公开(公告)号：US20100295165A1

公开(公告)日：2010-11-25

申请号：US12471188

申请日：2009-05-22

申请人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

发明人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L21/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05599 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81903 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/0132 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/0311 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2924/01015 ,  H01L2924/01049 ,  H01L2924/01031 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552 ,  H01L2924/00

摘要： A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.

摘要翻译： 封装具有具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，互连中的化学活化剂 区域，以及响应于互连区域中的化学活化剂的粘合剂。 封装具有焊盘芯片，其具有接触焊盘，弹簧芯片，其具有与接触焊盘接触以形成互连的微弹簧，在焊盘芯片或弹簧芯片之一上的化学活化剂以及响应于化学活化剂的粘合剂 另一方面是垫片芯片或弹簧芯片。 一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂 芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

公开(公告)号：US08039938B2

公开(公告)日：2011-10-18

申请号：US12471163

申请日：2009-05-22

申请人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

发明人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/52 ,  H01L23/48 ,  H01L23/34

CPC分类号： H01L21/563 ,  H01L24/01 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L33/62 ,  H01L2224/13016 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81855 ,  H01L2224/81902 ,  H01L2224/83192 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.

摘要翻译： 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和布置成在垫片芯片和弹簧芯片之间形成间隙的弹簧芯片，以及在间隙的一部分中的底部填充材料，以从垫片芯片和弹簧芯片形成模具。 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和弹簧芯片布置成在垫片芯片和弹簧芯片之间形成间隙，间隙中的底部填充材料从垫片芯片和弹簧芯片形成模具，以及底部填充材料和互连件之间的至少一个壁 区。 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

公开(公告)号：US08405198B2

公开(公告)日：2013-03-26

申请号：US12471188

申请日：2009-05-22

申请人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

发明人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC分类号： H01L23/52

CPC分类号： H01L21/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05599 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13016 ,  H01L2224/13027 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81903 ,  H01L2224/83193 ,  H01L2224/83855 ,  H01L2224/83859 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/9211 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/0132 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4015 ,  H05K2201/0311 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2924/01015 ,  H01L2924/01049 ,  H01L2924/01031 ,  H01L2224/13599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552 ,  H01L2924/00

摘要： A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, a chemical activator in the interconnect area, and an adhesive responsive to the chemical activator in the interconnect area. A package has a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, a chemical activator on one of either the pad chip or the spring chip, and an adhesive responsive to the chemical activator on the other of either the pad chip or the spring chip. A method includes providing a pad chip having contact pads, providing a spring chip having micro-springs, applying a chemical activator to one of either the pad chip or the spring chip, applying an adhesive responsive to the chemical activator on the other of the pad chip or the spring chip, aligning the pad chip to the spring chip such that the micro-springs will contact the contact pads, and pressing the pad chip and the spring chip together such that the chemical activator at least partially cures the adhesive.

摘要翻译： 封装具有具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，互连中的化学活化剂 区域，以及响应于互连区域中的化学活化剂的粘合剂。 封装具有焊盘芯片，其具有接触焊盘，弹簧芯片，其具有与接触焊盘接触以形成互连的微弹簧，在焊盘芯片或弹簧芯片之一上的化学活化剂以及响应于化学活化剂的粘合剂 另一方面是垫片芯片或弹簧芯片。 一种方法包括提供具有接触焊盘的焊盘芯片，提供具有微弹簧的弹簧芯片，将化学活化剂施加到衬垫芯片或弹簧芯片中的一个上，在衬垫的另一个上施加响应于化学活化剂的粘合剂 芯片或弹簧芯片，将焊盘芯片对准弹簧芯片，使得微弹簧将接触接触焊盘，并将焊盘芯片和弹簧芯片压在一起，使得化学活化器至少部分地固化粘合剂。

公开(公告)号：US08399296B2

公开(公告)日：2013-03-19

申请号：US13269609

申请日：2011-10-09

申请人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

发明人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC分类号： H01L21/00 ,  H01L23/34

CPC分类号： H01L21/563 ,  H01L24/01 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L33/62 ,  H01L2224/13016 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81855 ,  H01L2224/81902 ,  H01L2224/83192 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.

