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公开(公告)号:US20110095431A1
公开(公告)日:2011-04-28
申请号:US12984707
申请日:2011-01-05
申请人: Bruce K. Furman , Jae-Woong Nah
发明人: Bruce K. Furman , Jae-Woong Nah
IPC分类号: H01L23/52
CPC分类号: H01L21/6835 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/81 , H01L25/50 , H01L2224/05001 , H01L2224/05026 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05571 , H01L2224/05644 , H01L2224/11003 , H01L2224/11334 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/328 , H05K2201/0379 , H05K2201/10234 , H05K2201/10242 , H05K2201/10734 , H05K2203/0278 , H01L2924/00014 , H01L2224/13099
摘要: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.
摘要翻译: 一种电气结构和形成方法。 电结构包括第一衬底,其包括第一导电焊盘,第二衬底,其包括第二导电焊盘,以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构和第一焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 非焊接金属芯结构的第二部分被热压接合到第二导电焊盘。
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2.
公开(公告)号:US08541291B2
公开(公告)日:2013-09-24
申请号:US13159773
申请日:2011-06-14
申请人: Bruce K. Furman , Jae-Woong Nah
发明人: Bruce K. Furman , Jae-Woong Nah
CPC分类号: H05K3/3436 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05026 , H01L2224/0508 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05571 , H01L2224/05644 , H01L2224/11003 , H01L2224/11334 , H01L2224/11901 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/328 , H05K2201/0367 , H05K2201/0379 , H05K2201/10234 , H05K2201/10734 , H05K2201/10977 , H05K2203/0338 , Y02P70/613 , Y10T29/49155 , H01L2924/00014 , H01L2224/13099
摘要: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.
摘要翻译: 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底,使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。
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公开(公告)号:US08164192B2
公开(公告)日:2012-04-24
申请号:US12984707
申请日:2011-01-05
申请人: Bruce K. Furman , Jae-Woong Nah
发明人: Bruce K. Furman , Jae-Woong Nah
IPC分类号: H01L25/488
CPC分类号: H01L21/6835 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/81 , H01L25/50 , H01L2224/05001 , H01L2224/05026 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05571 , H01L2224/05644 , H01L2224/11003 , H01L2224/11334 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/328 , H05K2201/0379 , H05K2201/10234 , H05K2201/10242 , H05K2201/10734 , H05K2203/0278 , H01L2924/00014 , H01L2224/13099
摘要: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.
摘要翻译: 一种电气结构和形成方法。 电结构包括第一衬底,其包括第一导电焊盘,第二衬底,其包括第二导电焊盘,以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构和第一焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 非焊接金属芯结构的第二部分被热压接合到第二导电焊盘。
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4.
公开(公告)号:US08043893B2
公开(公告)日:2011-10-25
申请号:US11855236
申请日:2007-09-14
申请人: Bruce K. Furman , Jae-Woong Nah
发明人: Bruce K. Furman , Jae-Woong Nah
CPC分类号: H05K3/3436 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05026 , H01L2224/0508 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05571 , H01L2224/05644 , H01L2224/11003 , H01L2224/11334 , H01L2224/11901 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/328 , H05K2201/0367 , H05K2201/0379 , H05K2201/10234 , H05K2201/10734 , H05K2201/10977 , H05K2203/0338 , Y02P70/613 , Y10T29/49155 , H01L2924/00014 , H01L2224/13099
摘要: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.
摘要翻译: 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底,使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。
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5.
公开(公告)号:US20110239458A1
公开(公告)日:2011-10-06
申请号:US13159773
申请日:2011-06-14
申请人: Bruce K. Furman , Jae-Woong Nah
发明人: Bruce K. Furman , Jae-Woong Nah
IPC分类号: H05K3/10
CPC分类号: H05K3/3436 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05026 , H01L2224/0508 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05571 , H01L2224/05644 , H01L2224/11003 , H01L2224/11334 , H01L2224/11901 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/328 , H05K2201/0367 , H05K2201/0379 , H05K2201/10234 , H05K2201/10734 , H05K2201/10977 , H05K2203/0338 , Y02P70/613 , Y10T29/49155 , H01L2924/00014 , H01L2224/13099
摘要: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.
摘要翻译: 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底,使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。
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6.
