公开(公告)号：US5837610A

公开(公告)日：1998-11-17

申请号：US805659

申请日：1997-02-27

申请人： Byoung-hun Lee ,  Joon-hee Lee

发明人： Byoung-hun Lee ,  Joon-hee Lee

IPC分类号： B24B1/00 ,  B24B37/00 ,  B24B37/20 ,  B24B37/24 ,  B24B57/02 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3105

CPC分类号： B24B57/02 ,  B24B37/04 ,  H01L21/31051

摘要： A chemical mechanical polishing (CMP) apparatus for planarizing a semiconductor wafer includes a wafer carrier for loading and fixing a semiconductor wafer to be polished and a polishing platen rotating at a constant speed, disposed at a lower portion of the wafer carrier. A polishing pad is provided on an upper surface of the polishing platen, and is in contact with a surface of the semiconductor wafer. A spiral slurry feed line supplies a slurry solution to the polishing pad. An end of the spiral slurry feed line is provided with a plurality of nozzles and the spiral slurry feed line is connected to a deionized water feed line that is opened or closed by a valve. Accordingly, abrasives are prevented from being precipitated, and the slurry solution is uniformly supplied to the semiconductor wafer, to thereby enhance polishing uniformity.

摘要翻译： 用于平坦化半导体晶片的化学机械抛光（CMP）装置包括用于加载和固定待抛光的半导体晶片的晶片载体和设置在晶片载体的下部的以恒定速度旋转的研磨平板。 抛光垫设置在研磨台板的上表面上并与半导体晶片的表面接触。 螺旋浆料进料管线将浆液提供给抛光垫。 螺旋浆料供给管线的端部设置有多个喷嘴，并且螺旋浆料进料管线连接到由阀打开或关闭的去离子水进料管线。 因此，防止了研磨剂的沉淀，将浆液溶液均匀地供给到半导体晶片，从而提高了研磨均匀性。

公开(公告)号：US5665631A

公开(公告)日：1997-09-09

申请号：US563803

申请日：1995-11-28

申请人： Byoung-hun Lee ,  Chi-jung Kang ,  Kyung-wook Lee ,  Gi-ho Cha

发明人： Byoung-hun Lee ,  Chi-jung Kang ,  Kyung-wook Lee ,  Gi-ho Cha

IPC分类号： H01L21/304 ,  H01L21/02 ,  H01L21/18 ,  H01L21/20 ,  H01L27/12 ,  H01L21/76

CPC分类号： H01L21/76256 ,  Y10S438/938

摘要： A SOI substrate manufacturing method which corrects the warpage in the SOI substrate by varying the thickness of a semiconductor material layer additionally formed over the bonded combination of a semiconductor substrate and supporting substrate.

摘要翻译： 一种SOI衬底制造方法，其通过改变在半导体衬底和支撑衬底的接合组合上附加形成的半导体材料层的厚度来校正SOI衬底中的翘曲。

公开(公告)号：US5735731A

公开(公告)日：1998-04-07

申请号：US606194

申请日：1996-02-23

申请人： Byoung-hun Lee

发明人： Byoung-hun Lee

IPC分类号： B24B37/20 ,  B24B37/22 ,  B24D9/00 ,  H01L21/304 ,  H01L21/683 ,  B24B5/00

CPC分类号： B24B37/22 ,  B24B37/26 ,  B24D13/12 ,  B24D9/00

摘要： An improved chemical mechanical polishing (CMP) device for chemically and mechanically planarizing the surface of a semiconductor wafer includes a flat wafer stage for loading and affixation of the semiconductor wafer so that the surface of a material to be polished, i.e. the surface of the wafer, faces up, and a cylindrical polishing pad formed above the exposed surface of the wafer to be polished which is rotatable at high speed so that the contact point of the wafer and the pad moves linearly. The stage is constructed to support a wafer by a vacuum suction through vacuum holes. The cylindrical polishing pad has a rotating axis for transmitting rotation at the center, thereof, and a double layer polishing pad having different hardness on a peripheral surface of the rotating axis.

摘要翻译： 用于化学和机械平面化半导体晶片的表面的改进的化学机械抛光（CMP）装置包括用于加载和固定半导体晶片的平坦晶片台，使得待抛光材料的表面，即晶片的表面 面朝上，以及形成在要被抛光的晶片的暴露表面上的高速旋转的圆柱形抛光垫，使得晶片和衬垫的接触点线性移动。 该台被构造成通过真空孔通过真空抽吸来支撑晶片。 圆筒形抛光垫具有用于在其中心传递旋转的旋转轴线和在旋转轴的圆周表面上具有不同硬度的双层抛光垫。

公开(公告)号：US07768620B2

公开(公告)日：2010-08-03

申请号：US11560616

申请日：2006-11-16

申请人： Jeong-ho Hwang ,  Ho-min Kang ,  Hee-young Park ,  Byoung-hun Lee ,  Seung-jun Lee ,  Sung-teak Choi

发明人： Jeong-ho Hwang ,  Ho-min Kang ,  Hee-young Park ,  Byoung-hun Lee ,  Seung-jun Lee ,  Sung-teak Choi

IPC分类号： G02F1/13 ,  G02F1/1335

CPC分类号： G02F1/133351 ,  G02F2202/28

摘要： A method of fabricating a light weight and small size LCD, and an LCD fabricated by the same. The method of fabricating an LCD includes providing assembled mother substrates, wherein at least one of the mother substrates includes a polarizer, a buffer layer, and a transparent film sequentially stacked on an out-side thereof, and fabricating the assembled mother substrates as individual units by cutting the assembled mother substrates into unit cells.

