Self cooling piezo actuator for high temperature applications
    1.
    发明授权
    Self cooling piezo actuator for high temperature applications 有权
    用于高温应用的自冷压电致动器

    公开(公告)号:US06933661B2

    公开(公告)日:2005-08-23

    申请号:US10271454

    申请日:2002-10-16

    IPC分类号: H01L41/053 H02N2/04 H01L41/08

    CPC分类号: H01L41/053

    摘要: A piezoelectric actuator and a method of assembling and employing a piezoelectric actuator. This method comprises the steps of positioning an expandable piezoelectric material inside a case, and enclosing a vaporizable liquid in the case. The case is positioned in a high temperature environment; and the liquid vaporizes, in that high temperature environment, over a given period of time, to maintain the temperature of the piezoelectric material below a given value for said period of time. Preferably, the vaporizing liquid maintains the temperature of the piezoelectric material substantially constant over that period of time. Also, preferably the case is provided with a pressure responsive valve that opens and closes, in the high temperature environment, to expose the liquid to that environment and control the vaporization of the liquid to maintain the temperature of the piezoelectric material substantially constant over the period of time.

    摘要翻译: 压电致动器以及组装和使用压电致动器的方法。 该方法包括将可膨胀压电材料定位在壳体内并将壳体中的可汽化液体包围的步骤。 该案件位于高温环境中; 并且在该高温环境中,液体在给定的时间内蒸发,以将压电材料的温度保持在给定值以下一段时间。 优选地,汽化液体在该时间段内保持压电材料的温度基本上恒定。 此外,优选地,在高温环境中优选地设置有打开和关闭的压力响应阀,以将液体暴露于该环境并且控制液体的蒸发以在压缩材料的温度保持基本上恒定的期间 的时间。

    Microelectromechanical high pressure gas microvalve
    2.
    发明授权
    Microelectromechanical high pressure gas microvalve 有权
    微机电高压气体微阀

    公开(公告)号:US06883774B2

    公开(公告)日:2005-04-26

    申请号:US10277028

    申请日:2002-10-21

    IPC分类号: F15C5/00 F16K99/00 F16K7/12

    摘要: A microvalve and a method of forming a microvalve. The microvalve comprises first and second layers, a diaphragm member and a switching means. The first and second layers are secured together to form a valve body that forms an inlet opening for receiving fluid, an outlet opening for conducting fluid from the valve body, and a flow channel for conducting fluid from the inlet to the outlet. The diaphragm is disposed between the layers, and is movable between open and closed positions. In these position, the diaphragm, respectively, allows and blocks the flow of fluid from the inlet to the flow channel. The diaphragm is biased to the closed position, and moves from the closed position to the open position when the pressure of fluid in the inlet reaches a preset value. The switching means is connected to the valve body for moving the diaphragm to the closed position against the pressure of fluid in the inlet. Preferably, the microvalve is constructed out of SiC and stainless steel materials, allowing the microvalve to be used in a harsh environment.

    摘要翻译: 一种微型阀和形成微型阀的方法。 微型阀包括第一和第二层,隔膜构件和开关装置。 第一层和第二层被固定在一起以形成阀体,其形成用于接收流体的入口开口,用于从阀体传导流体的出口,以及用于将流体从入口传导到出口的流动通道。 隔膜设置在层之间,并且可在打开位置和关闭位置之间移动。 在这些位置上,隔膜分别允许和阻止流体从入口到流动通道的流动。 隔膜被偏压到关闭位置,并且当入口中的流体的压力达到预设值时,隔膜从关闭位置移动到打开位置。 切换装置连接到阀体,用于抵抗入口中的流体的压力将隔膜移动到关闭位置。 优选地,微型阀由SiC和不锈钢材料制成,允许微型阀在恶劣的环境中使用。

    Anisotropic dry etching technique for deep bulk silicon etching
    3.
    发明授权
    Anisotropic dry etching technique for deep bulk silicon etching 失效
    用于深体硅蚀刻的各向异性干蚀刻技术

    公开(公告)号:US06790779B2

    公开(公告)日:2004-09-14

    申请号:US10202331

    申请日:2002-07-24

    IPC分类号: H01L21302

    摘要: A method for creating deep features in a Si-containing substrate for use in fabricating MEMS type devices is provided. The method includes first forming a thin Ni hardmask on a surface of a Si-containing substrate. The Ni hardmask is patterned using conventional photolithography and wet etching so as to expose at least one portion of the underlying Si-containing substrate. The at least one exposed portion of the Si-containing substrate, not containing the patterned hardmask, is then etched in a plasma that includes free radicals generated from a gaseous mixture of chlorine (Cl2), sulfur hexafluoride (SF6) and oxygen (O2). The interaction of the gas species in the plasma yields a rapid silicon etch rate that is highly selective to the Ni hardmask. The etch rate ratio of Si to Ni using the inventive method is greater than 250:1.

    摘要翻译: 提供了一种用于制造用于制造MEMS型器件的含Si衬底中的深度特征的方法。 该方法包括首先在含Si衬底的表面上形成薄的Ni硬掩模。 使用常规的光刻和湿法刻蚀图案化Ni硬掩模,以暴露下面的含Si衬底的至少一部分。 然后,在包含由氯(Cl 2),六氟化硫(SF 6)和氧气(O 2)的气体混合物产生的自由基的等离子体中蚀刻含有图案化硬掩模的含Si衬底的至少一个暴露部分, 。 等离子体中的气体物质的相互作用产生了对Ni硬掩模高度选择性的快速硅蚀刻速率。 使用本发明方法的Si与Ni的蚀刻速率比大于250:1。

    Thermistor having doped and undoped layers of material
    5.
    发明授权
    Thermistor having doped and undoped layers of material 失效
    具有掺杂和未掺杂材料层的热敏电阻

    公开(公告)号:US07880580B2

    公开(公告)日:2011-02-01

    申请号:US11648919

    申请日:2007-01-03

    IPC分类号: H01C7/10

    摘要: According to some embodiments, a first layer of doped material may be provided to form a resistor. A second layer of undoped material may then be formed on the first layer. The first layer might comprise, for example, a layer of doped silicon carbide while the second layer comprises a layer of undoped silicon carbide. The resistance of the resistor may then be measured to determine a temperature.

    摘要翻译: 根据一些实施例,可以提供第一掺杂材料层以形成电阻器。 然后可以在第一层上形成第二层未掺杂的材料。 第一层可以包括例如掺杂碳化硅层,而第二层包括未掺杂的碳化硅层。 然后可以测量电阻器的电阻以确定温度。