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公开(公告)号：US06815729B1
公开(公告)日：2004-11-09
申请号：US10268200
申请日：2002-10-09
申请人： Brenor Brophy , Marc Hartranft , Syed Tariq Shafaat , Jeff Hall
发明人： Brenor Brophy , Marc Hartranft , Syed Tariq Shafaat , Jeff Hall
IPC分类号： H01L3300
CPC分类号： H01S5/02248 , H01L2224/16225 , H01S5/02272 , H01S5/024 , H01S5/423
摘要： An electro-optical device preferably includes a printed circuit board (PCB) having a cutout region or a rigid region. A leadframe having an electro-optical semiconductor device arranged thereon can be arranged in proximity to the cutout region of the PCB. Alternatively, the electro-optical device can be arranged on the rigid region of the PCB. A lens is preferably arranged over the electro-optical semiconductor device. A connector array can also be arranged on the PCB to communicate electrical signals with an external device. An interface circuit, such as a driver circuit or an amplifier circuit, can also be arranged in close proximity to the electro-optical semiconductor devices on the leadframe or the PCB.
摘要翻译： 电光装置优选地包括具有切除区域或刚性区域的印刷电路板（PCB）。 具有布置在其上的电光半导体器件的引线框可布置在PCB的切除区域附近。 或者，电光装置可以布置在PCB的刚性区域上。 透镜优选地布置在电光半导体器件上。 连接器阵列也可以布置在PCB上以与外部设备通信电信号。 诸如驱动器电路或放大器电路的接口电路也可以被布置成靠近引线框架或PCB上的电光半导体器件。
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公开(公告)号：US07129722B1
公开(公告)日：2006-10-31
申请号：US10268275
申请日：2002-10-09
申请人： Brenor Brophy , Marc Hartranft , Syed Tariq Shafaat , Jeff Hall
发明人： Brenor Brophy , Marc Hartranft , Syed Tariq Shafaat , Jeff Hall
IPC分类号： G01R31/302
CPC分类号： G01R31/304 , G01R31/309
摘要： The quality and reliability of electro-optical modules can be improved, for instance, through improved testing and burn-in of an electro-optical sub-assembly. Reliability can also be enhanced through better methods of constructing an electro-optical module. By arranging both an electrical interface and an optical interface on a sub-assembly, for instance, testing can be performed on both interfaces in a single testing process. Burning-in an electro-optical sub-assembly can also improve the reliability of the module by identifying defects. A method of forming an electro-optical module can provide improved reliability by testing and/or burning-in an electro-optical sub-assembly before assembling the module.
摘要翻译： 例如，通过改进电光子组件的测试和老化，可以提高电光模块的质量和可靠性。 还可以通过构建电光模块的更好方法来增强可靠性。 通过在子组件上布置电接口和光接口，例如，可以在单个测试过程中在两个接口上执行测试。 燃烧电光子组件还可以通过识别缺陷来提高模块的可靠性。 形成电光模块的方法可以在组装模块之前通过测试和/或燃烧电光子组件来提供改进的可靠性。
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公开(公告)号：US06892449B1
公开(公告)日：2005-05-17
申请号：US10268205
申请日：2002-10-09
申请人： Brenor Brophy , Marc Hartranft , Syed Tariq Shafaat , Jeff Hall
发明人： Brenor Brophy , Marc Hartranft , Syed Tariq Shafaat , Jeff Hall
CPC分类号： G02B6/4206 , H01L2224/16225 , Y10T29/49121 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49155 , Y10T29/49798
摘要： A method of manufacturing a plurality of electro-optical sub-assemblies in parallel is provided. A plurality of printed circuit boards (PCBs) are preferably formed in a panel of flex material. Rigid substrates can be arranged along regions of the PCBs. A plurality of electrical components, including electro-optical semiconductor devices, are preferably located on the rigid substrates. Lens arrays are preferably aligned over the electro-optical semiconductor devices, such as through an alignment mechanism. The PCBs can then be singulated into individual electro-optical sub-assemblies. The rigid substrates can be a plurality of leadframes formed on a matrix leadframe. The matrix leadframe is preferably attached to the panel of flex material such that the leadframes are arranged in proximity to leadframe cutout regions of the PCBs. Electrical interconnections are then preferably formed between the electrical components on the leadframe and the PCBs.
