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    METHOD OF AND DEVICE FOR DETERMINING THE DISTANCE BETWEEN AN INTEGRATED CIRCUIT AND A SUBSTRATE
    1.
    发明申请
    METHOD OF AND DEVICE FOR DETERMINING THE DISTANCE BETWEEN AN INTEGRATED CIRCUIT AND A SUBSTRATE 审中-公开
    用于确定集成电路和基板之间的距离的方法和装置

    公开(公告)号：US20100310124A1

    公开(公告)日：2010-12-09

    申请号：US12744939

    申请日：2008-11-25

    申请人： Christian Zenz ,  Dietmar Nessmann ,  Shafqat Hussain ,  Martin Weinberger

    发明人： Christian Zenz ,  Dietmar Nessmann ,  Shafqat Hussain ,  Martin Weinberger

    IPC分类号： G06K9/00

    CPC分类号： G01B11/0625 ,  H01L2224/73204

    摘要： In a method of determining the distance (d) between an integrated circuit (1) and a substrate (2) a picture (31,32) of the integrated circuit (1) is taken. The integrated circuit (1) is attached to the substrate (2) that is at least semi transparent. An at least semi transparent material, particularly an at least semi transparent adhesive (8), is located between the integrated circuit (1) and the substrate (2). The picture (31,32) of the integrated circuit (1) is taken through the substrate (2) and the material (8). The picture (31,32) and/or image data related to the picture (31,32) is evaluated and the distance (d) between the integrated circuit (1) and the substrate (2) is determined in response to the evaluated picture (31,32) and/or image data related to the picture (31,32).

    摘要翻译： 在确定集成电路（1）和衬底（2）之间的距离（d）的方法中，采集集成电路（1）的图像（31,32）。 集成电路（1）附接到至少半透明的基板（2）。 至少半透明材料，特别是至少半透明粘合剂（8），位于集成电路（1）和基底（2）之间。 集成电路（1）的图像（31,32）通过基板（2）和材料（8）。 评估与图像（31,32）相关的图像（31,32）和/或图像数据，并且响应于评估图像来确定集成电路（1）和基板（2）之间的距离（d） （31,32）和/或与图像相关的图像数据（31,32）。