公开(公告)号：US6362959B2

公开(公告)日：2002-03-26

申请号：US78514801

申请日：2001-02-16

Applicant: COMPAQ COMPUTER CORP

Inventor： TRACY MARK S

IPC: G06F1/16 ,  G06F1/20

CPC classification number: G06F1/1632 ,  G06F1/203

Abstract: A portable computer docking base has incorporated therein a thermoelectric cooling system used to provide auxiliary operating heat dissipation for a portable notebook computer operatively docked to the base. The cooling system includes a thermoelectric (Peltier effect) heat pump unit disposed within the docking base housing and having opposite hot and cold sides. A finned heat sink member is secured to the hot side of the assembly and positioned in the path of fan-generated cooling air, and a heat slug member is secured to the cold side of the assembly and projects outwardly through an exterior wall of the docking base housing into its computer receiving area. When the computer is placed in the receiving area and docked, the cooling system heat slug member is brought into heat conductive contact with a similar heat slug member carried within the computer and thermally coupled to its microprocessor. Operating heat from the microprocessor is transferred through the contacting heat slugs, passes through the thermoelectric heat pump assembly to its hot side heat sink, and is dissipated from the heat sink to the cooling air flow within the docking base.

Abstract translation: 便携式计算机对接基座内装有热电冷却系统，用于为可操作地对接到基座的便携式笔记本电脑提供辅助工作散热。 冷却系统包括设置在对接基座壳体内并具有相对的冷热侧的热电（珀耳帖效应）热泵单元。 翅片式散热构件固定在组件的热侧并且定位在风扇产生的冷却空气的路径中，并且散热构件固定到组件的冷侧并通过对接的外壁向外突出 基座壳体进入其计算机接收区域。 当计算机被放置在接收区域并对接时，冷却系统加热块构件与计算机内携带的类似热块构件导热接触，并与其微处理器热耦合。 来自微处理器的工作热量通过接触的热段传递，通过热电热泵组件到其热侧散热器，并从散热器散发到对接基座内的冷却空气流。