-
公开(公告)号:US20110198745A1
公开(公告)日:2011-08-18
申请号:US12707239
申请日:2010-02-17
IPC分类号: H01L23/498 , H01L21/78
CPC分类号: H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/64 , H01L24/66 , H01L24/69 , H01L24/81 , H01L24/89 , H01L2224/0401 , H01L2224/06102 , H01L2224/11914 , H01L2224/13099 , H01L2224/131 , H01L2224/1403 , H01L2224/81136 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83194 , H01L2224/83907 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01068 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/10329 , H01L2924/14 , H01L2924/3025
摘要: A wafer-level packaged semiconductor device is described. In an implementation, the device includes one or more self-assembled resilient leads disposed on an integrated circuit chip. Each of the resilient leads are configured to move from a first position wherein the resilient lead is held adjacent to the chip and a second position wherein the resilient lead is extended away from the chip to interconnect the chip to a printed circuit board. A guard is provided to protect the resilient leads when the resilient leads are in the first position. One or more attachment bumps may also be furnished to facilitate attachment of the device to the printed circuit board.
摘要翻译: 描述了晶片级封装半导体器件。 在一个实现中,该装置包括设置在集成电路芯片上的一个或多个自组装的弹性引线。 每个弹性引线构造成从第一位置移动,其中弹性引线邻近芯片保持,第二位置,其中弹性引线远离芯片延伸以将芯片与印刷电路板互连。 当弹性引线处于第一位置时,提供防护件以保护弹性引线。 还可以设置一个或多个附接凸块以便于将装置附接到印刷电路板。
-
公开(公告)号:US06455922B1
公开(公告)日:2002-09-24
申请号:US09599778
申请日:2000-06-21
IPC分类号: H01L23495
CPC分类号: H01L23/49544 , H01L2924/0002 , H01L2924/00
摘要: A leadframe structure for use with an integrated circuit chip, comprising a chip mount pad having an area smaller than said chip intended for mounting; a plurality of support members, each attached externally to the perimeter of said pad and internally to said leadframe; and each said support member having at least one portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support member.
-