COUPLING PIEZOELECTRIC MATERIAL GENERATED STRESSES TO DEVICES FORMED IN INTEGRATED CIRCUITS
    7.
    发明申请
    COUPLING PIEZOELECTRIC MATERIAL GENERATED STRESSES TO DEVICES FORMED IN INTEGRATED CIRCUITS 有权
    联合压电材料生成的应力到集成电路中形成的器件

    公开(公告)号:US20120270353A1

    公开(公告)日:2012-10-25

    申请号:US13532991

    申请日:2012-06-26

    IPC分类号: H01L21/02

    CPC分类号: H01L49/00 H01C10/103

    摘要: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiffener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

    摘要翻译: 用于将压电材料产生的应力耦合到集成电路的致动装置的耦合结构包括围绕压电(PE)材料形成的刚性加强结构和致动装置,该致动装置包括具有电阻的压阻(PR)材料 取决于施加的压力; 以及围绕PE材料和PR材料形成的软缓冲结构,缓冲结构设置在PE和PR材料之间以及加强件结构之间,其中加强件结构将PE和PR材料夹持到基底上,PE和PR材料 并且其中软缓冲结构允许PE材料相对于PR材料自由移动,从而将由施加的电压产生的应力耦合到PE材料到PR材料,从而改变PR材料的电阻。

    Coupling piezoelectric material generated stresses to devices formed in integrated circuits
    8.
    发明授权
    Coupling piezoelectric material generated stresses to devices formed in integrated circuits 有权
    将压电材料耦合到产生的应力到集成电路中形成的器件

    公开(公告)号:US08405279B2

    公开(公告)日:2013-03-26

    申请号:US13532991

    申请日:2012-06-26

    IPC分类号: H01L21/02

    CPC分类号: H01L49/00 H01C10/103

    摘要: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiffener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

    摘要翻译: 用于将压电材料产生的应力耦合到集成电路的致动装置的耦合结构包括围绕压电(PE)材料形成的刚性加强结构和致动装置,该致动装置包括具有电阻的压阻(PR)材料 取决于施加的压力; 以及围绕PE材料和PR材料形成的软缓冲结构,缓冲结构设置在PE和PR材料之间以及加强件结构之间,其中加强件结构将PE和PR材料夹持到基底上,PE和PR材料 并且其中软缓冲结构允许PE材料相对于PR材料自由移动,从而将由施加的电压产生的应力耦合到PE材料到PR材料,从而改变PR材料的电阻。

    Coupling piezoelectric material generated stresses to devices formed in integrated circuits
    9.
    发明授权
    Coupling piezoelectric material generated stresses to devices formed in integrated circuits 有权
    将压电材料耦合到产生的应力到集成电路中形成的器件

    公开(公告)号:US08247947B2

    公开(公告)日:2012-08-21

    申请号:US12632154

    申请日:2009-12-07

    IPC分类号: H01L41/00

    CPC分类号: H01L49/00 H01C10/103

    摘要: A coupling structure for coupling piezoelectric material generated stresses to an actuated device of an integrated circuit includes a rigid stiffener structure formed around a piezoelectric (PE) material and the actuated device, the actuated device comprising a piezoresistive (PR) material that has an electrical resistance dependent upon an applied pressure thereto; and a soft buffer structure formed around the PE material and PR material, the buffer structure disposed between the PE and PR materials and the stiffener structure, wherein the stiffener structure clamps both the PE and PR materials to a substrate over which the PE and PR materials are formed, and wherein the soft buffer structure permits the PE material freedom to move relative to the PR material, thereby coupling stress generated by an applied voltage to the PE material to the PR material so as change the electrical resistance of the PR material.

    摘要翻译: 用于将压电材料产生的应力耦合到集成电路的致动装置的耦合结构包括围绕压电(PE)材料形成的刚性加强结构和致动装置,该致动装置包括具有电阻的压阻(PR)材料 取决于施加的压力; 以及围绕PE材料和PR材料形成的软缓冲结构,缓冲结构设置在PE和PR材料之间以及加强件结构之间,其中加强件结构将PE和PR材料夹持到基底上,PE和PR材料 并且其中软缓冲结构允许PE材料相对于PR材料自由移动,从而将由施加的电压产生的应力耦合到PE材料到PR材料,从而改变PR材料的电阻。

    4-TERMINAL PIEZOELECTRONIC TRANSISTOR (PET)
    10.
    发明申请
    4-TERMINAL PIEZOELECTRONIC TRANSISTOR (PET) 审中-公开
    4端子电子晶体管(PET)

    公开(公告)号:US20130009668A1

    公开(公告)日:2013-01-10

    申请号:US13176880

    申请日:2011-07-06

    IPC分类号: H01L25/00 H01C7/10 H01L41/22

    摘要: A 4-terminal piezoelectronic transistor (PET) which includes a piezoelectric (PE) material disposed between first and second electrodes; an insulator material disposed on the second electrode; a third electrode disposed on the insulator material and a piezoresistive (PR) material disposed between the third electrode and a fourth electrode. An applied voltage across the first and second electrodes causing a pressure from the PE material to be applied to the PR material through the insulator material, the electrical resistance of the PR material being dependent upon the pressure applied by the PE material. The first and second electrodes are electrically isolated from the third and fourth electrodes. Also disclosed are logic devices fabricated from 4-terminal PETs and a method of fabricating a 4-terminal PET.

    摘要翻译: 4端子压电晶体管(PET),其包括设置在第一和第二电极之间的压电(PE)材料; 设置在所述第二电极上的绝缘体材料; 设置在绝缘体材料上的第三电极和设置在第三电极和第四电极之间的压阻(PR)材料。 在第一和第二电极两端施加的电压导致来自PE材料的压力通过绝缘体材料施加到PR材料上,PR材料的电阻取决于PE材料施加的压力。 第一和第二电极与第三和第四电极电隔离。 还公开了由4端子PET制造的逻辑器件和制造4端子PET的方法。