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公开(公告)号：US08848363B2
公开(公告)日：2014-09-30
申请号：US13152410
申请日：2011-06-03
申请人： Chen Chen , Hong-Zhi Sun , Yang Li
发明人： Chen Chen , Hong-Zhi Sun , Yang Li
CPC分类号： G06F1/20
摘要： A heat dissipation system includes a computer case having a base plate and a back plate perpendicularly to the base plate, a motherboard on the base plate adjacent to the back plate, and a mass storage device beside the motherboard. The motherboard has a heat sink and a first fan on the heat sink. The base plate has a second fan beside the motherboard. The second fan is adjacent to the back plate. The mass storage device is away from the back plate. The first fan rotates in such a manner that airflow is drawn into the computer case, flows through the heat sink and is exhausted out of the computer case. The second fan rotates in such a manner that airflow is drawn into the computer case, flows through the mass storage device and is exhausted out of the computer case.
摘要翻译： 散热系统包括具有基板和垂直于基板的背板的计算机外壳，与底板相邻的基板上的主板和主板旁边的大容量存储装置。 主板上有散热片和散热片上的第一个风扇。 基板在主板旁边有一个第二个风扇。 第二个风扇与背板相邻。 大容量存储装置远离背板。 第一风扇以这样的方式旋转，使得气流被吸入计算机外壳中，流过散热器并被排出计算机外壳。 第二风扇以这样的方式旋转，使得气流被吸入计算机外壳中，流过大容量存储装置并被排出计算机外壳。
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公开(公告)号：US08456829B2
公开(公告)日：2013-06-04
申请号：US12945675
申请日：2010-11-12
申请人： Chen Chen , Hong-Zhi Sun , Yang Li
发明人： Chen Chen , Hong-Zhi Sun , Yang Li
IPC分类号： G06F1/16
CPC分类号： G06F1/20
摘要： A computer includes an enclosure and a mainframe module enclosed in the enclosure. The mainframe module includes a base board, a motherboard, a partition panel perpendicularly attached on the base board, and a fan. The motherboard and the fan are attached on the base board at opposite sides of the partition panel. The fan is capable of blowing air to the motherboard to cool heat generating components of the motherboard.
摘要翻译： 计算机包括一个外壳和一个封闭在外壳内的主机模块。 主机模块包括基板，母板，垂直安装在基板上的分隔板和风扇。 主板和风扇安装在分隔板相对两侧的基板上。 风扇能够将空气吹到主板上，以冷却主板的发热部件。
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公开(公告)号：US08335082B2
公开(公告)日：2012-12-18
申请号：US13095863
申请日：2011-04-28
申请人： Hong-Zhi Sun , Chen Chen , Yang Li
发明人： Hong-Zhi Sun , Chen Chen , Yang Li
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： A heat dissipating apparatus comprises a cooler, an air duct, and a cooling fan. a cooler secured to a circuit board of a host; the cooler is secured to a circuit board of a host; the air duct, covers the cooler, comprises a side tray that is substantially perpendicular to the circuit board; the cooling fan is secured to the cooler and located on a side of the cooler, and adjacent to the side tray; a gap is defined between the side tray and the cooler, an air guiding board is located in the gap and extends towards a VRM that is secured to the circuit board, and the air guiding board is configured to direct air flowing towards the VRM.
摘要翻译： 散热装置包括冷却器，风道和冷却风扇。 固定在主机电路板上的冷却器; 冷却器固定在主机的电路板上; 空气管道覆盖冷却器，包括基本垂直于电路板的侧托盘; 冷却风扇被固定到冷却器并且位于冷却器的一侧并且靠近侧托盘; 在侧托盘和冷却器之间限定了间隙，空气引导板位于间隙中并且朝向固定到电路板的VRM延伸，并且空气引导板被配置为引导朝向VRM流动的空气。
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公开(公告)号：US08300405B2
公开(公告)日：2012-10-30
申请号：US12903083
申请日：2010-10-12
申请人： Hong-Zhi Sun , Chen Chen , Yang Li
发明人： Hong-Zhi Sun , Chen Chen , Yang Li
CPC分类号： G06F1/20
摘要： An airflow duct for guiding air toward two heat sink apparatuses in computer includes a duct body fixed in a computer case, a first air guide channel and a second air guide channel defined in the duct body. The duct body has an air inlet and an air outlet. The first air guide channel forms a first air outlet, which opens towards a first heat sink apparatus in the computer case. The second air guide channel forms a second air outlet, which opens towards a second heat sink apparatus in the computer case. The first and second air guide channels guide air from the air inlet to the first and second heat sink apparatuses, through the first and second air outlet openings to dissipate heat respectively from the first and second heat sink apparatuses. A first air guide channel height is greater than that of the second air guide channel.
摘要翻译： 用于将空气引导到计算机中的两个散热装置的通风管包括固定在计算机外壳中的管体，第一空气引导通道和限定在管体中的第二空气引导通道。 管体具有空气入口和空气出口。 第一空气引导通道形成第一空气出口，朝向计算机机壳中的第一散热装置打开。 第二空气引导通道形成第二空气出口，朝向计算机外壳中的第二散热装置打开。 第一和第二空气引导通道将空气从空气入口引导到第一和第二散热装置，通过第一和第二空气出口开口分别从第一和第二散热装置散热。 第一空气引导通道高度大于第二导气通道高度。
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公开(公告)号：US08164900B2
公开(公告)日：2012-04-24
申请号：US12938602
申请日：2010-11-03
申请人： Hong-Zhi Sun , Chen Chen , Yang Li
发明人： Hong-Zhi Sun , Chen Chen , Yang Li
IPC分类号： H05K7/20
摘要： An enclosure of an electronic device includes a bottom plate, a rear plate connected to the bottom plate, and a power supply unit. A heat generation apparatus is located on the bottom plate. An opening is defined in the rear plate. A power supply unit includes a wide first receiver portion and a narrow second receiver portion. A fan is mounted in the wide first receiver portion. The wide first receiver portion includes a rear wall located in the opening and a first front wall that is parallel to the rear wall. The first front wall and the rear wall define vent holes. The narrow second receiver portion includes a second side wall perpendicular to the first front wall. The second side wall and the heat generation apparatus form an air flow channel therebetween. The fan drives air flow through the air flow channel.
