Trailing plated step
    1.
    发明授权
    Trailing plated step 有权
    追踪电镀步

    公开(公告)号:US08449752B2

    公开(公告)日:2013-05-28

    申请号:US12569973

    申请日:2009-09-30

    IPC分类号: C25D5/02 G11B5/127 G11B5/187

    摘要: Methods for fabrication of magnetic write heads, and more specifically to fabrication of magnetic poles and trailing magnetic pole steps. A write pole may first be patterned on a substrate. Then a side gap material may be patterned along sidewall portions of the write pole. Thereafter, a masking layer may be deposited and patterned to expose a portion of the write pole. A trailing magnetic pole step may be formed on the exposed portion of the write pole.

    摘要翻译: 用于制造磁写头的方法,更具体地说是制造磁极和后磁极台阶。 写极可以首先在衬底上图案化。 然后,侧面间隙材料可以沿着写入极的侧壁部分被图案化。 此后,可以沉积和图案化掩模层以暴露写入极的一部分。 可以在写入极的暴露部分上形成尾部磁极台阶。

    TRAILING PLATED STEP
    2.
    发明申请
    TRAILING PLATED STEP 有权
    跟踪步骤

    公开(公告)号:US20110076393A1

    公开(公告)日:2011-03-31

    申请号:US12569973

    申请日:2009-09-30

    IPC分类号: G11B5/17

    摘要: Methods for fabrication of magnetic write heads, and more specifically to fabrication of magnetic poles and trailing magnetic pole steps. A write pole may first be patterned on a substrate. Then a side gap material may be patterned along sidewall portions of the write pole. Thereafter, a masking layer may be deposited and patterned to expose a portion of the write pole. A trailing magnetic pole step may be formed on the exposed portion of the write pole.

    摘要翻译: 用于制造磁写头的方法,更具体地说是制造磁极和后磁极台阶。 写极可以首先在衬底上图案化。 然后,侧面间隙材料可以沿着写入极的侧壁部分被图案化。 此后,可以沉积和图案化掩模层以暴露写入极的一部分。 可以在写入极的暴露部分上形成尾部磁极台阶。

    Structure formation using metal deposited on a RIE-able seedlayer
    3.
    发明授权
    Structure formation using metal deposited on a RIE-able seedlayer 失效
    使用沉积在可RIE的种子层上的金属的结构形成

    公开(公告)号:US08673161B2

    公开(公告)日:2014-03-18

    申请号:US12345457

    申请日:2008-12-29

    摘要: Methods for fabricating a device component are provided. A substrate comprising a RIE stop layer, an oxide layer formed on the RIE stop layer, and a RIE-able layer formed on the oxide layer may be provided. A resist layer may be patterned on the RIE-able layer. A metal layer may be formed on portions of the RIE-able layer that are not covered by the resist layer. The resist layer may be removed and an RIE performed to remove exposed portions of the RIE-able layer and portions of the oxide layer beneath the exposed portions of the RIE-able layer. Thereafter, the metal layer may be removed, and the component may be formed in an opening in the oxide layer formed during the RIE.

    摘要翻译: 提供了制造器件部件的方法。 可以提供包括RIE停止层,形成在RIE停止层上的氧化物层和形成在氧化物层上的RIE能层的衬底。 抗蚀剂层可以在RIE能层上图案化。 可以在RIE能层的未被抗蚀剂层覆盖的部分上形成金属层。 可以去除抗蚀剂层,并且执行RIE以去除RIE能层的暴露部分和在RIE能层的暴露部分下方的氧化物层的部分。 此后,可以去除金属层,并且可以在RIE中形成的氧化物层的开口中形成该部件。