公开(公告)号：US07407423B2

公开(公告)日：2008-08-05

申请号：US10823331

申请日：2004-04-13

申请人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H01J9/00

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积在第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US08063560B2

公开(公告)日：2011-11-22

申请号：US11521888

申请日：2006-09-15

申请人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H05B33/00

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积到第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US07602121B2

公开(公告)日：2009-10-13

申请号：US11228803

申请日：2005-09-16

申请人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H01J1/62

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积到第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US06998776B2

公开(公告)日：2006-02-14

申请号：US10414794

申请日：2003-04-16

申请人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce G. Aitken ,  Joel P. Carberry ,  Steven E. DeMartino ,  Henry E. Hagy ,  Lisa A. Lamberson ,  Richard J. Miller, II ,  Robert Morena ,  Joseph F. Schroeder, III ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H05B33/00

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

公开(公告)号：US20060009109A1

公开(公告)日：2006-01-12

申请号：US11228803

申请日：2005-09-16

申请人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H05B33/10

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

公开(公告)号：US20050001545A1

公开(公告)日：2005-01-06

申请号：US10823331

申请日：2004-04-13

申请人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C27/00 ,  C03C27/06 ,  H01L51/52 ,  H05B33/04 ,  H05B33/00

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积到第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US20070007894A1

公开(公告)日：2007-01-11

申请号：US11521888

申请日：2006-09-15

申请人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

发明人： Bruce Aitken ,  Joel Carberry ,  Steven DeMartino ,  Henry Hagy ,  Lisa Lamberson ,  Richard Miller ,  Robert Morena ,  Joseph Schroeder ,  Alexander Streltsov ,  Sujanto Widjaja

IPC分类号： H05B33/04 ,  H05B33/10 ,  H01L51/50

CPC分类号： C03C27/06 ,  C03C3/072 ,  C03C3/17 ,  C03C3/19 ,  C03C3/21 ,  C03C8/24 ,  C03C8/245 ,  C03C27/005 ,  H01L51/5246

摘要： A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

摘要翻译： 这里使用OLED显示器作为示例来描述气密密封的玻璃封装和制造密封玻璃封装的方法。 基本上，通过提供第一基板和第二基板并将玻璃料沉积到第二基板上来制造密封的OLED显示器。 OLED沉积在第一基板上。 然后使用照射源（例如，激光，红外光）来加热玻璃料，其熔化并形成将第一衬底板连接到第二衬底板并且还保护OLED的气密密封。 玻璃料是掺杂有至少一种过渡金属和可能的CTE降低填料的玻璃，使得当照射源加热玻璃料时，其软化并形成结合。 这使得玻璃料熔化并形成气密密封，同时避免对OLED的热损伤。

公开(公告)号：US20110019351A1

公开(公告)日：2011-01-27

申请号：US12922987

申请日：2009-03-30

申请人： John Frederick Bayne ,  Yabei Gu ,  Glenn Vertner Morgan ,  Butchi Reddy Vaddi ,  Jamie Todd Westbrook ,  Sujanto Widjaja

发明人： John Frederick Bayne ,  Yabei Gu ,  Glenn Vertner Morgan ,  Butchi Reddy Vaddi ,  Jamie Todd Westbrook ,  Sujanto Widjaja

IPC分类号： H05K7/00 ,  H01J5/02

CPC分类号： G02F1/133308 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/5237

摘要： Methods and assemblies related to frame or bezel packaging of a sealed glass assembly, such as a fit-sealed OLED device, such as an OLED display panel. The frame or bezel packaging may have one or more of (a) rounded or chamfered corners, (a) a cover, (b) a reinforced lead edge, (c) openings or cutouts in the back panel to conserve material and lighten the bezel, and (d) a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the back and/or sides of the frame or bezel. The frame or bezel design may include a gap between the sealed glass assembly and the back panel of the bezel. The gap may be filled at least in part with low modulus of elasticity backing material. The glass package may have one or more of (a) rounded or chamfered corners, (b) rounded or chamfered edges, (c) a low modulus of elasticity material applied around its periphery or portions of its periphery, such as on the corners only, (d) a shortened lead end, and (e) a thickened lead end.

