-JET HEAD
    4.
    发明申请
    METHOD OF MANUFACTURING INK-JET HEAD 审中-公开
    制造喷嘴头的方法

    公开(公告)号：US20100096081A1

    公开(公告)日：2010-04-22

    申请号：US12437082

    申请日：2009-05-07

    申请人： Pil-Joong KANG ,  Jae-Woo JOUNG ,  Young-Seuck YOO

    发明人： Pil-Joong KANG ,  Jae-Woo JOUNG ,  Young-Seuck YOO

    IPC分类号： B32B37/06

    CPC分类号： B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1634 ,  B41J2002/14403

    摘要： Disclosed is a method of manufacturing an ink-jet head including a reservoir storing ink, an inlet port through which the ink is provided to the reservoir, a chamber provided with the ink from the reservoir, a restrictor linking the reservoir and the chamber, and a nozzle through which the ink in the chamber is discharged. The method in accordance with an embodiment of the present invention includes: processing a first plate in which the inlet port is formed; processing a second plate in which the chamber and the inlet port are formed; bonding the first plate on an upper surface of the second plate; processing a third plate in which the restrictor and the reservoir are formed; processing a fourth plate by irradiating a femtosecond laser such that the nozzle is formed; bonding the fourth plate on a lower surface of the third plate, and bonding the third plate on a lower surface of the second plate.

    摘要翻译： 公开了一种制造喷墨头的方法，该喷墨头包括存储墨水的储存器，墨水提供给储存器的入口，从储存器设置有墨水的室，连接储存器和室的限流器，以及 一个喷嘴，通过该喷嘴排出腔室中的墨水。 根据本发明的实施例的方法包括：处理其中形成入口的第一板; 处理形成所述室和所述入口的第二板; 将所述第一板接合在所述第二板的上表面上; 处理其中形成限流器和储存器的第三板; 通过照射飞秒激光以形成喷嘴来处理第四板; 将第四板接合在第三板的下表面上，并将第三板接合在第二板的下表面上。

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD
    7.
    发明申请
    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD 审中-公开
    印刷电路板和制造方法

    公开(公告)号：US20100059251A1

    公开(公告)日：2010-03-11

    申请号：US12432449

    申请日：2009-04-29

    申请人： Sergey REMIZOV ,  Jae-Woo JOUNG ,  Hyun-Chul JUNG ,  Young-Ah SONG

    发明人： Sergey REMIZOV ,  Jae-Woo JOUNG ,  Hyun-Chul JUNG ,  Young-Ah SONG

    IPC分类号： B29C43/02 ,  B29C59/14 ,  H05K1/00

    CPC分类号： H05K3/107 ,  H05K3/125 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2203/013 ,  H05K2203/0278 ,  H05K2203/1131

    摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The method, which includes providing a base substrate in which a thermoplastic resin layer is formed; forming a circuit pattern on the thermoplastic resin layer by discharging a conductive ink by an inkjet method; curing the circuit pattern through the heating at a temperature that is lower than a melting point of the thermoplastic resin layer; sintering the circuit pattern through the heating; and burying at least a part of the circuit pattern in the thermoplastic resin layer by heating the thermoplastic resin layer and compressing the circuit pattern toward the thermoplastic resin layer, can provide a printed circuit board and a method for manufacturing the same, in which a fine circuit pattern can be formed by an inkjet method and the adhesive force between the circuit pattern and the base substrate can be improved.

    摘要翻译： 公开了一种印刷电路板及其制造方法。 该方法包括提供其中形成热塑性树脂层的基底; 通过喷墨法排出导电油墨，在热塑性树脂层上形成电路图形; 在低于热塑性树脂层的熔点的温度下通过加热固化电路图案; 通过加热烧结电路图案; 并且通过加热热塑性树脂层并将电路图案压向热塑性树脂层，将电路图案的至少一部分埋入热塑性树脂层中，可以提供印刷电路板及其制造方法，其中精细 可以通过喷墨法形成电路图案，并且可以提高电路图案和基底基板之间的粘合力。

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20090269559A1

    公开(公告)日：2009-10-29

    申请号：US12355288

    申请日：2009-01-16

    申请人： Ro-Woon LEE ,  Jae-Woo JOUNG ,  Kyoung-Jin JEONG ,  Tae-Gu KIM

    发明人： Ro-Woon LEE ,  Jae-Woo JOUNG ,  Kyoung-Jin JEONG ,  Tae-Gu KIM

    IPC分类号： B32B27/34 ,  B29C65/02

    CPC分类号： H05K1/036 ,  H05K1/0366 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/389 ,  H05K2201/0154 ,  H05K2203/013 ,  Y10T428/24851

    摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include adhering a film to an insulation base, in which the film is configured to flatten a surface of the insulation base, thermosetting the film, and forming a circuit pattern on the film by way of ink-jetting. In accordance with the present invention, a surface of the insulation base can be flattened and the surface roughness thereof can be made uniform, so that the diffusivity of the circuit pattern can be controlled while printing a minute circuit pattern and an adhesive strength between the insulation base and the circuit pattern can be increased.

    摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 制造印刷电路板的方法可以包括将膜粘附到绝缘基底上，其中膜被构造成使绝缘基底的表面平坦化，使膜热固化，并且通过油墨形成电路图案， 喷射 根据本发明，可以使绝缘基体的表面变平，并使其表面粗糙度均匀，从而可以在印刷微电路图案和绝缘层之间的粘合强度的同时控制电路图案的扩散率 基极和电路图案可以增加。