摘要翻译： 电子设备的外壳包括底板，连接到底板的后板和电源单元。 发热装置位于底板上。 在后板中限定开口。 电源单元包括宽的第一接收器部分和窄的第二接收器部分。 风扇安装在宽的第一接收器部分中。 宽的第一接收器部分包括位于开口中的后壁和平行于后壁的第一前壁。 第一个前壁和后壁定义通气孔。 狭窄的第二接收器部分包括垂直于第一前壁的第二侧壁。 第二侧壁和发热装置在它们之间形成空气流动通道。 风扇驱动气流通过气流通道。
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公开(公告)号：US08072763B2
公开(公告)日：2011-12-06
申请号：US12728587
申请日：2010-03-22
申请人： Yang Li , Hong-Zhi Sun , Shuang Fu
发明人： Yang Li , Hong-Zhi Sun , Shuang Fu
CPC分类号： H01L23/4006 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H05K1/0271 , H01L2924/00
摘要： A printed circuit board assembly includes a heat sink, a back board, and a securing member. The heat sink is configured to be mounted on a heat generating element of a printed circuit board. The heat sink is configured to dissipate heat generated by the heat generating element. The heat sink and the back board are configured to be placed on opposite sides of the printed circuit board. The heat sink includes a first connecting heat pipe. The back board includes a second connecting heat pipe. The second connecting heat pipe contacts the first connecting heat pipe. The securing member thermally contacts the first connecting heat pipe and the second connecting heat pipe.
摘要翻译： 印刷电路板组件包括散热器，背板和固定构件。 散热器被配置为安装在印刷电路板的发热元件上。 散热器被配置为消散由发热元件产生的热量。 散热器和背板被配置为放置在印刷电路板的相对侧上。 散热器包括第一连接热管。 背板包括第二连接热管。 第二连接热管接触第一连接热管。 固定构件热接触第一连接热管和第二连接热管。
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7.发明授权公开(公告)号：US10819972B2
公开(公告)日：2020-10-27
申请号：US15969863
申请日：2018-05-03
申请人： Yang Li , Helmar Adler , Sergio Bermudez
发明人： Yang Li , Helmar Adler , Sergio Bermudez
IPC分类号： H04N13/275 , H04N13/239 , H04N13/254 , G06T7/593 , G06T7/73 , G06T7/90
摘要： Systems and methods disclosed herein includes a measurement device to enable dimensional metrology and/or 3D reconstruction of an object. The measurement device is positioned between the object and reference luminaires (e.g., light emitting diodes or other light sources). The measurement device uses the reference luminaires to determine the position and orientation of the measurement device. The measurement device may include a camera oriented towards the reference luminaires and may acquire/use images of reference luminaires to determine the position and orientation of the measurement device. Using the reference luminaires, the system may determine positions and orientations of the measurement device when the images of the reference luminaires are taken. The system may be configured to use the positions and the orientations of the measurement device to determine dimensions and/or 3D models of the object.
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公开(公告)号：US20200066032A1
公开(公告)日：2020-02-27
申请号：US16108749
申请日：2018-08-22
申请人： Yang Li , Khadige Abboud , Sergio Bermudez , Helmar Adler
发明人： Yang Li , Khadige Abboud , Sergio Bermudez , Helmar Adler
摘要： Aspects of the present disclosure include systems and methods for automated luminaire commissioning using computer vision and light-based communications (“LCom”). In some examples, locations of an installation of luminaires can be measured and recorded with a mobile commissioning device equipped with an image capture device and image processing and simultaneous localization and mapping software.
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公开(公告)号：US10242269B2
公开(公告)日：2019-03-26
申请号：US15437521
申请日：2017-02-21
申请人： Anant Aggarwal , Yang Li , Sajin George , Christian Breuer
发明人： Anant Aggarwal , Yang Li , Sajin George , Christian Breuer
摘要： Techniques are disclosed for locating an occupant within an area. The system includes a first sensor including a first plurality of pixels for receiving a thermal energy input from the occupant within a first field of view (FOV) and a second sensor including a second plurality of pixels for receiving the input within a second FOV. A first distance from the occupant to the first sensor is determined based on the input received by at least one pixel of the first plurality of pixels and a first sensor location from an origin. A second distance from the occupant to the second sensor is also determined based on the input received by at least one pixel of the second plurality of pixels and a second sensor location relative to the origin. A coordinate position for the occupant relative to the origin is determined based on the determined first and second distances.
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公开(公告)号：US10191140B2
公开(公告)日：2019-01-29
申请号：US15611249
申请日：2017-06-01
申请人： Yang Li , Christian Breuer , Bernhard Siessegger
发明人： Yang Li , Christian Breuer , Bernhard Siessegger
摘要： Various embodiments disclosed herein include a method for determining the position of a computing device. The method may include obtaining, by the computing device, an image of a subset of luminaries from a plurality of luminaires located in an indoor environment, in which each subset grouping of luminaires in the plurality of luminaires is uniquely identifiable. The computing device may then compare the subset of luminaires to a database storing each uniquely identifiable subset grouping of luminaires in the plurality of luminaires, in which the database includes position information for each luminaire in the plurality of luminaires, and determine the position of the computing device based on the comparison of the subset of luminaries to the database.
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