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公开(公告)号：US11048334B2
公开(公告)日：2021-06-29
申请号：US16229765
申请日：2018-12-21
摘要： Aspects of the technology described herein relate to methods and apparatuses for identifying gestures based on ultrasound data. Performing gesture recognition may include obtaining, with a wearable device, ultrasound data corresponding to an anatomical gesture; and identifying the anatomical gesture based on the obtained ultrasound data. Interfacing with a computing device may include identifying, with a wearable device, an anatomical gesture using ultrasound data obtained by the wearable device; and causing the computing device to perform a specific function based on the anatomical gesture identified by the wearable device. Training a wearable device to perform gesture recognition may include obtaining, with the wearable device, ultrasound data corresponding to an anatomical gesture; obtaining non-ultrasound data corresponding to the anatomical gesture; and training a machine learning model accessed by the wearable device to recognize the anatomical gesture based on correlating the non-ultrasound data and the ultrasound data.
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2.发明授权公开(公告)号：US10850306B2
公开(公告)日：2020-12-01
申请号：US15905289
申请日：2018-02-26
摘要： Processes for fabricating capacitive micromachined ultrasonic transducers (CMUTs) are described, as are CMUTs of various doping configurations. An insulating layer separating conductive layers of a CMUT may be formed by forming the layer on a lightly doped epitaxial semiconductor layer. Dopants may be diffused from a semiconductor substrate into the epitaxial semiconductor layer, without diffusing into the insulating layer. CMUTs with different configurations of N-type and P-type doping are also described.
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公开(公告)号：US10710873B2
公开(公告)日：2020-07-14
申请号：US16290188
申请日：2019-03-01
发明人： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要： Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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公开(公告)号：US10706520B2
公开(公告)日：2020-07-07
申请号：US16405996
申请日：2019-05-07
发明人： Alex Rothberg , Igor Lovchinsky , Jimmy Jia , Tomer Gafner , Matthew de Jonge , Jonathan M. Rothberg
摘要： Aspects of the technology described herein relate to techniques for calculating, during imaging, a quality of a sequence of images collected during the imaging. Calculating the quality of the sequence of images may include calculating a probability that a medical professional would use a given image for clinical evaluation and a confidence that an automated analysis segmentation performed on the given image is correct. Techniques described herein also include receiving a trigger to perform an automatic measurement on a sequence of images, calculating a quality of the sequence of images, determining whether the quality of the sequence of images exceeds a threshold quality, and performing the automatic measurement on the sequence of images based on determining that the quality of the sequence of images exceeds the threshold quality.
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公开(公告)号：US20200205670A1
公开(公告)日：2020-07-02
申请号：US16728844
申请日：2019-12-27
IPC分类号： A61B5/00
摘要： Methods and apparatuses are provided for photoacoustic imaging. One such apparatus may include an ultrasound-on-a-chip device attached to a housing, an optical emitter attached to the housing, and a controller enclosed at least partially in the housing. The ultrasound-on-a-chip device may include a plurality of ultrasonic transducers. The optical emitter may include an array of diodes arranged at a periphery of the plurality of ultrasonic transducers. The controller may be configured to control the optical emitter to emit pulses of light, to control the plurality of ultrasonic transducers to detect ultrasonic waves emitted from a target to be imaged in response to exposure to the pulses of light, and to convert the ultrasonic waves to digital signals. For example, the optical emitter may be controlled to emit chirped optical pulses. The digital signals may be processed by the controller to produce image-formation data.
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公开(公告)号：US20200147641A1
公开(公告)日：2020-05-14
申请号：US16680956
申请日：2019-11-12
发明人： Keith G. Fife , Lingyun Miao , Jianwei Liu , Jonathan M. Rothberg
摘要： A method of forming an ultrasonic transducer device includes bonding a membrane to seal a transducer cavity with at least a portion of a getter material layer being exposed, the getter material layer comprising a portion of a bilayer stack compatible for use in damascene processing.
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公开(公告)号：US10518292B2
公开(公告)日：2019-12-31
申请号：US15868989
申请日：2018-01-11
发明人： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要： CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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8.发明授权公开(公告)号：US10416298B2
公开(公告)日：2019-09-17
申请号：US15273377
申请日：2016-09-22
摘要： Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transducers. The ultrasound device circuitry may facilitate the generation of ultrasound waveforms in a manner that is power- and data-efficient.
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9.发明申请公开(公告)号：US20190164956A1
公开(公告)日：2019-05-30
申请号：US16197438
申请日：2018-11-21
IPC分类号： H01L27/06 , H01L27/092 , H01L23/528 , H01L23/522 , H01L21/768 , B81C1/00 , B06B1/02 , H01L21/56 , H01L21/3213 , H01L21/8238 , A61B8/00 , B81B3/00 , B81B7/00
摘要： Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
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公开(公告)号：US10272470B2
公开(公告)日：2019-04-30
申请号：US15581511
申请日：2017-04-28
发明人： Jonathan M. Rothberg , Keith G. Fife , Tyler S. Ralston , Gregory L. Charvat , Nevada J. Sanchez
摘要： CMOS Ultrasonic Transducers and processes for making such devices are described. The processes may include forming cavities on a first wafer and bonding the first wafer to a second wafer. The second wafer may be processed to form a membrane for the cavities. Electrical access to the cavities may be provided.
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