摘要翻译： 一种制造重量轻且尺寸小的LCD的方法，以及由其制造的LCD。 制造LCD的方法包括提供组装母基板，其中至少一个母基板包括顺序地层叠在其外侧的偏振器，缓冲层和透明膜，并且将组装的母板作为单独单元 通过将组装的母基板切割成单元电池。

公开(公告)号：US20070031997A1

公开(公告)日：2007-02-08

申请号：US11499370

申请日：2006-08-04

申请人： Byoung-hun Lee ,  Ho-min Kang ,  Hoon-kee Min ,  Jeong-ho Hwang ,  Sung-min Kim

发明人： Byoung-hun Lee ,  Ho-min Kang ,  Hoon-kee Min ,  Jeong-ho Hwang ,  Sung-min Kim

IPC分类号： H01L21/00

CPC分类号： H01L21/67363

摘要： Provided is a jig which can be used in a process of adhering a adhering object to a to-be adhered object in a vacuum atmosphere, and vacuum equipment for use in the adhering process. The jig includes a first frame and a second frame which together define a chamber for receiving the first and second objects. The first frame includes a seating portion having a plurality of seating pockets, and an actuator disposed below each of the seating pockets, the actuator being movable with respect to the seating pockets. A first elastic member is disposed in the jig below the actuator. The first elastic member being positioned such that it can contact and move the actuator in response to a change of pressure in the jig chamber. The second frame includes a second elastic member which is positioned adjacent to each of the seating pockets. The second elastic member being movable to the change of pressure in the jig chamber.

摘要翻译： 提供了一种夹具，其可用于在真空气氛中将粘附物粘附到待粘合物体的过程中，以及用于粘合过程的真空设备。 夹具包括第一框架和第二框架，第一框架和第二框架共同限定用于接收第一和第二物体的室。 第一框架包括具有多个座舱的座位部分和设置在每个座舱下方的致动器，所述致动器可相对于所述座舱口移动。 第一弹性构件设置在致动器下方的夹具中。 第一弹性构件被定位成使得其可以响应于夹具室中的压力变化而接触和移动致动器。 第二框架包括第二弹性构件，该第二弹性构件邻近每个座舱口定位。 第二弹性构件可移动到夹具室中的压力变化。

公开(公告)号：US5863375A

公开(公告)日：1999-01-26

申请号：US067821

申请日：1998-04-28

申请人： Gi-ho Cha ,  Byoung-hun Lee

发明人： Gi-ho Cha ,  Byoung-hun Lee

IPC分类号： H01L27/12 ,  B26D3/28 ,  B26F3/00 ,  B32B43/00 ,  H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/30 ,  H01L21/304 ,  H01L21/58 ,  B32B35/00

CPC分类号： B32B43/006 ,  B26D3/28 ,  B26F3/004 ,  H01L21/67092 ,  H01L24/98 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/32 ,  H01L24/83 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10S134/902 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/19 ,  Y10T29/49819 ,  Y10T29/49822 ,  Y10T29/53683

摘要： Wafer debonding of a bonded bulk wafer and a device wafer using a liquid jet to avoid scratching of the wafers is provided. The wafer debonder includes a wafer loader having a first stand with a flat upper surface and a second stand located above the first stand having a lower surface slanted with respect to the upper surface of the first stand at a predetermined angle. A first holder is connected to the first stand and a second holder is located on an imaginary surface extended from the lower surface of the second stand for holding the wafers. A liquid jetting nozzle is positioned adjacent the wafer loader to direct a jet of liquid at the interface between the wafers to separate the wafers.

摘要翻译： 提供了使用液体射流的粘合体晶片和器件晶片的晶片剥离以避免晶片的划伤。 晶片剥离器包括具有平坦的上表面的第一支架和位于第一支架上方的第二支架的晶片装载器，其具有相对于第一支架的上表面以预定角度倾斜的下表面。 第一保持器连接到第一支架，并且第二保持器位于从第二支架的下表面延伸的假想表面上，用于保持晶片。 液体喷射喷嘴位于晶片装载器附近，以在晶片之间的界面处引导液体射流以分离晶片。

公开(公告)号：US5783022A

公开(公告)日：1998-07-21

申请号：US742938

申请日：1996-10-31

申请人： Gi-ho Cha ,  Byoung-hun Lee

发明人： Gi-ho Cha ,  Byoung-hun Lee

IPC分类号： H01L27/12 ,  B26D3/28 ,  B26F3/00 ,  B32B43/00 ,  H01L21/00 ,  H01L21/02 ,  H01L21/20 ,  H01L21/30 ,  H01L21/304 ,  H01L21/58 ,  B32B35/00

CPC分类号： B32B43/006 ,  B26D3/28 ,  B26F3/004 ,  H01L21/67092 ,  H01L24/98 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/32 ,  H01L24/83 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10S134/902 ,  Y10S156/941 ,  Y10T156/11 ,  Y10T156/1126 ,  Y10T156/19 ,  Y10T29/49819 ,  Y10T29/49822 ,  Y10T29/53683

摘要： Wafer debonding of a bonded bulk wafer and a device wafer using a liquid jet to avoid scratching of the wafers is provided. The wafer debonder includes a wafer loader having a first stand with a flat upper surface and a second stand located above the first stand having a lower surface slanted with respect to the upper surface of the first stand at a predetermined angle. A first holder is connected to the first stand and a second holder is located on an imaginary surface extended from the lower surface of the second stand for holding the wafers. A liquid jetting nozzle is positioned adjacent the wafer loader to direct a jet of liquid at the interface between the wafers to separate the wafers.