公开(公告)号：US4875989A

公开(公告)日：1989-10-24

申请号：US283036

申请日：1988-12-05

申请人： Cecil J. Davis ,  Robert T. Matthews ,  Lee M. Loewenstein ,  Joe V. Abernathy ,  Timothy A. Wooldridge

发明人： Cecil J. Davis ,  Robert T. Matthews ,  Lee M. Loewenstein ,  Joe V. Abernathy ,  Timothy A. Wooldridge

IPC分类号： G03F7/16 ,  H01L21/00

CPC分类号： H01L21/67017 ,  G03F7/168

摘要： A processing apparatus and method for edge-preferential processing of partially fabricated integrated circuit wafers or of other substantially flat and thin workpieces. A plasma remote from the workpiece is used to generate activated species, and a baffle which is in proximity to the wafer face but not in contact with it is used to direct the stream of activated species. This module can be set up to perform both edge bead removal and bake of spun-on photoresist.

摘要翻译： 一种用于部分制造的集成电路晶片或其它基本上平坦和薄的工件的边缘优先处理的处理装置和方法。 使用远离工件的等离子体产生活化物质，并且靠近晶片表面而不与其接触的挡板用于引导活化物质流。 该模块可以设置为执行旋转光刻胶的边缘珠去除和烘烤。