摘要:
This invention relates to hot melt adhesives comprising a high molecular weight polystyrene-ethylene/butylene-polystyrene block copolymer and articles constructed therefrom. This polymer is useful in a variety of hot melt adhesive applications such as food packaging adhesives, rodent traps, skin attachment adhesives, positioning adhesives, diaper tapes, low tack diaper fastening systems, foam in place gaskets, etc.
摘要:
The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.
摘要:
The invention is directed to a radiation curable adhesive composition comprising at least one vinyl modified block copolymer having a first polyvinyl aromatic block and a second polydiene block having vinyl functionality, and at least one tackifier. Optionally, the composition may comprises at least one second block copolymer that has not been vinyl modified, at least one platicizer, and at least one wax. The invention is also directed to a double-faced label formed from the composition and the method of producing said label.
摘要:
A polymeric composition in pellet form comprising a tacky hot melt composition, comprising a) from about 5% by weight to about 90% by weight of a thermoplastic polymer, b) from about 0% by weight to about 65% by weight of a tackifying resin, c) from about 0% to about 50% by weight of a plasticizer, d) up to about 2% by weight of an antioxidant, and a pelletizing aid, wherein the tacky hot melt composition has some minimum amount of tackifier or plasticizer and is a pressure sensitive adhesive having a storage modulus, G', at about 25.degree. C., of less than about 5.times.10.sup.6 dynes/cm.sup.2, and each pellet has a substantially tack-free surface.This invention further discloses a polymeric composition in pellet form suitable for molding articles. The composition comprises a tacky hot melt composition comprising at least one high molecular weight triblock copolymer of the general configuration A-B-A and a plasticizer and a pelletizing aid. The pelletizing aid substantially surrounds the tacky composition such that the molded articles are substantially free from surface tack.A method of forming the pellets is also disclosed.
摘要翻译:颗粒形式的聚合物组合物包含粘性热熔组合物,其包含a)约5重量%至约90重量%的热塑性聚合物,b)约0重量%至约65重量%的增粘剂 树脂,c)约0重量%至约50重量%的增塑剂,d)至多约2重量%的抗氧化剂和造粒助剂,其中该粘性热熔组合物具有一些最小量的增粘剂或增塑剂 并且是在约25℃下具有小于约5×10 6达因/ cm 2的储能模量G'的压敏粘合剂,并且每个颗粒具有基本上无粘性的表面。 本发明还公开了一种适于模制制品的颗粒形式的聚合物组合物。 该组合物包含粘性热熔组合物,其包含至少一种通式A-B-A的高分子量三嵌段共聚物和增塑剂和造粒助剂。 造粒助剂基本上包围粘性组合物,使得模塑制品基本上没有表面粘性。 还公开了一种形成颗粒的方法。
摘要:
A polymeric composition in pellet form comprising a tacky hot melt composition, comprising a) from about 5% by weight to about 90% by weight of a thermoplastic polymer, b) from about 0% by weight to about 65% by weight of a tackifying resin, c) from about 0% to about 50% by weight of a plasticizer, d) up to about 2% by weight of an antioxidant, and a pelletizing aid, wherein the tacky hot melt composition has some minimum amount of tackifier or plasticizer and is a pressure sensitive adhesive having a storage modulus, G', at about 25.degree. C., of less than about 5.times.10.sup.6 dynes/cm.sup.2, and each pellet has a substantially tack-free surface.This invention further discloses a polymeric composition in pellet form suitable for molding articles. The composition comprises a tacky hot melt composition comprising at least one high molecular weight triblock copolymer of the general configuration A-B-A and a plasticizer and a pelletizing aid. The pelletizing aid substantially surrounds the tacky composition such that the molded articles are substantially free from surface tack.A method of forming the pellets is also disclosed.
摘要:
This invention relates to an envelope coated with a hot melt pressure sensitive adhesive composition preferably comprising a) from about 10% to about 40% by weight in the adhesive of at least one block copolymer selected from the group consisting of styrene-isoprene-styrene block copolymers, styrene-butadiene-styrene block copolymers and mixtures thereof wherein the block copolymers comprise from about 15% to about 35% styrene by weight in the copolymer and diblock contents from about 0% to about 90% by weight in the copolymer; and b) from about 60% to about 90% by weight in the adhesive of a modifier selected from the group consisting of solid tackifying resins, liquid tackifying resins, liquid elastomers and mixtures thereof. The invention further relates to an improved oil-free pressure sensitive adhesive that is low in viscosity and provides a destructive bond and resists deformation of high density spun polyolefin materials.
摘要:
The invention relates to a PSA hot melt composition that exhibits adhesive stability when exposed to ultraviolet light and is stable when contacted with plasticized surfaces.
摘要:
Disclosed are adhesives and processes for preparing the same, comprising at least one first homogeneous ethylene/α-olefin interpolymer, and optionally at least one tackifier, and optionally at least one plasticizer. The claimed adhesives are useful as adhesives such as are employed in various applications, such as in masking tape, clear office tape, labels, decals, bandages, decorative and protective sheets (such as shelf and drawer liners), floor tiles, sanitary napkin/incontinence device placement strips, sun control films, the joining of gaskets to automobile windows, packaging, bookbinding, construction of nonwoven articles, and insulation bonding.
摘要:
An improved hot melt adhesive with low self-adhesion. The adhesive is useful for disposable articles and employs a S-EB-S block copolymer. The adhesive does not require a release liner and has superior stay-in-place properties.
摘要:
The present invention is a hot melt adhesive composition comprising at least one ingredient present in an encapsulated form. The encapsulated ingredient may be any known hot melt adhesive formulation ingredient as well as any hot melt adhesive additive such as antioxidants and fragrances for which there is a desirable change in adhesive properties by isolating such ingredient for a duration of time. The encapsulated ingredient is released from the shell by means of pressure, temperature, diffusion, pH, light, radiation, ultrasound, and combinations thereof. Hot melt adhesive compositions comprising at least one encapsulated ingredient are useful for a variety of novel products including self-supported friction glue sticks, non-tacky pelletized pressure sensitive adhesives, cohesive adhesive systems, hot melt adhesive compositions exhibiting improved thermal stability and odor, as well as for a variety of other adhesive applications.