摘要翻译： 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

公开(公告)号：US20100295164A1

公开(公告)日：2010-11-25

申请号：US12471163

申请日：2009-05-22

申请人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

发明人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC分类号： H01L23/498

CPC分类号： H01L21/563 ,  H01L24/01 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L33/62 ,  H01L2224/13016 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81855 ,  H01L2224/81902 ,  H01L2224/83192 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, and an underfill material in a portion of the gap to form a mold from the pad chip and the spring chip. A package includes a pad chip having contact pads, a spring chip having micro-springs in contact with the contact pads to form interconnects, the area in which the micro-springs contact the contact pads forming an interconnect area, an assembly material between the pad chip and the spring chip arranged to form a gap between the pad chip and the spring chip, an underfill material in the gap to form a mold from the pad chip and the spring chip, and at least one wall between the underfill material and the interconnect area. A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.

摘要翻译： 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和布置成在垫片芯片和弹簧芯片之间形成间隙的弹簧芯片，以及在间隙的一部分中的底部填充材料，以从垫片芯片和弹簧芯片形成模具。 封装包括具有接触焊盘的焊盘芯片，具有与接触焊盘接触以形成互连的微弹簧的弹簧芯片，微弹簧接触形成互连区域的接触焊盘的区域，焊盘之间的组合材料 芯片和弹簧芯片布置成在垫片芯片和弹簧芯片之间形成间隙，间隙中的底部填充材料从垫片芯片和弹簧芯片形成模具，以及底部填充材料和互连件之间的至少一个壁 区。 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

公开(公告)号：US20120088330A1

公开(公告)日：2012-04-12

申请号：US13269609

申请日：2011-10-09

申请人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

发明人： Christopher L. Chua ,  Bowen Cheng ,  Eugene M. Chow ,  Dirk De Bruyker

IPC分类号： H01L21/50

CPC分类号： H01L21/563 ,  H01L24/01 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0657 ,  H01L33/62 ,  H01L2224/13016 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17505 ,  H01L2224/17517 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/81855 ,  H01L2224/81902 ,  H01L2224/83192 ,  H01L2225/06527 ,  H01L2225/06575 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00

摘要： A method of assembling a package includes aligning a pad chip with a spring chip to form at least one interconnect in an interconnect area, adhering the pad chip to the spring chip so that there is a gap between the pad chip and the spring chip, dispensing underfill material into the gap to seal the interconnect area from an environment external to the package, and curing the underfill material to form a solid mold.

摘要翻译： 组装包装的方法包括将衬垫芯片与弹簧芯片对准以在互连区域中形成至少一个互连，将焊盘芯片粘附到弹簧芯片，使得在垫片芯片和弹簧芯片之间存在间隙，分配 将填充材料填充到间隙中以将互连区域与包装外部的环境密封，并固化底部填充材料以形成固体模具。

公开(公告)号：US08241509B2

公开(公告)日：2012-08-14

申请号：US12428397

申请日：2009-04-22

申请人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

发明人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

IPC分类号： C40B50/18

CPC分类号： G01N35/1074 ,  B01J2219/00387 ,  B01L3/0244 ,  B01L3/0255 ,  B01L3/502715 ,  B01L2300/0819 ,  B01L2400/025 ,  B01L2400/0406 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1643 ,  C40B60/14 ,  G01N35/1009 ,  G01N2035/00237 ,  G01N2035/1037 ,  G03F7/0002 ,  Y10T436/2575

摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

摘要翻译： 公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。 由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。 由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。 由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。

公开(公告)号：US20080141877A1

公开(公告)日：2008-06-19

申请号：US11613159

申请日：2006-12-19

申请人： Dirk De Bruyker ,  JengPing Lu ,  Jurgen H. Daniel ,  Eugene M. Chow ,  Armin R. Volkel

发明人： Dirk De Bruyker ,  JengPing Lu ,  Jurgen H. Daniel ,  Eugene M. Chow ,  Armin R. Volkel

IPC分类号： B41M1/10

CPC分类号： B41M1/10 ,  B41M1/04 ,  B41M1/06 ,  H05K3/207 ,  H05K2201/091 ,  H05K2203/105

摘要： A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state.

