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1.发明授权Working electrode design for electrochemical processing of electronic components 有权电子元器件电化学处理工作电极设计公开(公告)号：US08926820B2
公开(公告)日：2015-01-06
申请号：US13612661
申请日：2012-09-12
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译： 一种电镀设备，包括用于容纳电镀电解质的电镀槽。 对电极，例如阳极，存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。 在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。
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2.发明授权公开(公告)号：US08784618B2
公开(公告)日：2014-07-22
申请号：US12806719
申请日：2010-08-19
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译： 提供一种电镀设备，其包括用于容纳电镀液的镀槽。 对电极，例如阳极，存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。 在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。
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3.发明申请公开(公告)号：US20120043216A1
公开(公告)日：2012-02-23
申请号：US12806719
申请日：2010-08-19
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译： 提供一种电镀设备，其包括用于容纳电镀液的镀槽。 对电极，例如阳极，存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。 在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。
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4.发明申请WORKING ELECTRODE DESIGN FOR ELECTROCHEMICAL PROCESSING OF ELECTRONIC COMPONENTS 有权电子元器件电化学处理工作电极设计公开(公告)号：US20130062209A1
公开(公告)日：2013-03-14
申请号：US13612661
申请日：2012-09-12
CPC分类号： C25D17/001 , C25D5/04 , C25D7/123 , C25D17/004 , C25D17/02 , C25D17/12
摘要： An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.
摘要翻译： 一种电镀设备，包括用于容纳电镀电解质的电镀槽。 对电极，例如阳极，存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面，其与工作电极的电镀表面偏移。 在一个实施例中，窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中，提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。
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公开(公告)号：US20120043217A1
公开(公告)日：2012-02-23
申请号：US12806730
申请日：2010-08-19
摘要： An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.
摘要翻译： 一种电镀/蚀刻装置，包括存在于含有用于电镀/蚀刻工艺的电解质的罐的流体射流和干燥器。 流体射流和干燥器从被电镀或蚀刻的部件，例如工作电极上去除多余的液体，例如电解质。 工作电极存在于在电镀或蚀刻操作期间从罐中的第一位置穿过到包含电镀电解质外侧的第二位置的保持器。 当保持器处于第二位置时，流体喷射器冲洗工作电极，并且强制空气干燥器将来自流体射流和电解质的任何剩余流体从工作电极吹入罐中。
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公开(公告)号：US09222194B2
公开(公告)日：2015-12-29
申请号：US12806730
申请日：2010-08-19
摘要： An electroplating/etch apparatus including a fluid jet and a dryer present over the tank containing the electrolyte for the electroplating/etch process. The fluid jet and the dryer remove excess liquids, such as electrolyte, from the component being plated or etched, e.g., working electrode. The working electrode is present on a holder that traverses from a first position within the tank during a plating or etch operation to a second position that is outside the containing the plating electrolyte. The fluid jet rinses the working electrode when the holder is in the second position, and the forced air dryer blows any remaining fluid from the fluid jet and the electrolyte from the working electrode into the tank.
摘要翻译： 一种电镀/蚀刻装置，包括存在于含有用于电镀/蚀刻工艺的电解质的罐的流体射流和干燥器。 流体射流和干燥器从被电镀或蚀刻的部件，例如工作电极上去除多余的液体，例如电解质。 工作电极存在于在电镀或蚀刻操作期间从罐中的第一位置穿过到包含电镀电解质外侧的第二位置的保持器。 当保持器处于第二位置时，流体喷射器冲洗工作电极，并且强制空气干燥器将来自流体射流和电解质的任何剩余流体从工作电极吹入罐中。
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公开(公告)号：US20120325667A1
公开(公告)日：2012-12-27
申请号：US13604666
申请日：2012-09-06
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译： 公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。 具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例 。 该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。 此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。
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公开(公告)号：US20080179192A1
公开(公告)日：2008-07-31
申请号：US11627494
申请日：2007-01-26
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译： 公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。 具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例 。 该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。 此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。
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公开(公告)号：US08623194B2
公开(公告)日：2014-01-07
申请号：US13604666
申请日：2012-09-06
IPC分类号： C25D3/56
CPC分类号： C25D17/008 , C25D17/007 , C25D17/12
摘要： Disclosed are embodiments of an electroplating system and an associated electroplating method that allow for depositing of metal alloys with a uniform plate thickness and with the means to alter dynamically the alloy composition. Specifically, by using multiple anodes, each with different types of soluble metals, the system and method avoid the need for periodic plating bath replacement and also allow the ratio of metals within the deposited alloy to be selectively varied by applying different voltages to the different metals. The system and method further avoids the uneven current density and potential distribution and, thus, the non-uniform plating thicknesses exhibited by prior art methods by selectively varying the shape and placement of the anodes within the plating bath. Additionally, the system and method allows for fine tuning of the plating thickness by using electrically insulating selectively placed prescribed baffles.
摘要翻译： 公开了电镀系统和相关电镀方法的实施例，其允许沉积具有均匀板厚度的金属合金以及动态地改变合金组成的手段。 具体来说，通过使用具有不同类型的可溶性金属的多个阳极，该系统和方法避免了对周期性电镀浴更换的需要，还允许通过向不同的金属施加不同的电压来选择性地改变沉积合金中的金属比例 。 该系统和方法进一步避免了不均匀的电流密度和电势分布，并且因此通过选择性地改变阳极在电镀槽内的形状和位置，现有技术方法表现出不均匀的电镀厚度。 此外，该系统和方法允许通过使用电绝缘的选择性放置的规定的挡板来微调电镀厚度。
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10.发明申请Solder Interconnect with Non-Wettable Sidewall Pillars and Methods of Manufacture 有权焊接与不可湿润的侧壁支柱和制造方法互连公开(公告)号：US20110193218A1
公开(公告)日：2011-08-11
申请号：US12700863
申请日：2010-02-05
申请人： Charles L. Arvin , Raschid J. Bezama , Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , David L. Questad , Wolfgang Sauter , Timothy D. Sullivan , Brian R. Sundlof
发明人： Charles L. Arvin , Raschid J. Bezama , Timothy H. Daubenspeck , Jeffrey P. Gambino , Christopher D. Muzzy , David L. Questad , Wolfgang Sauter , Timothy D. Sullivan , Brian R. Sundlof
IPC分类号： H01L23/498 , H01L21/768
CPC分类号： H01L24/13 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L2224/0401 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/10126 , H01L2224/11334 , H01L2224/1146 , H01L2224/1147 , H01L2224/1182 , H01L2224/119 , H01L2224/13017 , H01L2224/13018 , H01L2224/1308 , H01L2224/13083 , H01L2224/13084 , H01L2224/13101 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13565 , H01L2224/1357 , H01L2224/13687 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/3841 , H01L2924/00014 , H01L2924/01024 , H01L2924/01026 , H01L2924/01032 , H01L2924/00012 , H01L2924/00
摘要： A solder interconnect structure is provided with non-wettable sidewalls and methods of manufacturing the same. The method includes forming a nickel or nickel alloy pillar on an underlying surface. The method further includes modifying the sidewall of the nickel or nickel alloy pillar to prevent solder wetting on the sidewall.
摘要翻译： 焊接互连结构设置有不可润湿的侧壁及其制造方法。 该方法包括在下面的表面上形成镍或镍合金支柱。 该方法还包括修改镍或镍合金柱的侧壁以防止在侧壁上的焊料润湿。
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