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    LIGHT EMITTING DIODE PACKAGE HAVING MULTIPLE MOLDING RESINS
    7.
    发明申请
    LIGHT EMITTING DIODE PACKAGE HAVING MULTIPLE MOLDING RESINS 有权
    具有多种成型树脂的发光二极管封装

    公开(公告)号：US20080303052A1

    公开(公告)日：2008-12-11

    申请号：US12196028

    申请日：2008-08-21

    申请人： Chung Hoon LEE ,  Do Hyung KIM ,  Keon-Young LEE

    发明人： Chung Hoon LEE ,  Do Hyung KIM ,  Keon-Young LEE

    IPC分类号： H01L33/00

    CPC分类号： H01L33/52 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014

    摘要： Disclosed is a light emitting diode (LED) package having multiple molding resins. The LED package includes a pair of lead terminals. At least portions of the pair of lead terminals are embedded in a package main body. The package main body has an opening through which the pair of lead terminals is exposed. An LED die is mounted in the opening and electrically connected to the pair of lead terminals. A first molding resin covers the LED die. A second molding resin with higher hardness than the first molding resin covers the first molding resin. Therefore, stress to be imposed on the LED die can be reduced and the deformation of the molding resins can be prevented.

    摘要翻译： 公开了具有多个成型树脂的发光二极管（LED）封装。 LED封装包括一对引线端子。 一对引线端子的至少一部分嵌入在封装主体中。 包装主体具有一对开口，一对引线端子通过该开口露出。 LED管芯安装在开口中并电连接到一对引线端子。 第一模塑树脂覆盖LED芯片。 具有比第一模塑树脂硬度更高的第二模塑树脂覆盖第一模塑树脂。 因此，可以减少施加在LED模具上的应力，并且可以防止模塑树脂的变形。

    LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME
    9.
    发明申请
    LIGHT EMITTING DEVICE HAVING A PLURALITY OF LIGHT EMITTING CELLS AND METHOD OF FABRICATING THE SAME 有权
    具有多个发光单元的发光装置及其制造方法

    公开(公告)号：US20090189166A1

    公开(公告)日：2009-07-30

    申请号：US12410101

    申请日：2009-03-24

    申请人： Chung Hoon LEE ,  Hong San Kim ,  James S. Speck

    发明人： Chung Hoon LEE ,  Hong San Kim ,  James S. Speck

    IPC分类号： H01L33/00

    CPC分类号： H01L27/153 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/48095 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01079

    摘要： Disclosed is a light emitting device having a plurality of light emitting cells. The light emitting device comprises a thermally conductive substrate, such as a SiC substrate, having a thermal conductivity higher than that of a sapphire substrate. The plurality of light emitting cells are connected in series on the thermally conductive substrate. Meanwhile, a semi-insulating buffer layer is interposed between the thermally conductive substrate and the light emitting cells. For example, the semi-insulating buffer layer may be formed of AlN or semi-insulating GaN. Since the thermally conductive substrate having a thermal conductivity higher than that of a sapphire substrate is employed, heat-dissipating performance can be enhanced as compared with a conventional sapphire substrate, thereby increasing the maximum light output of a light emitting device that is driven under a high voltage AC power source. In addition, since the semi-insulating buffer layer is employed, it is possible to prevent an increase in a leakage current through the thermally conductive substrate and between the light emitting cells.

    摘要翻译： 公开了具有多个发光单元的发光器件。 发光器件包括具有高于蓝宝石衬底的热导率的导热衬底，例如SiC衬底。 多个发光单元串联连接在导热基板上。 同时，在导热基板和发光单元之间插入半绝缘缓冲层。 例如，半绝缘缓冲层可以由AlN或半绝缘GaN形成。 由于采用具有高于蓝宝石基板的导热性的导热性基板，所以与以往的蓝宝石基板相比，能够提高散热性能，从而能够增大驱动下的发光元件的最大光输出 高压交流电源。 此外，由于采用了半绝缘缓冲层，因此可以防止通过导热基板和发光单元之间的漏电流的增加。

    LIGHT EMITTING DEVICE FOR AC POWER OPERATION
    10.
    发明申请
    LIGHT EMITTING DEVICE FOR AC POWER OPERATION 有权
    用于交流电源运行的发光装置

    公开(公告)号：US20110031891A1

    公开(公告)日：2011-02-10

    申请号：US12908692

    申请日：2010-10-20

    申请人： Chung Hoon LEE ,  James S. SPECK ,  Hong San KIM ,  Jae Jo KIM ,  Sung Han KIM ,  Jae Ho LEE

    发明人： Chung Hoon LEE ,  James S. SPECK ,  Hong San KIM ,  Jae Jo KIM ,  Sung Han KIM ,  Jae Ho LEE

    IPC分类号： H05B41/16

    CPC分类号： H05B33/0827 ,  H01L27/153 ,  H01L27/156 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/73265 ,  H05B33/02 ,  H05B33/08 ,  H05B33/0806 ,  H05B33/0815 ,  H05B33/0821 ,  H05B33/0824 ,  H05B33/083 ,  H05B33/0848 ,  H05B37/029

    摘要： Disclosed is an improved light-emitting device for an AC power operation. A conventional light emitting device employs an AC light-emitting diode having arrays of light emitting cells connected in reverse parallel. The arrays in the prior art alternately repeat on/off in response to a phase change of an AC power source, resulting in short light emission time during a ½ cycle and the occurrence of a flicker effect. An AC light-emitting device according to the present invention employs a variety of means by which light emission time is prolonged during a ½ cycle in response to a phase change of an AC power source and a flicker effect can be reduced. For example, the means may be switching blocks respectively connected to nodes between the light emitting cells, switching blocks connected to a plurality of arrays, or a delay phosphor. Further, there is provided an AC light-emitting device, wherein a plurality of arrays having the different numbers of light emitting cells are employed to increase light emission time and to reduce a flicker effect.

    摘要翻译： 公开了一种用于AC电力操作的改进的发光装置。 传统的发光器件采用具有反向并联连接的发光单元阵列的交流发光二极管。 现有技术中的阵列响应于AC电源的相变而交替重复开/关，导致在1/2周期期间的短发光时间和闪烁效应的发生。 根据本发明的交流发光装置采用各种手段，响应于​​交流电源的相变而在1/2周期期间发光时间延长，并且可以减少闪烁效应。 例如，装置可以是分别连接到发光单元，连接到多个阵列的切换块或延迟荧光体之间的节点的切换块。 此外，提供了一种交流发光装置，其中采用具有不同数量的发光单元的多个阵列来增加发光时间并减少闪烁效果。