-
公开(公告)号:US06403892B1
公开(公告)日:2002-06-11
申请号:US08669598
申请日:1996-06-24
申请人: Claudius Feger , Teresita Ordonez Graham , Kurt Rudolph Grebe , Alphonso Philip Lanzetta , John Joseph Liutkus , Linda Carolyn Matthew , Michael Jon Palmer , Nelson Russell Tanner , Ho-Ming Tong , Charles Haile Wilson , Helen Li Yeh
发明人: Claudius Feger , Teresita Ordonez Graham , Kurt Rudolph Grebe , Alphonso Philip Lanzetta , John Joseph Liutkus , Linda Carolyn Matthew , Michael Jon Palmer , Nelson Russell Tanner , Ho-Ming Tong , Charles Haile Wilson , Helen Li Yeh
IPC分类号: H05K100
CPC分类号: H01L24/45 , H01L21/481 , H01L23/49572 , H01L23/49894 , H01L24/85 , H01L2224/056 , H01L2224/05644 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/351 , H05K3/0017 , H05K3/3452 , H05K3/363 , H05K2201/10681 , H05K2201/10977 , H05K2203/176 , Y10T29/49121 , Y10T29/49155 , Y10T29/49165 , H01L2924/00 , H01L2224/48 , H01L2924/0002 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要: A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
摘要翻译: 适用于芯片载体应用的柔性或TAB产品,其中在功率和热循环期间由铜枝晶生长和引线弯曲引起的柔性可靠性问题通过将特殊涂层施加到柔性带的引导区域来减少。