公开(公告)号：US20070120234A1

公开(公告)日：2007-05-31

申请号：US11603839

申请日：2006-11-24

申请人： Chang Kim ,  Yoon Han ,  Young Song ,  Byung Kim ,  Jae Roh ,  Seong Hong

发明人： Chang Kim ,  Yoon Han ,  Young Song ,  Byung Kim ,  Jae Roh ,  Seong Hong

IPC分类号： H01L23/495

CPC分类号： H01L33/62 ,  G02B6/0073 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/4554

摘要： A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

摘要翻译： 一种用于背光单元的侧视图LED封装包括具有一倾斜内侧壁的空腔的封装主体，布置在封装主体中的第一和第二引线框架，该封装体的空腔暴露了第一和第二引线框架中的至少一个的一部分， 第二引线框架放置在腔的底部到外部，安装在腔的底部上以电连接到第一引线框架和第二引线框架的发光二极管芯片，以及布置在围绕发光二极管的空腔中的透明密封剂 芯片。 空腔的深度大于发光二极管芯片的安装高度，不超过安装高度的六倍。 侧壁的高度被缩短以改善发射光的束角特性，增加光量，并防止侧壁的模制缺陷。

公开(公告)号：US20070018191A1

公开(公告)日：2007-01-25

申请号：US11490233

申请日：2006-07-21

申请人： Jae Roh ,  Seong Hong ,  Chang Kim ,  Young Song ,  Yoon Han

发明人： Jae Roh ,  Seong Hong ,  Chang Kim ,  Young Song ,  Yoon Han

IPC分类号： H01L33/00

CPC分类号： H01L25/167 ,  G02B6/0073 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2924/181 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A side view LED includes an insulating substrate, and first and second metal layers each having first and second areas spaced apart from each other at a predetermined gap and disposed on top and underside surfaces of the insulating substrate, respectively. First and second electrical connectors are formed in a thickness direction of the insulating substrate, connecting the first area of the first metal layer to that of the second metal layer, and the second area of the first metal layer to that of the second metal layer. An LED chip is mounted on the first metal layer and electrically connected to the first and second areas. Also, a wall part is attached to the first metal layer to form an opened area around the LED chip. A protective device is mounted on an underside surface of the second metal layer and electrically connected to the first and second areas.

摘要翻译： 侧视图LED包括绝缘基板，以及第一和第二金属层，每个第一和第二金属层分别具有以预定间隙彼此间隔开的第一和第二区域，并且分别设置在绝缘基板的顶表面和下表面上。 第一和第二电连接器形成在绝缘基板的厚度方向上，将第一金属层的第一区域与第二金属层的第一区域连接，将第一金属层的第二区域连接到第二金属层的第二区域。 LED芯片安装在第一金属层上并电连接到第一和第二区域。 此外，壁部附接到第一金属层以在LED芯片周围形成开放区域。 保护装置安装在第二金属层的下表面上并电连接到第一和第二区域。

公开(公告)号：US20060070576A1

公开(公告)日：2006-04-06

申请号：US11266366

申请日：2005-11-04

申请人： Ki Kim ,  Yoon Han ,  Yoon Tak

发明人： Ki Kim ,  Yoon Han ,  Yoon Tak

IPC分类号： C23C16/00

CPC分类号： C23C14/12 ,  C23C14/243 ,  C23C14/543 ,  H01L51/56

摘要： The present invention disclosed the deposition source installed in a chamber, heated by applied electric power to transfer heat to a vapor deposition material received therein and applying a vaporized deposition material generated therein to a substrate to form deposition organic electroluminescent layers onto the substrate, and comprising a vessel consisted of a top plate on which a vapor efflux aperture is formed, a side wall, and a bottom wall; a heating means for supplying heat to the deposition material received in the vessel, the heating means being capable of moving vertically; and a means for moving the heating means (or the bottom wall), the moving means (or the bottom wall) being operated in response to the signal of a sensing means on varied distances between the heating means and the surface of said deposition material. Thus, the heating means is moved downward (or the bottom wall) is moved upward by the moving means to maintain the distance between the heating means (or the substrate to be coated) and the surface of the deposition material at an initially-set value when the thickness of the deposition material is decreased.

摘要翻译： 本发明公开了安装在室中的沉积源，其通过施加的电力加热，以将热量传递到容纳在其中的气相沉积材料，并将其中产生的汽化沉积材料施加到衬底上以在衬底上形成沉积有机电致发光层，并且包括 一个容器由一个形成有蒸汽流出孔的顶板，一个侧壁和一个底壁组成; 加热装置，用于向容纳在容器中的沉积材料供热，所述加热装置能够垂直移动; 以及用于移动加热装置（或底壁）的装置，移动装置（或底壁）响应感测装置的信号在加热装置和所述沉积材料的表面之间的不同距离上被操作。 因此，加热装置向下移动（或底壁）通过移动装置向上移动，以将加热装置（或待涂覆的基板）与沉积材料的表面之间的距离保持在初始设定值 当沉积材料的厚度减小时。