Polymeric composition in pellet form
    4.
    发明授权
    Polymeric composition in pellet form 有权
    颗粒形式的聚合物组合物

    公开(公告)号:US5942569A

    公开(公告)日:1999-08-24

    申请号:US143757

    申请日:1998-08-31

    摘要: A polymeric composition in pellet form comprising a tacky hot melt composition, comprising a) from about 5% by weight to about 90% by weight of a thermoplastic polymer, b) from about 0% by weight to about 65% by weight of a tackifying resin, c) from about 0% to about 50% by weight of a plasticizer, d) up to about 2% by weight of an antioxidant, and a pelletizing aid, wherein the tacky hot melt composition has some minimum amount of tackifier or plasticizer and is a pressure sensitive adhesive having a storage modulus, G', at about 25.degree. C., of less than about 5.times.10.sup.6 dynes/cm.sup.2, and each pellet has a substantially tack-free surface.This invention further discloses a polymeric composition in pellet form suitable for molding articles. The composition comprises a tacky hot melt composition comprising at least one high molecular weight triblock copolymer of the general configuration A-B-A and a plasticizer and a pelletizing aid. The pelletizing aid substantially surrounds the tacky composition such that the molded articles are substantially free from surface tack.A method of forming the pellets is also disclosed.

    摘要翻译: 颗粒形式的聚合物组合物包含粘性热熔组合物,其包含a)约5重量%至约90重量%的热塑性聚合物,b)约0重量%至约65重量%的增粘剂 树脂,c)约0重量%至约50重量%的增塑剂,d)至多约2重量%的抗氧化剂和造粒助剂,其中该粘性热熔组合物具有一些最小量的增粘剂或增塑剂 并且是在约25℃下具有小于约5×10 6达因/ cm 2的储能模量G'的压敏粘合剂,并且每个颗粒具有基本上无粘性的表面。 本发明还公开了一种适于模制制品的颗粒形式的聚合物组合物。 该组合物包含粘性热熔组合物,其包含至少一种通式A-B-A的高分子量三嵌段共聚物和增塑剂和造粒助剂。 造粒助剂基本上包围粘性组合物,使得模塑制品基本上没有表面粘性。 还公开了一种形成颗粒的方法。

    Hot melt pressure sensitive adhesive designed for use on high density
spun polyolefin film
    6.
    发明授权
    Hot melt pressure sensitive adhesive designed for use on high density spun polyolefin film 失效
    设计用于高密度聚丙烯薄膜的热熔压敏胶

    公开(公告)号:US5869562A

    公开(公告)日:1999-02-09

    申请号:US829712

    申请日:1997-03-28

    CPC分类号: C09J153/02

    摘要: This invention relates to an envelope coated with a hot melt pressure sensitive adhesive composition preferably comprising a) from about 10% to about 40% by weight in the adhesive of at least one block copolymer selected from the group consisting of styrene-isoprene-styrene block copolymers, styrene-butadiene-styrene block copolymers and mixtures thereof wherein the block copolymers comprise from about 15% to about 35% styrene by weight in the copolymer and diblock contents from about 0% to about 90% by weight in the copolymer; and b) from about 60% to about 90% by weight in the adhesive of a modifier selected from the group consisting of solid tackifying resins, liquid tackifying resins, liquid elastomers and mixtures thereof. The invention further relates to an improved oil-free pressure sensitive adhesive that is low in viscosity and provides a destructive bond and resists deformation of high density spun polyolefin materials.

    摘要翻译: 本发明涉及涂覆有热熔压敏粘合剂组合物的外壳,优选地包含a)粘合剂中约10%至约40%重量的至少一种选自苯乙烯 - 异戊二烯 - 苯乙烯嵌段 共聚物,苯乙烯 - 丁二烯 - 苯乙烯嵌段共聚物及其混合物,其中嵌段共聚物在共聚物中包含约15重量%至约35重量%的苯乙烯,在共聚物中包含约0重量%至约90重量%的二嵌段含量; 和b)在选自固体增粘树脂,液体增粘树脂,液体弹性体及其混合物的改性剂的粘合剂中约60重量%至约90重量%。 本发明还涉及一种改进的无油压敏粘合剂,该粘合剂具有低粘度并提供破坏性粘合并且抵抗高密度纺丝聚烯烃材料的变形。

    Hot melt adhesive comprising an encapsulated ingredient
    10.
    发明授权
    Hot melt adhesive comprising an encapsulated ingredient 失效
    包含封装成分的热熔粘合剂

    公开(公告)号:US6084010A

    公开(公告)日:2000-07-04

    申请号:US128135

    申请日:1998-08-03

    摘要: The present invention is a hot melt adhesive composition comprising at least one ingredient present in an encapsulated form. The encapsulated ingredient may be any known hot melt adhesive formulation ingredient as well as any hot melt adhesive additive such as antioxidants and fragrances for which there is a desirable change in adhesive properties by isolating such ingredient for a duration of time. The encapsulated ingredient is released from the shell by means of pressure, temperature, diffusion, pH, light, radiation, ultrasound, and combinations thereof. Hot melt adhesive compositions comprising at least one encapsulated ingredient are useful for a variety of novel products including self-supported friction glue sticks, non-tacky pelletized pressure sensitive adhesives, cohesive adhesive systems, hot melt adhesive compositions exhibiting improved thermal stability and odor, as well as for a variety of other adhesive applications.

    摘要翻译: 本发明是一种热熔粘合剂组合物,其包含至少一种以胶囊形式存在的成分。 包封的成分可以是任何已知的热熔粘合剂制剂成分以及任何热熔粘合剂添加剂,例如抗氧化剂和香料,通过在一段时间内分离这些成分,粘合性能有所希望的变化。 封装的成分通过压力,温度,扩散,pH,光,辐射,超声及其组合从壳中释放。 包含至少一种封装成分的热熔粘合剂组合物可用于各种新产品,包括自支撑摩擦胶棒,非粘性颗粒状压敏粘合剂,粘性粘合剂体系,显示出改善的热稳定性和气味的热熔粘合剂组合物,如 以及各种其他粘合剂应用。