摘要翻译： 提供并联制造多个电光子组件的方法。 多个印刷电路板（PCB）优选地形成在柔性材料的面板中。 刚性基板可以沿着PCB的区域布置。 包括电光半导体器件的多个电气部件优选地位于刚性基板上。 透镜阵列优选地在电光半导体器件上对准，例如通过对准机构。 然后可将PCBs分割成单独的电光子组件。 刚性基板可以是形成在矩阵引线框架上的多个引线框架。 矩阵引线框架优选地附接到柔性材料板，使得引线框架布置在PCB的引线框架切除区域附近。 然后优选在引线框架上的电气部件和PCB之间形成电互连。
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公开(公告)号：US06890107B1
公开(公告)日：2005-05-10
申请号：US10268216
申请日：2002-10-09
申请人： Brenor Brophy , Marc Hartranft , Syed Tariq Shafaat , Jeff Hall
发明人： Brenor Brophy , Marc Hartranft , Syed Tariq Shafaat , Jeff Hall
CPC分类号： G02B6/4201 , G02B6/4204 , G02B6/4224 , G02B6/4249 , G02B6/428
摘要： An electro-optical apparatus constructed according to various inventive principles disclosed herein provides flexibility in the type and arrangement of components. The electro-optical apparatus preferably includes a Printed Circuit Board (PCB). An interface device can be electrically connected to the PCB, and an electro-optical device can be electrically connected to the interface device. A lens is preferably arranged in optical communication with the electro-optical device. Numerous variations in component selection and arrangement are contemplated within the scope of these inventive principles. Various methods for configuring an electro-optical apparatus are also provided.
摘要翻译： 根据本文公开的各种发明原理构造的电光装置提供了组件的类型和布置的灵活性。 电光装置优选地包括印刷电路板（PCB）。 接口装置可以电连接到PCB，并且电光装置可以电连接到接口装置。 透镜优选地布置成与电光装置光学连通。 在这些发明原理的范围内考虑了组件选择和布置的许多变化。 还提供了用于配置电光装置的各种方法。
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公开(公告)号：US06956995B1
公开(公告)日：2005-10-18
申请号：US10232790
申请日：2002-08-28
CPC分类号： G02B6/4214 , G02B6/32 , G02B6/43
摘要： An arrangement for optical communication comprises an optical coupler, an opto-electronic board, and an optical fiber. The optical fiber comprises a first refraction surface, a second refraction surface, and an internal reflector. The first refraction surface has a first finite focal length. The second refraction surface has a second finite focal length. In operation, an optical signal enters the first refraction surface, couples from the first refraction surface to the second refraction surface via the internal reflector, and exits the second refraction surface, where the optical signal defines a light path. The light path optically couples the opto-electronic board to the optical fiber.
摘要翻译： 光通信装置包括光耦合器，光电板和光纤。 光纤包括第一折射表面，第二折射表面和内部反射器。 第一折射面具有第一有限焦距。 第二折射面具有第二有限焦距。 在操作中，光信号进入第一折射表面，经由内部反射器从第一折射表面耦合到第二折射表面，并且离开第二折射表面，其中光信号限定光路。 光路将光电板光耦合到光纤。
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6.发明授权Circuit and method for snapdown prevention in voltage controlled MEMS devices 有权电压控制MEMS器件防止掉电的电路和方法公开(公告)号：US07529017B1
公开(公告)日：2009-05-05
申请号：US11448302
申请日：2006-06-07
IPC分类号： G02B26/00
CPC分类号： G02B26/0808 , B81C1/00976
摘要： A circuit and method are provided for preventing snapdown in a voltage controlled Micro-Electromechanical System device having a movable actuator with an actuator electrode coupled to a first potential, the actuator suspended over a cavity electrode coupled to a second potential. Generally, the circuit includes an in-circuit conductive path between the actuator electrode and the cavity electrode, the conductive path configured to transfer charge therebetween when a voltage between the first and second potential exceeds a predetermined threshold voltage. In one embodiment the conductive path comprises an ESD clamp coupled between the actuator electrode and the cavity electrode. Other embodiments are also disclosed.
摘要翻译： 提供了一种电路和方法，用于防止具有可动致动器的压控微机电系统装置中的卡扣，致动器电极耦合到第一电位，致动器悬挂在耦合到第二电位的腔电极上。 通常，电路包括在致动器电极和腔电极之间的在线导电路径，导电路径被配置为当第一和第二电位之间的电压超过预定阈值电压时在其间传递电荷。 在一个实施例中，导电路径包括耦合在致动器电极和腔电极之间的ESD夹具。 还公开了其他实施例。
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公开(公告)号：US5846874A
公开(公告)日：1998-12-08
申请号：US810494
申请日：1997-02-28
申请人： Marc Hartranft , Pat Zicolello
发明人： Marc Hartranft , Pat Zicolello
CPC分类号： H01L23/562 , H01L23/585 , H01L2924/0002
摘要： An anchor structure placed in an open field in corner areas of the semiconductor die and along die edges for preventing cracks in the die. In the corner areas, the anchor structure is placed perpendicular to a resultant vector force, which is approximately at a 45.degree. angle to an imaginary horizontal line passing through the die. This perpendicular placement of the anchor structure more uniformly distributes the stresses along the anchor preventing corner cracks in the die. Along the die edges, the anchor structures are placed approximately perpendicular to the resultant vector forces that impinge the die edges.
