公开(公告)号：US20170232576A1

公开(公告)日：2017-08-17

申请号：US15361166

申请日：2016-11-25

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/017 ,  B24B37/34 ,  B24B37/20

CPC分类号： B24B53/017 ,  B24B37/20 ,  B24B37/34

摘要： A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

公开(公告)号：US09724802B2

公开(公告)日：2017-08-08

申请号：US14506476

申请日：2014-10-03

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/00 ,  B24B53/017 ,  B24B53/12 ,  B24D3/00

CPC分类号： B24B53/017 ,  B24B53/12 ,  B24D3/00

摘要： CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a support substrate and a plurality of superabrasive particles secured to the support substrate with each superabrasive particle extending away from the support substrate to a protrusion distance, where a highest protruding tip of each of the plurality of superabrasive particles align along a designated profile with a tip variation of from about 5 microns to about 100 microns.

公开(公告)号：US09475169B2

公开(公告)日：2016-10-25

申请号：US14223726

申请日：2014-03-24

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B49/00 ,  B24D18/00 ,  B24B53/02 ,  B24B1/00 ,  B24B49/18 ,  B24B53/017 ,  B24D3/28

CPC分类号： B24B49/186 ,  B24B53/017 ,  B24D3/28

摘要： Methods and systems for evaluating and/or increasing CMP pad dresser performance are provided. In one aspect, for example, a method of identifying overly-aggressive superabrasive particles in a CMP pad dresser can include positioning a CMP pad dresser having a plurality of superabrasive particles on an indicator substrate such that at least a portion of the plurality of superabrasive particles of the CMP pad dresser contact the indicator substrate, and moving the CMP pad dresser across the indicator substrate in a first direction such that the portion of the plurality of superabrasive particles create a first marking pattern on the substrate, wherein the first marking pattern identifies a plurality of working superabrasive particles from among the plurality of superabrasive particles.

摘要翻译： 提供了用于评估和/或增加CMP垫修整器性能的方法和系统。 在一个方面，例如，在CMP抛光修整器中识别过度侵蚀性超研磨颗粒的方法可以包括将具有多个超研磨颗粒的CMP抛光垫修整器定位在指示剂基底上，使得多个超研磨颗粒的至少一部分 所述CMP抛光修整器与所述指示器基板接触，并且沿着第一方向移动所述CMP抛光垫修整器穿过所述指示器基板，使得所述多个超级磨料颗粒的所述部分在所述基板上形成第一标记图案，其中所述第一标记图案标识 多个超研磨颗粒中的多个工作超研磨颗粒。

公开(公告)号：US09370856B2

公开(公告)日：2016-06-21

申请号：US13416201

申请日：2012-03-09

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24D18/00 ,  B28D1/12 ,  B01J3/06 ,  B24D3/06

摘要： Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

公开(公告)号：US09138862B2

公开(公告)日：2015-09-22

申请号：US13802112

申请日：2013-03-13

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/017

CPC分类号： B24B53/017 ,  B24B37/044 ,  H01L21/31055 ,  H01L21/3212

摘要： CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a method can include pressing a CMP pad dresser against a CMP pad, where the dresser includes a monolayer of a plurality of superabrasive particles protruding from a matrix layer. The difference in protrusion distance between the highest protruding tip and the second highest protruding tip of the monolayer of superabrasive particles is less than or equal to about 10 microns and the difference in protrusion distance between the highest 10 protruding tips of the monolayer of superabrasive particles are within about 20 microns or less. The method can further include rotating the dresser against the CMP pad such that asperities are cut into the CMP pad having a maximum cutting depth of about 60 microns.

摘要翻译： 提供具有调平尖端和相关方法的CMP抛光垫修整器。 在一个方面，例如，一种方法可以包括将CMP垫修整器压靠在CMP垫上，其中修整器包括从矩阵层突出的多个超级磨料颗粒的单层。 超级磨料颗粒单层的最高突出尖端和第二高突出尖端之间的突出距离的差异小于或等于约10微米，并且超级磨料颗粒单层的最高10个突出尖端之间的突出距离的差异为 在约20微米以内。 该方法还可以包括将修整器旋转抵靠在CMP垫上，使得粗糙度被切割成具有大约60微米的最大切割深度的CMP垫。

公开(公告)号：US09067301B2

公开(公告)日：2015-06-30

申请号：US13794164

申请日：2013-03-11

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24B53/00 ,  B24B53/017 ,  B24D3/00

CPC分类号： B24B53/017 ,  B24D3/007

摘要： A CMP pad conditioner comprises a plurality of abrasive segments. Each abrasive segment includes a segment blank and an abrasive layer attached to the segment blank, the abrasive layer including a superhard abrasive material. A pad conditioner substrate is also provided. Each of the plurality of abrasive segments is permanently affixed to the pad conditioner substrate in an orientation that enables removal of material from a CMP pad by the abrasive layer as the pad conditioner and the CMP pad are moved relative to one another.

