公开(公告)号：US20050116245A1

公开(公告)日：2005-06-02

申请号：US10965453

申请日：2004-10-13

申请人： Bruce Aitken ,  Paul Danielson ,  James Dickinson ,  Stephan Logunov ,  Robert Morena ,  Mark Powley ,  Kamjula Reddy ,  Joseph Schroeder ,  Alexander Streltsov

发明人： Bruce Aitken ,  Paul Danielson ,  James Dickinson ,  Stephan Logunov ,  Robert Morena ,  Mark Powley ,  Kamjula Reddy ,  Joseph Schroeder ,  Alexander Streltsov

IPC分类号： C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C8/24 ,  C03C27/00 ,  C03C27/06 ,  C03C27/12 ,  H01L51/00 ,  H01L51/52 ,  H05B33/04 ,  H01L21/00 ,  H01L33/00

CPC分类号： C03B23/245 ,  C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C8/24 ,  C03C27/06 ,  H01L51/524 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 在一个实施例中，通过提供第一基板和第二基板制造密封的玻璃封装。 第二基板包含至少一种过渡金属或稀土金属，例如铁，铜，钒，锰，钴，镍，铬，钕和/或铈。 需要保护的敏感薄膜器件沉积到第一衬底板上。 然后使用激光器以使其一部分膨胀并形成将第一衬底板连接到第二衬底板的气密密封件并且还保护薄膜器件的方式来加热掺杂的第二衬底板。 第二衬底板掺杂有至少一种过渡金属，使得当激光与其相互作用时，吸收来自第二衬底板中的激光的光，这导致气密密封的形成，同时避免对 薄膜装置。 本文还描述了密封玻璃封装的另一个实施例以及密封玻璃封装的制造方法。

公开(公告)号：US20070007894A1

公开(公告)日：2007-01-11

申请号：US11521888

申请日：2006-09-15

申请人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H05B33/04 ,  H05B33/10 ,  H01L51/50

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积到第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US20060009109A1

公开(公告)日：2006-01-12

申请号：US11228803

申请日：2005-09-16

申请人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H05B33/10

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

公开(公告)号：US20050001545A1

公开(公告)日：2005-01-06

申请号：US10823331

申请日：2004-04-13

申请人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C27/00 ,  C03C27/06 ,  H01L51/52 ,  H05B33/04 ,  H05B33/00

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积到第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US08148179B2

公开(公告)日：2012-04-03

申请号：US12725648

申请日：2010-03-17

申请人： Bruce G. Aitken ,  Paul S. Danielson ,  James E. Dickinson, Jr. ,  Stephan L. Logunov ,  Robert Morena ,  Mark L. Powley ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Alexander Streltsov

发明人： Bruce G. Aitken ,  Paul S. Danielson ,  James E. Dickinson, Jr. ,  Stephan L. Logunov ,  Robert Morena ,  Mark L. Powley ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Alexander Streltsov

IPC分类号： H01L21/00

CPC分类号： C03B23/245 ,  C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C8/24 ,  C03C27/06 ,  H01L51/524 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 在一个实施例中，通过提供第一基板和第二基板制造密封的玻璃封装。 第二基板包含至少一种过渡金属或稀土金属，例如铁，铜，钒，锰，钴，镍，铬，钕和/或铈。 需要保护的敏感薄膜器件沉积到第一衬底板上。 然后使用激光器以使其一部分膨胀并形成将第一衬底板连接到第二衬底板的气密密封件并且还保护薄膜器件的方式来加热掺杂的第二衬底板。 第二衬底板掺杂有至少一种过渡金属，使得当激光与其相互作用时，吸收来自第二衬底板中的激光的光，这导致气密密封的形成，同时避免对 薄膜装置。 本文还描述了密封玻璃封装的另一个实施例以及密封玻璃封装的制造方法。

公开(公告)号：US07407423B2

公开(公告)日：2008-08-05

申请号：US10823331

申请日：2004-04-13

申请人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H01J9/00

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积在第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US08063560B2

公开(公告)日：2011-11-22

申请号：US11521888

申请日：2006-09-15

申请人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H05B33/00

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积到第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US20100186449A1

公开(公告)日：2010-07-29

申请号：US12725648

申请日：2010-03-17

申请人： Bruce G. Aitken ,  Paul S. Danielson ,  James E. Dickinson, JR. ,  Stephan L. Longunov ,  Robert Morena ,  Mark L. Powley ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Alexander Streltsov

发明人： Bruce G. Aitken ,  Paul S. Danielson ,  James E. Dickinson, JR. ,  Stephan L. Longunov ,  Robert Morena ,  Mark L. Powley ,  Kamjula P. Reddy ,  Joseph F. Schroeder, III ,  Alexander Streltsov

IPC分类号： C03B29/00

CPC分类号： C03B23/245 ,  C03C3/091 ,  C03C3/093 ,  C03C3/108 ,  C03C8/04 ,  C03C8/10 ,  C03C8/24 ,  C03C27/06 ,  H01L51/524 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. In one embodiment, the hermetically sealed glass package is manufactured by providing a first substrate plate and a second substrate plate. The second substrate contains at least one transition or rare earth metal such as iron, copper, vanadium, manganese, cobalt, nickel, chromium, neodymium and/or cerium. A sensitive thin-film device that needs protection is deposited onto the first substrate plate. A laser is then used to heat the doped second substrate plate in a manner that causes a portion of it to swell and form a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the thin film device. The second substrate plate is doped with at least one transition metal such that when the laser interacts with it there is an absorption of light from the laser in the second substrate plate, which leads to the formation of the hermetic seal while avoiding thermal damage to the thin-film device. Another embodiment of the hermetically sealed glass package and a method for manufacturing that hermetically sealed glass package are also described herein.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 在一个实施例中，通过提供第一基板和第二基板制造密封的玻璃封装。 第二基板包含至少一种过渡金属或稀土金属，例如铁，铜，钒，锰，钴，镍，铬，钕和/或铈。 需要保护的敏感薄膜器件沉积到第一衬底板上。 然后使用激光器以使其一部分膨胀并形成将第一衬底板连接到第二衬底板的气密密封件并且还保护薄膜器件的方式来加热掺杂的第二衬底板。 第二衬底板掺杂有至少一种过渡金属，使得当激光与其相互作用时，吸收来自第二衬底板中的激光的光，这导致气密密封的形成，同时避免对 薄膜装置。 本文还描述了密封玻璃封装的另一个实施例以及密封玻璃封装的制造方法。

公开(公告)号：US07602121B2

公开(公告)日：2009-10-13

申请号：US11228803

申请日：2005-09-16

申请人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H01J1/62

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积到第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US06998776B2

公开(公告)日：2006-02-14

申请号：US10414794

申请日：2003-04-16

申请人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H05B33/00

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.