摘要翻译： 锚固结构放置在半导体管芯的拐角区域的开放场中并且沿着模具边缘，以防止模具中的裂纹。 在拐角区域中，锚结构垂直于与通过模具的虚拟水平线大约成45度角的合成矢量力。 锚定结构的这种垂直放置更均匀地分布沿着锚的应力，防止模具中的角裂纹。 沿着模具边缘，锚结构被放置成大致垂直于撞击冲模边缘的合成矢量力。
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公开(公告)号：US07573695B1
公开(公告)日：2009-08-11
申请号：US11977875
申请日：2007-10-26
IPC分类号： H01T23/00
CPC分类号： H01H59/0009 , H01H2059/0018
摘要： An architecture and method are provided for preventing snapdown in a voltage controlled MEMS device having a movable actuator with an actuator electrode coupled to a high voltage power supply (HVPS) through a drive circuit, the movable actuator suspended over a cavity electrode formed on a substrate and coupled to a common backplane supply (VssC). Generally, the circuit includes a number of first diodes coupled between the HVPS and the actuator electrode and/or the cavity electrode to provide a forward-biased path to transfer a positive charge to the HVPS when the accumulated charge exceeds a predetermined threshold. Preferably, the drive circuit further includes second diodes to provide a low impedance path to transfer a positives charge from the actuator electrode and/or the cavity electrode to a substrate ground when the accumulated charge results in or exceeds a predetermined threshold voltage. Other embodiments are also disclosed.
摘要翻译： 提供了一种架构和方法，用于防止具有可移动致动器的压控MEMS装置中的卡扣，致动器具有通过驱动电路耦合到高压电源（HVPS）的致动器电极，可移动致动器悬挂在形成在基板上的空腔电极 并耦合到公共背板电源（VssC）。 通常，电路包括耦合在HVPS和致动器电极和/或空腔电极之间的多个第一二极管，以在累积电荷超过预定阈值时提供正向偏置路径以将正电荷传送到HVPS。 优选地，驱动电路还包括第二二极管，以在累积电荷导致或超过预定阈值电压时提供低阻抗路径以将正电荷从致动器电极和/或空腔电极传送到衬底接地。 还公开了其他实施例。
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公开(公告)号：US07184253B1
公开(公告)日：2007-02-27
申请号：US11332676
申请日：2006-01-13
申请人： Marc Hartranft , Eric Mann , Dan Zupcau
发明人： Marc Hartranft , Eric Mann , Dan Zupcau
IPC分类号： H02H3/22
CPC分类号： H01L27/0266
摘要： A circuit (100) can include a first section (102) that can provide a designated function within an integrated circuit device that can be altered due to current injection at a node (106). A mirror section (104) can mirror the effects of current injection on one or more devices within first section (102) and generate an output indication INJ_EFF representing such effects. In one very particular arrangement, detection of an injected current can be used to prevent false triggering of a switched electrostatic discharge (ESD) current path.
摘要翻译： 电路（100）可以包括第一部分（102），其可以在集成电路装置内提供由于在节点（106）处的电流注入而可以改变的指定功能。 镜部分（104）可以将电流注入的影响反映在第一部分（102）内的一个或多个装置上，并产生表示这种效果的输出指示INJ_EFF。 在一个非常特别的布置中，可以使用注入电流的检测来防止开关静电放电（ESD）电流路径的错误触发。
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公开(公告)号：US5650666A
公开(公告)日：1997-07-22
申请号：US562125
申请日：1995-11-22
申请人： Marc Hartranft , Pat Zicolello
发明人： Marc Hartranft , Pat Zicolello
CPC分类号： H01L23/562 , H01L23/585 , H01L2924/0002
摘要： An anchor structure placed in an open field in corner areas of the semiconductor die and along die edges for preventing cracks in the die. In the corner areas, the anchor structure is placed perpendicular to a resultant vector force, which is approximately at a 45.degree. angle to an imaginary horizontal line passing through the die. This perpendicular placement of the anchor structure more uniformly distributes the stresses along the anchor preventing corner cracks in the die. Along the die edges, the anchor structures are placed approximately perpendicular to the resultant vector forces that impinge the die edges.
摘要翻译： 锚固结构放置在半导体管芯的拐角区域的开放场中并且沿着模具边缘，以防止模具中的裂纹。 在拐角区域中，锚结构垂直于与通过模具的虚拟水平线大约成45度角的合成矢量力。 锚定结构的这种垂直放置更均匀地分布沿着锚的应力，防止模具中的角裂纹。 沿着模具边缘，锚结构被放置成大致垂直于撞击冲模边缘的合成矢量力。
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