Method of manufacturing ultrasound transducer device having acoustic backing
    1.
    发明申请
    Method of manufacturing ultrasound transducer device having acoustic backing 有权
    制造具有声学背衬的超声波换能器装置的方法

    公开(公告)号:US20050046311A1

    公开(公告)日:2005-03-03

    申请号:US10960871

    申请日:2004-10-06

    摘要: An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译: 一种超声波换能器装置,包括:微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征,例如突片或凹口,用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄,以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配,以便防止在向后传播的任何声能的界面处的反射,即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    Backing material for micromachined ultrasonic transducer devices
    3.
    发明申请
    Backing material for micromachined ultrasonic transducer devices 审中-公开
    用于微加工超声波换能器的支撑材料

    公开(公告)号:US20050043628A1

    公开(公告)日:2005-02-24

    申请号:US10959343

    申请日:2004-10-06

    摘要: An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.

    摘要翻译: 一种超声波换能器装置,包括:微机械加工在基底上的超声换能器阵列; 连接到换能器阵列的柔性电连接; 以及支撑衬底和柔性电连接的声衰减材料体。 声学衬垫材料可以包含附加特征,例如突片或凹口,用于在最终组装期间制造或将换能器定位在壳体内时将换能器定位在固定装置上。 仅在制造期间使用的标签或其它特征可随后从装置中移除。 MUT设备本身也可以被减薄,以便根据需要提供灵活性。 背衬材料优选地与硅晶片的声阻抗匹配,以便防止在向后传播的任何声能的界面处的反射,即远离器件前表面的方向上的反射。 背衬材料还可以具有高热导率以帮助从装置移除热量。

    Ultrasound transducer with additional sensors
    4.
    发明申请
    Ultrasound transducer with additional sensors 审中-公开
    超声波换能器附加传感器

    公开(公告)号:US20060004290A1

    公开(公告)日:2006-01-05

    申请号:US10881986

    申请日:2004-06-30

    IPC分类号: A61B8/14

    摘要: The present technique provides for the manufacture and/or use of an ultrasound probe configured to acquire non-imaging data in addition to imaging data. In particular, the ultrasound probe includes a micro-machined ultrasound transducer formed on the surface of a substrate using micro-electric mechanical systems techniques or other techniques associated with semiconductor processing. Non-imaging sensors are formed on the substrate, either on the surface or the interior, or on a substrate proximate to the substrate upon which the transducer is formed. The non-imaging sensors may be used to acquire non-imaging data in conjunction with the acquisition of imaging data by the transducer.

    摘要翻译: 本技术提供了除了成像数据之外还配置成获取非成像数据的超声波探头的制造和/或使用。 特别地,超声波探头包括使用微电子机械系统技术或与半导体处理相关的其它技术在基板的表面上形成的微加工的超声换能器。 非成像传感器形成在衬底上,无论是在表面还是内部,或者在靠近形成换能器的衬底的衬底上。 非成像传感器可以用于通过换能器获取成像数据来获取非成像数据。

    Curved micromachined ultrasonic transducer arrays and related methods of manufacture
    5.
    发明申请
    Curved micromachined ultrasonic transducer arrays and related methods of manufacture 有权
    弯曲微加工超声波换能器阵列及相关制造方法

    公开(公告)号:US20050146247A1

    公开(公告)日:2005-07-07

    申请号:US10749645

    申请日:2003-12-31

    CPC分类号: G01N29/2406 B06B1/0292

    摘要: A curved sensor device, such as an ultrasonic transducer array, is fabricated from a flat micromachined sensor (such as cMUT or pMUT) array constructed using micromachined electromechanical systems (MEMS) techniques. The device comprises: a support structure comprising a spine having a profile that is generally curved and a multiplicity of teeth extending from one side of the curved spine; and a multiplicity of sensors built on the support structure. The spine can be bent forward or backward and attached to a curved front face of a support member, thereby causing the sensors to adopt a curved array.

    摘要翻译: 诸如超声换能器阵列的弯曲传感器装置由使用微加工机电系统(MEMS)技术构造的平面微机械传感器(例如cMUT或pMUT)阵列制造。 该装置包括:支撑结构,其包括具有大致弯曲的轮廓的脊柱和从弯曲脊的一侧延伸的多个齿; 以及建立在支撑结构上的多个传感器。 脊柱可以向前或向后弯曲并且附接到支撑构件的弯曲前表面,从而使传感器采用弯曲阵列。

    Acoustic backing material for small-element ultrasound transducer arrays
    6.
    发明申请
    Acoustic backing material for small-element ultrasound transducer arrays 审中-公开
    用于小元件超声波换能器阵列的声学背衬材料

    公开(公告)号:US20050127793A1

    公开(公告)日:2005-06-16

    申请号:US10737216

    申请日:2003-12-15

    CPC分类号: G10K11/002

    摘要: A fine-pitch acoustic transducer array that has a backing made of acoustically attenuative material. The backing material is prepared by homogeneously combining a matrix component and filler components having an average particle size less than one-fifth (preferably less than one-tenth) of the smallest dimension of the elements making up the array. In certain embodiments, the acoustically attenuative material comprises 25-45 wt. % tungsten particles, 15-35 wt. % silicone particles and 40-60 wt. % epoxy.