摘要翻译： 与密封玻璃组件的框架或边框包装相关的方法和组件，例如适合密封的OLED装置，例如OLED显示面板。 框架或边框包装可以具有（a）圆形或倒角的一个或多个，（a）盖，（b）加强的引线边缘，（c）后面板中的开口或切口以节省材料并减轻边框 ，和（d）在密封的玻璃组件和框架或表圈的背面和/或侧面之间施加低弹性材料材料的吸震中间层。 框架或边框设计可以包括密封的玻璃组件和边框的后面板之间的间隙。 间隙可以至少部分地用低弹性背衬材料填充。 玻璃包装可以具有一个或多个（a）圆形或倒角，（b）圆形或倒角边缘，（c）围绕其周边或其周边部分施加的低弹性材料，例如仅在拐角上 ，（d）缩短的引线端，（e）增厚的引线端。

公开(公告)号：US07786559B2

公开(公告)日：2010-08-31

申请号：US11594487

申请日：2006-11-08

申请人： John F Bayne ,  Jamie T Westbrook ,  Sujanto Widjaja

发明人： John F Bayne ,  Jamie T Westbrook ,  Sujanto Widjaja

IPC分类号： H01L21/00

CPC分类号： B65D81/05 ,  C03C27/048 ,  H01L51/5237

摘要： Methods and assemblies relate to bezel packaging of a sealed glass assembly, such as a frit-sealed OLED device. The bezel packaging includes a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the bezel. A bonding agent, which may include the low modulus of elasticity material and/or a separate bonding material, affixes the sealed glass assembly to the bezel. Bezel modifications may be made to stabilize the bezel. Exemplary bezel modifications include reinforced bezel side walls and supporting straps attached between bezel walls. The bezel design may include a gap between the edges of the sealed glass assembly and the bezel walls, so as to avoid direct contact therewith. The gap may be filled at least in part with low modulus of elasticity organic adhesive to provide additional shock absorbency. The low modulus of elasticity material may include foam, ceramic fiber cloth and/or a low modulus of elasticity polymeric organic coating.

摘要翻译： 方法和组件涉及密封玻璃组件的边框包装，例如玻璃料密封的OLED装置。 表圈包装包括施加在密封玻璃组件和表圈之间的低弹性材料材料的减震中间层。 可以包括低弹性模量材料和/或单独的粘合材料的粘合剂将密封的玻璃组件固定在边框上。 可以进行挡板修改以使挡板稳定。 示例性的边框修改包括加强的边框侧壁和附接在边框壁之间的支撑带。 边框设计可以包括密封玻璃组件的边缘与边框壁之间的间隙，以避免与其直接接触。 间隙可以至少部分地由低弹性有机粘合剂填充以提供额外的冲击吸收性。 低弹性材料材料可以包括泡沫，陶瓷纤维布和/或低弹性聚合物有机涂层。

公开(公告)号：US07279241B2

公开(公告)日：2007-10-09

申请号：US11157305

申请日：2005-06-20

申请人： Thomas Dale Ketcham ,  Dell Joseph St Julien ,  Sujanto Widjaja ,  Scott Christopher Pollard

发明人： Thomas Dale Ketcham ,  Dell Joseph St Julien ,  Sujanto Widjaja ,  Scott Christopher Pollard

IPC分类号： H01M8/00 ,  H01M8/10 ,  H01M4/00

CPC分类号： H01M8/1226 ,  H01M8/124 ,  H01M8/1253 ,  H01M8/242 ,  H01M8/2435 ,  Y02E60/525 ,  Y02P70/56

摘要： An electrolyte sheet comprises a substantially non-porous body and has at least one stress-relief area on at least a portion of the electrolyte sheet. The stress-relief area has a surface with a plurality of folds. The plurality of folds are arranged around and directed longitudinally toward a common central area.

摘要翻译： 电解质片包括基本上无孔的主体并且在至少一部分电解质片上具有至少一个应力消除区域。 应力消除区域具有多个褶皱的表面。 多个折叠被布置成围绕并纵向朝向共同的中心区域。