公开(公告)号：US06486557B1

公开(公告)日：2002-11-26

申请号：US09515110

申请日：2000-02-29

申请人： Charles R. Davis ,  Daniel Charles Edelstein ,  John C. Hay ,  Jeffrey C. Hedrick ,  Christopher Jahnes ,  Vincent McGahay ,  Henry A. Nye, III

发明人： Charles R. Davis ,  Daniel Charles Edelstein ,  John C. Hay ,  Jeffrey C. Hedrick ,  Christopher Jahnes ,  Vincent McGahay ,  Henry A. Nye, III

IPC分类号： H01L2348

CPC分类号： H01L21/76808 ,  H01L21/76835 ,  H01L23/5222 ,  H01L23/53228 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： A multi-level, coplanar copper damascene interconnect structure on an integrated circuit chip includes a first planar interconnect layer on an integrated circuit substrate and having plural line conductors separated by a dielectric material having a relatively low dielectric constant and a relatively low elastic modulus. A second planar interconnect layer on the first planar interconnect layer comprises a dielectric film having an elastic modulus higher than in the first planar interconnect layer and conductive vias therethrough. The vias are selectively in contact with the line conductors. A third planar interconnect layer on the second planar interconnect layer has plural line conductors separated by the dielectric material and selectively in contact with the vias.

摘要翻译： 集成电路芯片上的多层共面铜镶嵌互连结构包括在集成电路基板上的第一平面互连层，并且具有由具有相对较低的介电常数和相对低的弹性模量的介电材料隔开的多个线导体。 第一平面互连层上的第二平面互连层包括具有高于第一平面互连层的弹性模量和通过其的导电通孔的电介质膜。 通孔选择性地与线路导体接触。 第二平面互连层上的第三平面互连层具有被电介质材料隔开并选择性地与通孔接触的多个线导体。

公开(公告)号：US20080077613A1

公开(公告)日：2008-03-27

申请号：US11688622

申请日：2007-03-20

申请人： John C. Hay ,  James M. Cochran ,  William P. Hughes

发明人： John C. Hay ,  James M. Cochran ,  William P. Hughes

IPC分类号： G06F17/00

CPC分类号： G06F17/2247

摘要： A method of creating a document is disclosed. Parent nodes and child nodes associated with the parent nodes are defined in a hierarchical tree. Each parent node contains information associated, with a process. Information in the child nodes are dependent on a position within a hierarchy of the tree and a parent node from which the child node is a descendant Content to be output to the document is determined based on traversing the hierarchical tree, wherein the content depends on the relationships of the child nodes to the parent nodes in the tree.

摘要翻译： 公开了一种创建文档的方法。 与父节点相关联的父节点和子节点在分层树中定义。 每个父节点包含与进程关联的信息。 子节点中的信息取决于树的层次结构中的位置，并且子节点是子节点的父节点基于遍历分层树确定要输出到文档的内容，其中内容取决于 子节点与树中父节点的关系。

公开(公告)号：US06455443B1

公开(公告)日：2002-09-24

申请号：US09789422

申请日：2001-02-21

申请人： Andrew Robert Eckert ,  John C. Hay ,  Jeffrey Curtis Hedrick ,  Kang-Wook Lee ,  Eric Gerhard Liniger ,  Eva Erika Simonyi

发明人： Andrew Robert Eckert ,  John C. Hay ,  Jeffrey Curtis Hedrick ,  Kang-Wook Lee ,  Eric Gerhard Liniger ,  Eva Erika Simonyi

IPC分类号： H01L2131

CPC分类号： H01L21/02282 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/312 ,  H01L21/3121 ,  H01L21/3122 ,  H01L21/3124 ,  H01L21/76829

摘要： A substantially defect-free, low-k dielectric film having improved adhesion is provided by (a) applying a silane coupling agent containing at least one polymerizable group to a surface of a substrate so as to provide a substantially uniform coating of said silane-coupling agent on said substrate; (b) heating the substrate containing the coating of the silane-coupling agent at a temperature of about 90° C. or above so as to provide a surface containing Si—O bonds; (c) rinsing the heated substrate with a suitable solvent that is effective in removing any residual silane-coupling agent; and (d) applying a dielectric material to the rinsed surface containing the Si—O bonds.