III-Nitride devices with recessed gates
    1.
    发明授权
    III-Nitride devices with recessed gates 有权
    具有凹槽的III型氮化物器件

    公开(公告)号:US07939391B2

    公开(公告)日:2011-05-10

    申请号:US12816971

    申请日:2010-06-16

    IPC分类号: H01L21/338

    摘要: III-nitride devices are described with recessed gates. In some embodiments, the material around the gates is formed by epitaxially depositing different III-nitride layers on a substrate and etching through at least the top two layers in the gate region. Because adjacent layers in the top three layers of the structure have different compositions, some of the layers act as etch stops to allow for precision etching. In some embodiments, a regrowth mask is used to prevent growth of material in the gate region. A gate electrode is deposited in the recess.

    摘要翻译: III型氮化物器件用凹入栅极描述。 在一些实施例中,围绕栅极的材料通过在衬底上外延沉积不同的III族氮化物层并且蚀刻至少栅极区域中的顶部两层来形成。 因为结构的顶部三层中的相邻层具有不同的组成,所以一些层用作蚀刻停止以允许精密蚀刻。 在一些实施例中,再生长掩模用于防止栅极区域中材料的生长。 栅电极沉积在凹槽中。

    III-Nitride Devices with Recessed Gates
    3.
    发明申请
    III-Nitride Devices with Recessed Gates 有权
    具有嵌入式门的III型氮化物器件

    公开(公告)号:US20090072240A1

    公开(公告)日:2009-03-19

    申请号:US12102340

    申请日:2008-04-14

    IPC分类号: H01L29/778 H01L21/338

    摘要: III-nitride devices are described with recessed gates. In some embodiments, the material around the gates is formed by epitaxially depositing different III-nitride layers on a substrate and etching through at least the top two layers in the gate region. Because adjacent layers in the top three layers of the structure have different compositions, some of the layers act as etch stops to allow for precision etching. In some embodiments, a regrowth mask is used to prevent growth of material in the gate region. A gate electrode is deposited in the recess.

    摘要翻译: III型氮化物器件用凹入栅极描述。 在一些实施例中,围绕栅极的材料通过在衬底上外延沉积不同的III族氮化物层并且蚀刻至少栅极区域中的顶部两层来形成。 因为结构的顶部三层中的相邻层具有不同的组成,所以一些层用作蚀刻停止以允许精密蚀刻。 在一些实施例中,再生长掩模用于防止栅极区域中材料的生长。 栅电极沉积在凹槽中。

    III-NITRIDE DEVICES WITH RECESSED GATES
    4.
    发明申请
    III-NITRIDE DEVICES WITH RECESSED GATES 有权
    具有接收器门的III-NITRIDE器件

    公开(公告)号:US20100255646A1

    公开(公告)日:2010-10-07

    申请号:US12816971

    申请日:2010-06-16

    IPC分类号: H01L21/335

    摘要: III-nitride devices are described with recessed gates. In some embodiments, the material around the gates is formed by epitaxially depositing different III-nitride layers on a substrate and etching through at least the top two layers in the gate region. Because adjacent layers in the top three layers of the structure have different compositions, some of the layers act as etch stops to allow for precision etching. In some embodiments, a regrowth mask is used to prevent growth of material in the gate region. A gate electrode is deposited in the recess.

    摘要翻译: III型氮化物器件用凹入栅极描述。 在一些实施例中,围绕栅极的材料通过在衬底上外延沉积不同的III族氮化物层并且蚀刻至少栅极区域中的顶部两层来形成。 因为结构的顶部三层中的相邻层具有不同的组成,所以一些层用作蚀刻停止以允许精密蚀刻。 在一些实施例中,再生长掩模用于防止栅极区域中材料的生长。 栅电极沉积在凹槽中。

    III-nitride devices with recessed gates
    6.
    发明授权
    III-nitride devices with recessed gates 有权
    具有凹入栅极的III族氮化物器件

    公开(公告)号:US07795642B2

    公开(公告)日:2010-09-14

    申请号:US12102340

    申请日:2008-04-14

    IPC分类号: H01L31/0328

    摘要: III-nitride devices are described with recessed gates. In some embodiments, the material around the gates is formed by epitaxially depositing different III-nitride layers on a substrate and etching through at least the top two layers in the gate region. Because adjacent layers in the top three layers of the structure have different compositions, some of the layers act as etch stops to allow for precision etching. In some embodiments, a regrowth mask is used to prevent growth of material in the gate region. A gate electrode is deposited in the recess.

