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公开(公告)号:US20130249066A1
公开(公告)日:2013-09-26
申请号:US13427940
申请日:2012-03-23
申请人: CHARLES L. ARVIN , KENNETH BIRD , CHARLES C. GOLDSMITH , SUNG K. KANG , MINHUA LU , CLARE JOHANNA MCCARTHY , ERIC DANIEL PERFECTO , SRINIVASA S.N. REDDY , KRYSTYNA WALERIA SEMKOW , THOMAS ANTHONY WASSICK
发明人: CHARLES L. ARVIN , KENNETH BIRD , CHARLES C. GOLDSMITH , SUNG K. KANG , MINHUA LU , CLARE JOHANNA MCCARTHY , ERIC DANIEL PERFECTO , SRINIVASA S.N. REDDY , KRYSTYNA WALERIA SEMKOW , THOMAS ANTHONY WASSICK
IPC分类号: H01L23/495 , H01L21/28
CPC分类号: H01L21/7685 , H01L21/321 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/742 , H01L24/81 , H01L2224/0382 , H01L2224/0401 , H01L2224/11003 , H01L2224/11005 , H01L2224/1111 , H01L2224/1131 , H01L2224/11462 , H01L2224/1147 , H01L2224/1184 , H01L2224/11849 , H01L2224/11903 , H01L2224/13017 , H01L2224/13027 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13562 , H01L2224/13566 , H01L2224/1357 , H01L2224/136 , H01L2224/16225 , H01L2224/16227 , H01L2224/81191 , H01L2224/81801 , H01L2924/181 , H01L2924/01028 , H01L2924/014 , H01L2924/01047 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要: Embodiments of the invention include a lead-free solder interconnect structure and methods for making a lead-free interconnect structure. The structure includes a semiconductor substrate having a last metal layer, a copper pedestal attached to the last metal layer, a barrier layer attached to the copper pedestal, a barrier protection layer attached to the barrier layer, and a lead-free solder layer contacting at least one side of the copper pedestal.