公开(公告)号:US07868457B2
公开(公告)日:2011-01-11
申请号:US11855290
申请日:2007-09-14
申请人: Bruce K. Furman , Jae-Woong Nah
发明人: Bruce K. Furman , Jae-Woong Nah
IPC分类号: H01L23/488
CPC分类号: H01L21/6835 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/81 , H01L25/50 , H01L2224/05001 , H01L2224/05026 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05571 , H01L2224/05644 , H01L2224/11003 , H01L2224/11334 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/73203 , H01L2224/73204 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/328 , H05K2201/0379 , H05K2201/10234 , H05K2201/10242 , H05K2201/10734 , H05K2203/0278 , H01L2924/00014 , H01L2224/13099
摘要: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.
摘要翻译: 一种电气结构和形成方法。 电结构包括第一衬底,其包括第一导电焊盘,第二衬底,其包括第二导电焊盘,以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构和第一焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 非焊接金属芯结构的第二部分被热压接合到第二导电焊盘。
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7.
公开(公告)号:US20090075469A1
公开(公告)日:2009-03-19
申请号:US11855236
申请日:2007-09-14
申请人: Bruce K. Furman , Jae-Woong Nah
发明人: Bruce K. Furman , Jae-Woong Nah
IPC分类号: H01L21/44
CPC分类号: H05K3/3436 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05001 , H01L2224/05026 , H01L2224/0508 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05571 , H01L2224/05644 , H01L2224/11003 , H01L2224/11334 , H01L2224/11901 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/1357 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2224/73203 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H05K3/328 , H05K2201/0367 , H05K2201/0379 , H05K2201/10234 , H05K2201/10734 , H05K2201/10977 , H05K2203/0338 , Y02P70/613 , Y10T29/49155 , H01L2924/00014 , H01L2224/13099
摘要: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.
摘要翻译: 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底,使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。
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公开(公告)号:US20080251281A1
公开(公告)日:2008-10-16
申请号:US11733840
申请日:2007-04-11
CPC分类号: H01L24/16 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/28 , H01L24/31 , H01L24/73 , H01L24/81 , H01L24/94 , H01L2221/68377 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/17051 , H01L2224/274 , H01L2224/29111 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K2201/0379 , H05K2201/094 , H05K2201/10234 , H05K2201/10242 , H05K2201/10977 , Y02P70/613 , Y10T29/49165 , H01L2224/45111 , H01L2924/01047 , H01L2224/13099 , H01L2924/01083 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
摘要翻译: 一种电气结构和成型方法。 电结构包括第一衬底,其包括第一导电焊盘,第二衬底,其包括第二导电焊盘,以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构,第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。
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公开(公告)号:US08541299B2
公开(公告)日:2013-09-24
申请号:US12787527
申请日:2010-05-26
CPC分类号: H01L24/16 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/28 , H01L24/31 , H01L24/73 , H01L24/81 , H01L24/94 , H01L2221/68377 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/17051 , H01L2224/274 , H01L2224/29111 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K2201/0379 , H05K2201/094 , H05K2201/10234 , H05K2201/10242 , H05K2201/10977 , Y02P70/613 , Y10T29/49165 , H01L2224/45111 , H01L2924/01047 , H01L2224/13099 , H01L2924/01083 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
摘要翻译: 电互连形成方法。 电互连包括包括第一导电焊盘的第一衬底,包括第二导电焊盘的第二衬底以及将第一导电焊盘电连接和机械地连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构,第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。
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公开(公告)号:US20100230143A1
公开(公告)日:2010-09-16
申请号:US12787485
申请日:2010-05-26
IPC分类号: H05K1/03
CPC分类号: H01L24/16 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/28 , H01L24/31 , H01L24/73 , H01L24/81 , H01L24/94 , H01L2221/68377 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/17051 , H01L2224/274 , H01L2224/29111 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K2201/0379 , H05K2201/094 , H05K2201/10234 , H05K2201/10242 , H05K2201/10977 , Y02P70/613 , Y10T29/49165 , H01L2224/45111 , H01L2924/01047 , H01L2224/13099 , H01L2924/01083 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要: An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
摘要翻译: 一种电结构,包括包括第一导电焊盘的第一基板,包括第二导电焊盘的第二基板和将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构,第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。
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