    摘要翻译: 具有由声衰减材料制成的背衬的细间距声换能器阵列。 通过均匀组合基质组分和平均粒径小于构成阵列的元素的最小尺寸的五分之一(优选小于十分之一)的填料组分来制备背衬材料。 在某些实施方案中,声学减弱材料包含25-45wt。 %钨颗粒,15-35重量% %硅氧烷颗粒和40-60重量% %环氧树脂。

    Switching circuitry for reconfigurable arrays of sensor elements
    8.
    发明申请
    Switching circuitry for reconfigurable arrays of sensor elements 有权
    用于可重构阵列的传感器元件的开关电路

    公开(公告)号:US20050169107A1

    公开(公告)日:2005-08-04

    申请号:US10978196

    申请日:2004-10-29

    摘要: A device comprising an array of sensors that are reconfigurable by means of a switching network. The sensors may be optical, thermal or pressure sensors or ultrasonic transducers. More specifically, the device comprises: a multiplicity of sensor elements; a plurality of bus lines; a set of access switches for selectively connecting a set of the sensor elements in a row to a bus line, one of the access switches being connected to a first sensor element; a multiplicity of sets of matrix switches, each of the sets of matrix switches selectively connecting a respective sensor element of the multiplicity of sensor elements to a respective set of adjacent sensor elements, one of the matrix switches being connected to the first sensor element and to a second sensor element that is not a member of the set of sensor elements; and control circuitry that controls the access switches and the matrix switches in accordance with a selected switching configuration such that the first sensor element is connected to the bus line via said one access switch, while at the same time the second sensor element is connected to said one access switch via said one matrix switch.

    摘要翻译: 一种包括可通过交换网络重新配置的传感器阵列的设备。 传感器可以是光学,热或压力传感器或超声换能器。 更具体地,该装置包括:多个传感器元件; 多条总线; 一组接入开关,用于选择性地将一行中的传感器元件连接到总线,其中一个接入开关连接到第一传感器元件; 多个矩阵开关组,每组矩阵开关选择性地将多个传感器元件的相应传感器元件连接到相应的一组相邻传感器元件,矩阵开关中的一个连接到第一传感器元件,并且 第二传感器元件,其不是该组传感器元件的构件; 以及控制电路,其根据选择的开关配置来控制接入开关和矩阵开关,使得第一传感器元件经由所述一个接入开关连接到总线,同时第二传感器元件连接到所述 一个接入开关经由所述一个矩阵开关。

    FETAL HEART RATE MONITOR WITH WIDE SEARCH AREA
    10.
    发明申请
    FETAL HEART RATE MONITOR WITH WIDE SEARCH AREA 审中-公开
    极地心率监测器具有广泛的搜索区域

    公开(公告)号:US20110160591A1

    公开(公告)日:2011-06-30

    申请号:US12649735

    申请日:2009-12-30

    IPC分类号: A61B8/00

    摘要: A continuous, non-invasive fetal heart rate measurement is produced using an ultrasound probe positioned on the abdomen of the mother. The ultrasound probe includes a plurality of ultrasound transducers that are positioned within a housing having a transmission surface. The transmission surface is configured to defocus the individual ultrasound beams created by the plurality of ultrasound transducers. The transmission surface defocuses the ultrasound beam and creates a wider area of coverage for the ultrasound probe. The controller contained within the heart rate monitor selectively activates different combinations of the plurality of ultrasound transducers to reduce the signal-to-noise ratio while allowing the ultrasound probe to locate the fetal heart beat and subsequently increase the signal-to-noise ratio during continuous heart rate monitoring.

    摘要翻译: 使用定位在母亲腹部的超声探头产生连续的非侵入性胎儿心率测量。 超声波探头包括多个超声换能器,其位于具有透射表面的壳体内。 传输表面被配置为使由多个超声换能器产生的各个超声波束聚焦。 传输表面使超声波束聚焦,并为超声波探头创建更广泛的覆盖区域。 包含在心率监测器内的控制器选择性地激活多个超声换能器的不同组合以降低信噪比,同时允许超声探头定位胎儿心跳,并且随后在连续期间增加信噪比 心率监测。