摘要翻译： CMP垫调节器包括多个磨料段。 每个研磨部分包括段坯料和连接到片坯的磨料层，研磨层包括超硬磨料。 还提供了衬垫调节衬底。 多个研磨部分中的每一个永久地固定到衬垫调节器衬底上，其方式是当衬垫调节器和CMP垫相对于彼此移动时，能够通过磨料层从CMP衬垫去除材料。

公开(公告)号：US20150079352A1

公开(公告)日：2015-03-19

申请号：US14455335

申请日：2014-08-08

申请人： Chien-Min Sung

发明人： Chien-Min Sung ,  Shao Chung Hu ,  I-Chiao Lin ,  Chien-Pei Yu

IPC分类号： C01B31/04

CPC分类号： C01B32/184 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/20 ,  C04B35/583 ,  C04B35/62218 ,  C04B35/653 ,  C04B2235/3203 ,  C23C14/0605 ,  H01L21/0242 ,  H01L21/02425 ,  H01L21/02491 ,  H01L21/02527 ,  H01L21/0254 ,  H01L21/02573 ,  H01L21/02612 ,  H01L21/02625 ,  Y10S977/734 ,  Y10S977/842 ,  Y10S977/932 ,  Y10T428/24612 ,  Y10T428/31678

摘要： Graphene layers made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, for example, a method of forming a graphite film can include heating a solid substrate under vacuum to a solubilizing temperature that is less than a melting point of the solid substrate, solubilizing carbon atoms from a graphite source into the heated solid substrate, and cooling the heated solid substrate at a rate sufficient to form a graphite film from the solubilized carbon atoms on at least one surface of the solid substrate. The graphite film is formed to be substantially free of lattice defects.

摘要翻译： 公开了主要由sp2键合的原子制成的石墨烯层及相关方法。 一方面，例如，形成石墨膜的方法可以包括在真空下将固体基质加热到小于固体基质的熔点的溶解温度，将碳原子从石墨源溶解到加热的固体基质中 并且以足以从固体基底的至少一个表面上溶解的碳原子形成石墨膜的速率冷却加热的固体基质。 石墨膜形成为基本上没有晶格缺陷。

公开(公告)号：US20140302756A1

公开(公告)日：2014-10-09

申请号：US14248109

申请日：2014-04-08

申请人： Chien-Min Sung ,  Wen-Ting Yeh

发明人： Chien-Min Sung ,  Wen-Ting Yeh

IPC分类号： B24B53/017

CPC分类号： B24B53/017

摘要： The present invention (utility model application in Taiwan) relates to a chemical mechanical polishing pad dresser, comprising: a substrate; a bonding layer disposed on the substrate; an electroplating layer disposed on the bonding layer; a fixed template disposed on the electroplating layer having a plurality of apertures; and a plurality of abrasive particles corresponding to and set in the apertures, wherein the plurality of abrasive particle fixed in the bonding layer and the substrate by means of the electroplating layer. Therefore, the present invention is not only to avoid damaging the abrasive particles due to the high temperature heating in the production process, but also to solve the corrosion problem of the surface of the chemical mechanical polishing pad dresser by the fixed template and the electroplating layer and to solve simultaneously the pollution problem generating on the polished workpieces by using conventional brazing bonding layer; and, the present invention can also provide to adjust the abrasive particles arrangement and protrude rate through the fixed template, so as to enhance the grinding performance and quality of the chemical mechanical polishing pad dresser.

摘要翻译： 本发明（台湾实用新型申请）涉及一种化学机械抛光垫修整器，包括：基材; 设置在所述基板上的接合层; 设置在所述接合层上的电镀层; 设置在具有多个孔的电镀层上的固定模板; 以及对应于并设置在所述孔中的多个磨料颗粒，其中所述多个研磨颗粒通过所述电镀层固定在所述粘合层和所述基底中。 因此，本发明不仅是为了避免在生产过程中由于高温加热而损害磨料颗粒，而且还通过固定模板和电镀层来解决化学机械抛光垫修整器表面的腐蚀问题 并通过使用传统的钎焊层同时解决抛光工件产生的污染问题; 并且本发明还可以提供通过固定模板来调节磨料颗粒排列和突出率，从而提高化学机械抛光垫修整器的研磨性能和质量。

公开(公告)号：US08778784B2

公开(公告)日：2014-07-15

申请号：US13284900

申请日：2011-10-29

申请人： Chien-Min Sung ,  Ming Chi Kan ,  Shao Chung Hu

发明人： Chien-Min Sung ,  Ming Chi Kan ,  Shao Chung Hu

IPC分类号： H01L21/20

CPC分类号： H01L23/3733 ,  H01L23/3732 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0075 ,  H01L2924/00

摘要： Stress regulated semiconductor devices and associated methods are provided. In one aspect, for example, a stress regulated semiconductor device can include a semiconductor layer, a stress regulating interface layer including a carbon layer formed on the semiconductor layer, and a heat spreader coupled to the carbon layer opposite the semiconductor layer. The stress regulating interface layer is operable to reduce the coefficient of thermal expansion difference between the semiconductor layer and the heat spreader to less than or equal to about 10 ppm/° C.

摘要翻译： 提供了受压调节的半导体器件和相关方法。 在一个方面，例如，应力调节半导体器件可以包括半导体层，包括形成在半导体层上的碳层的应力调节界面层和耦合到与半导体层相对的碳层的散热器。 应力调节界面层是可操作的，以将半导体层和散热器之间的热膨胀系数差减小到或等于约10ppm /℃。

公开(公告)号：US20130267154A1

公开(公告)日：2013-10-10

申请号：US13633082

申请日：2012-10-01

申请人： Chien-Min Sung

发明人： Chien-Min Sung

IPC分类号： B24D18/00 ,  B24B53/017

CPC分类号： B24D18/0054 ,  B01J2203/061 ,  B01J2203/062 ,  B01J2203/0645 ,  B01J2203/0655 ,  B01J2203/066 ,  B01J2203/068 ,  B24B53/017

摘要： Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

摘要翻译： 公开和描述了超研磨工具及其制造方法。 在一个方面，超磨料颗粒通过钎焊合金根据预定图案化学键合到基质载体材料上。 钎焊合金可以提供为粉末，薄片或非晶合金片。 可以使用具有以预定图案布置的多个孔的模板来将超研磨颗粒放置在给定的基底或基质支撑材料上。