    摘要翻译: III型氮化物器件用凹入栅极描述。 在一些实施例中,围绕栅极的材料通过在衬底上外延沉积不同的III族氮化物层并且蚀刻至少栅极区域中的顶部两层来形成。 因为结构的顶部三层中的相邻层具有不同的组成,所以一些层用作蚀刻停止以允许精密蚀刻。 在一些实施例中,再生长掩模用于防止栅极区域中材料的生长。 栅电极沉积在凹槽中。

    P-GaN/AlGaN/AlN/GaN enhancement-mode field effect transistor
    7.
    发明授权
    P-GaN/AlGaN/AlN/GaN enhancement-mode field effect transistor 有权
    P-GaN / AlGaN / AlN / GaN增强型场效应晶体管

    公开(公告)号:US07728356B2

    公开(公告)日:2010-06-01

    申请号:US12131704

    申请日:2008-06-02

    IPC分类号: H01L29/778

    摘要: An enhancement mode High Electron Mobility Transistor (HEMT) comprising a p-type nitride layer between the gate and a channel of the HEMT, for reducing an electron population under the gate. The HEMT may also comprise an Aluminum Nitride (AlN) layer between an AlGaN layer and buffer layer of the HEMT to reduce an on resistance of a channel.

    摘要翻译: 一种增强型高电子迁移率晶体管(HEMT),其包括在HEMT的栅极和沟道之间的p型氮化物层,用于减少栅极下的电子群。 HEMT还可以在AlGaN层和HEMT的缓冲层之间包含氮化铝(AlN)层,以降低通道的导通电阻。

    METHOD TO FABRICATE III-N SEMICONDUCTOR DEVICES ON THE N-FACE OF LAYERS WHICH ARE GROWN IN THE III-FACE DIRECTION USING WAFER BONDING AND SUBSTRATE REMOVAL
    9.
    发明申请
    METHOD TO FABRICATE III-N SEMICONDUCTOR DEVICES ON THE N-FACE OF LAYERS WHICH ARE GROWN IN THE III-FACE DIRECTION USING WAFER BONDING AND SUBSTRATE REMOVAL 审中-公开
    使用波形焊接和基板去除在III面形成的层的N面上制造III-N半导体器件的方法

    公开(公告)号:US20090085065A1

    公开(公告)日:2009-04-02

    申请号:US12059907

    申请日:2008-03-31

    摘要: A method for fabricating III-N semiconductor devices on the N-face of layers comprising (a) growing a III-nitride semiconductor device structure in a Ga-polar direction on a substrate, (b) attaching a Ga face of the III-nitride semiconductor device structure to a host substrate, and (c) removing the substrate to expose the N-face surface of the III-nitride semiconductor device structure. An N-polar (000-1) oriented III-nitride semiconductor device is also disclosed, comprising one or more (000-1) oriented nitride layers, each having an N-face opposite a group III-face, wherein at least one N-face is an at least partially exposed N-face, and a host substrate attached to one of the group III-faces.

    摘要翻译: 一种用于在层的N面上制造III-N半导体器件的方法,包括(a)在衬底上生长Ga极性方向上的III族氮化物半导体器件结构,(b)将III族氮化物的Ga面 半导体器件结构,以及(c)去除衬底以露出III族氮化物半导体器件结构的N面。 还公开了一种N极(000-1)取向的III族氮化物半导体器件,其包括一个或多个(000-1)取向的氮化物层,每个具有与III族面相反的N面,其中至少一个N 表面是至少部分暴露的N面,以及附着到III组面中的一个的主体衬底。

    APPARATUS FOR PREVENTING VEHICLE TRAY FROM BEING OPENED BY INERTIA LOAD
    10.
    发明申请
    APPARATUS FOR PREVENTING VEHICLE TRAY FROM BEING OPENED BY INERTIA LOAD 失效
    用于防止车载托盘从装置开启的装置

    公开(公告)号:US20090038225A1

    公开(公告)日:2009-02-12

    申请号:US11942567

    申请日:2007-11-19

    申请人: Chang Soo Suh

    发明人: Chang Soo Suh

    IPC分类号: E05F1/08

    摘要: An apparatus for preventing a lid from being undesirably opened. The lid is rotatably coupled to a vehicle tray. The apparatus includes a spring provided under the vehicle tray; and a stopper provided under the vehicle tray. The stopper is coupled at one end to the spring, so that, when a force greater than a predetermined force is applied to the stopper in a direction away from the spring, the stopper overcomes the elastic force of the spring and slides to a position at which it prevents the lid from opening. One-way sliding sawteeth are provided on a lower surface of the vehicle tray and on an upper surface of the stopper. The sawteeth engage with each other when the stopper slides to the position at which it prevents the lid from opening, such that the stopper is prevented from returning to its original position.

    摘要翻译: 一种用于防止盖不期望地打开的装置。 盖可旋转地联接到车辆托盘。 该装置包括设置在车辆托盘下方的弹簧; 以及设置在车辆托盘下方的止动件。 止动器的一端连接到弹簧,使得当大于预定的力的力沿着远离弹簧的方向施加到止动件上时,止动器克服弹簧的弹力并滑动到 这防止盖子打开。 单向滑动锯条设置在车辆托盘的下表面和止动件的上表面上。 当止动件滑动到防止盖打开的位置时,锯齿彼此接合,从而防止止动件返回到其初始位置。