摘要翻译： 打印表面包括在第一表面上具有锁定电极的基板，在基板的第一表面上的间隔层，图案化的间隔层以形成孔，使得锁定电极驻留在孔中，可变形的膜，该膜具有导电 区域，在间隔层上包围孔，每个封闭的井及其膜的相关区域形成像素膜，以及致动电路，用于致动电极，以使像素膜中选定的像素膜保持在偏转状态，当像素 膜受到冲击以返回到未偏转的状态。

公开(公告)号：US20110107928A1

公开(公告)日：2011-05-12

申请号：US12957113

申请日：2010-11-30

申请人： Dirk De Bruyker ,  JengPing Lu ,  Jürgen H. Daniel ,  Eugene M. Chow ,  Armin R. Völkel

发明人： Dirk De Bruyker ,  JengPing Lu ,  Jürgen H. Daniel ,  Eugene M. Chow ,  Armin R. Völkel

IPC分类号： B41M1/10

CPC分类号： B41M1/10 ,  B41M1/04 ,  B41M1/06 ,  H05K3/207 ,  H05K2201/091 ,  H05K2203/105

摘要： A printing surface includes a substrate having latching electrodes on a first surface, a spacer layer on the first surface of the substrate, the spacer layer patterned to form wells such that the latching electrodes reside in the wells, a deformable membrane, the membrane having conductive regions, on the spacer layer to enclose the wells, each enclosed well and its associated region of the membrane forming a pixel membrane, and actuation circuitry to actuate the electrodes to cause selected ones of the pixel membranes to remain in a deflected state when the pixel membranes receive an impulse to return to an undeflected state.

摘要翻译： 打印表面包括在第一表面上具有锁定电极的基板，在基板的第一表面上的间隔层，图案化的间隔层以形成孔，使得锁定电极驻留在孔中，可变形的膜，该膜具有导电 区域，在间隔层上包围孔，每个封闭的井及其膜的相关区域形成像素膜，以及致动电路，用于致动电极，以使像素膜中选定的像素膜保持在偏转状态，当像素 膜受到冲击以返回到未偏转的状态。

公开(公告)号：US20100213161A1

公开(公告)日：2010-08-26

申请号：US12775452

申请日：2010-05-06

申请人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

发明人： Thomas Hantschel ,  David K. Fork ,  Eugene M. Chow ,  Dirk De Bruyker ,  Michel A. Rosa

IPC分类号： B44C1/22 ,  B32B38/10 ,  C23C14/34

CPC分类号： G01N35/1074 ,  B01J2219/00387 ,  B01L3/0244 ,  B01L3/0255 ,  B01L3/502715 ,  B01L2300/0819 ,  B01L2400/025 ,  B01L2400/0406 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1643 ,  C40B60/14 ,  G01N35/1009 ,  G01N2035/00237 ,  G01N2035/1037 ,  G03F7/0002 ,  Y10T436/2575

摘要： Fluidic conduits, which can be used in microarraying systems, dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes that include at least one capillary channel. Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels can either be integrated into the spring beams or formed on the spring beams. Capillary forces produced by the narrow channels allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.

摘要翻译： 公开了可用于微阵列系统，浸笔纳米光刻系统，流体回路和微流体系统的流体导管，其使用包括至少一个毛细通道的通道弹簧探针。 由释放时从基板弯曲的弹簧梁（例如，应力金属梁）形成，通道可以集成到弹簧梁中或形成在弹簧梁上。 由窄通道产生的毛细管力允许液体被通道弹簧探针收集，保持和分配。 由于可以使用传统的半导体工艺制造通道弹簧梁，所以可以实现显着的设计灵活性和成本效率。