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公开(公告)号:US20210252639A1
公开(公告)日:2021-08-19
申请号:US17252546
申请日:2019-06-07
Applicant: Corning Incorporated
Inventor: Michael Thomas Gallagher , Scott Michael Jarvis , Xinghua Li , Nicholas Ryan Wheeler
IPC: B23K26/34 , B23K26/06 , B23K26/067 , B29C64/295 , C03B19/02
Abstract: A method for forming a structure includes providing a glass or glass ceramic tubular structure (110) having an interior (150) and exterior surface (160) and at least a partially closed end region (140); heating the glass or glass ceramic tubular structure (110) to at least its softening point by: providing a laser beam; directing the laser beam (130) down the interior surface of the glass or glass ceramic tubular structure (110), at least some of the laser beam (130) directed at an angle greater than a predetermined incidence angle; and the laser beam (130) impinging on the closed end region (140) where at least some of the laser beam (130) is absorbed by the closed end region (140) of the glass or glass ceramic tubular structure; and moving at least one of: the glass or glass ceramic tubular structure or the end region relative to each other to form at least a two-dimensional shape from the glass or glass ceramic tubular structure.
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公开(公告)号:US10167220B2
公开(公告)日:2019-01-01
申请号:US15425517
申请日:2017-02-06
Applicant: CORNING INCORPORATED
Inventor: Daniel Robert Boughton , Scott Michael Jarvis
IPC: C03B5/02 , C03B5/225 , H05H1/24 , H05H1/46 , C03C3/06 , C03C3/062 , C03C3/064 , C03C3/078 , C03C3/083 , C03C3/085 , C03C3/087 , C03C3/089 , C03C3/091 , C03C3/12 , C03C3/145 , H05B7/08 , H05B7/12 , H05B7/22 , H05H1/28 , H05H1/30 , H05H1/34 , H05H1/50 , C03B5/185 , C03B5/193
Abstract: Disclosed herein are methods and apparatuses for adding thermal energy to a glass melt. Apparatuses for generating a thermal plasma disclosed herein comprise an electrode, a grounded electrode, a dielectric plasma confinement vessel extending between the two electrodes, and a magnetic field generator extending around the dielectric plasma confinement vessel. Also disclosed herein are methods for fining molten glass comprising generating a thermal plasma using the apparatuses disclosed herein and contacting the molten glass with the thermal plasma. Glass structures produced according to these methods are also disclosed herein.
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公开(公告)号:US20180237329A1
公开(公告)日:2018-08-23
申请号:US15752120
申请日:2016-08-12
Applicant: Corning Incorporated
Inventor: Christopher William Drewnowski , Michael Thomas Gallagher , Scott Michael Jarvis , Xinghua Li , Moussa N'Gom , Robert Stephen Wagner , Nicholas Ryan Wheeler
IPC: C03B23/24 , C03B19/02 , B23K26/342 , B29C64/118
CPC classification number: C03B23/245 , B23K26/342 , B29C64/106 , B29C64/118 , B33Y10/00 , B33Y30/00 , B33Y70/00 , B33Y80/00 , C03B19/02 , C03B23/20
Abstract: A method of printing a 3D object includes feeding one or more preformed materials from a feed outlet into a build zone in which a hot spot is located and using the hot spot to selectively heat the one or more preformed materials to a viscous state. Object layers are formed by depositing portions of the preformed materials on a build surface, or on another object layer on the build surface, while effecting relative motion between the build surface and the feed outlet.
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公开(公告)号:US20240034666A1
公开(公告)日:2024-02-01
申请号:US18227470
申请日:2023-07-28
Applicant: CORNING INCORPORATED
Inventor: Tiphaine Fevre , Scott Michael Jarvis , Adam Robert Sarafian , Emily Kathryn Sarafian , Joseph Martin Wright
Abstract: A fining package for a glass composition may include a sulfate or a sulfide in an amount from about 0.001 to about 1 mol % of the glass composition. The fining package may include a multivalent compound, such as CeO2, SnO2, or Fe2O3, in an amount from about 0.001 to about 1 mol % of the glass composition. The fining package may be sulfide-free. The fining package may be free from a reducing agent for reducing sulfate to sulfide. The fining package may be free of at least one of Cl, F, Sn, Ce, and As. The glass composition may be used to form glass tubing. The glass tubing may be used to form a pharmaceutical packaging.
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公开(公告)号:US11065860B2
公开(公告)日:2021-07-20
申请号:US15752120
申请日:2016-08-12
Applicant: Corning Incorporated
Inventor: Christopher William Drewnowski , Michael Thomas Gallagher , Scott Michael Jarvis , Xinghua Li , Moussa N'Gom , Robert Stephen Wagner , Nicholas Ryan Wheeler
IPC: B33Y10/00 , C03B19/02 , B33Y80/00 , B33Y30/00 , C03B23/20 , B23K26/342 , B29C64/118 , C03B23/24 , B33Y70/00
Abstract: A method of printing a 3D object includes feeding one or more preformed materials from a feed outlet into a build zone in which a hot spot is located and using the hot spot to selectively heat the one or more preformed materials to a viscous state. Object layers are formed by depositing portions of the preformed materials on a build surface, or on another object layer on the build surface, while effecting relative motion between the build surface and the feed outlet.
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公开(公告)号:US20170217811A1
公开(公告)日:2017-08-03
申请号:US15425517
申请日:2017-02-06
Applicant: CORNING INCORPORATED
Inventor: Daniel Robert Boughton , Scott Michael Jarvis
CPC classification number: C03B5/025 , C03B5/185 , C03B5/193 , C03B5/225 , C03C3/06 , C03C3/062 , C03C3/064 , C03C3/078 , C03C3/083 , C03C3/085 , C03C3/087 , C03C3/089 , C03C3/091 , C03C3/125 , C03C3/145 , H05B7/08 , H05B7/12 , H05B7/22 , H05H1/2406 , H05H1/28 , H05H1/30 , H05H1/34 , H05H1/46 , H05H1/50 , H05H2001/2456 , H05H2001/2462 , H05H2001/4645 , H05H2001/4692 , Y02P40/57
Abstract: Disclosed herein are methods and apparatuses for adding thermal energy to a glass melt. Apparatuses for generating a thermal plasma disclosed herein comprise an electrode, a grounded electrode, a dielectric plasma confinement vessel extending between the two electrodes, and a magnetic field generator extending around the dielectric plasma confinement vessel. Also disclosed herein are methods for fining molten glass comprising generating a thermal plasma using the apparatuses disclosed herein and contacting the molten glass with the thermal plasma. Glass structures produced according to these methods are also disclosed herein.
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