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    Method of fabrication SOI devices with accurately defined monocrystalline source/drain extensions
    2.
    发明授权
    Method of fabrication SOI devices with accurately defined monocrystalline source/drain extensions 失效
    制造具有精确定义的单晶源极/漏极延伸的SOI器件的方法

    公开(公告)号：US06743689B1

    公开(公告)日：2004-06-01

    申请号：US10341427

    申请日：2003-01-14

    申请人： Eric N. Paton ,  Robert B. Ogle ,  Cyrus E. Tabery ,  Qi Xiang ,  Bin Yu

    发明人： Eric N. Paton ,  Robert B. Ogle ,  Cyrus E. Tabery ,  Qi Xiang ,  Bin Yu

    IPC分类号： H01L21336

    CPC分类号： H01L21/26513 ,  H01L21/26506 ,  H01L21/2658 ,  H01L21/268 ,  H01L29/458 ,  H01L29/66492 ,  H01L29/665 ,  H01L29/6653 ,  H01L29/66553 ,  H01L29/66772 ,  H01L29/78612 ,  H01L29/78621

    摘要： Semiconductor devices comprising fully and partially depleted SOI transistors with accurately defined monocrystalline or substantially completely monocrystalline silicon source/drain extensions are fabricated by selectively pre-amorphizing intended source/drain extensions, ion implanting dopants into the pre-amorphized regions and laser thermal annealing to effect crystallization and activation of the source/drain extensions. Embodiments include forming a gate electrode over an SOI substrate with a gate dielectric layer therebetween, forming silicon nitride sidewall spacers on the side surfaces of the gate electrode, forming source/drain regions, forming a thermal oxide layer on the gate electrode and on the source/drain regions, removing the silicon nitride sidewall spacers, pre-amorphizing the intended source/drain extension regions, ion implanting impurities into the pre-amorphized regions and laser thermal annealing to crystallize the pre-amorphized regions and to activate the source/drain extensions.

    摘要翻译： 包括具有精确定义的单晶或基本上完全单晶硅源极/漏极延伸的完全和部分耗尽的SOI晶体管的半导体器件通过将预期的源/漏延伸，离子注入掺杂剂预先非晶化以进行预非晶化区域和激光热退火来制造 源/漏扩展的结晶和激活。 实施例包括在SOI衬底之上形成栅极电介质层，在栅电极之间形成氮化硅侧壁间隔物，形成源/漏区，在栅电极和源极上形成热氧化层 漏极区域，去除氮化硅侧壁间隔物，使预期的源极/漏极延伸区域预非晶化，离子注入杂质到预非晶化区域和激光热退火以使预非晶化区域结晶并激活源极/漏极延伸部分 。

    Scanning laser thermal annealing
    3.
    发明授权
    Scanning laser thermal annealing 有权
    扫描激光热退火

    公开(公告)号：US07351638B1

    公开(公告)日：2008-04-01

    申请号：US10021782

    申请日：2001-12-18

    申请人： Cyrus E. Tabery ,  Eric N. Paton ,  Bin Yu ,  Qi Xiang ,  Robert B. Ogle

    发明人： Cyrus E. Tabery ,  Eric N. Paton ,  Bin Yu ,  Qi Xiang ,  Robert B. Ogle

    IPC分类号： H01L21/336

    CPC分类号： H01L21/268 ,  H01L21/26513 ,  H01L29/6659

    摘要： A method of manufacturing a semiconductor device includes forming a gate electrode over a substrate, implanting dopants into the substrate and activating the dopants using laser thermal annealing. During annealing, the laser and substrate are moved relative to one another, and the movement of the laser and the substrate relative to one another does not pause between and during activating one portion of the source/drain regions and activating another portion of the source/drain regions. Each pulse from the laser can respectively irradiate different portions of the source/drain regions, and a spot area of the laser is less than 50 millimeter2.

    摘要翻译： 一种制造半导体器件的方法包括在衬底上形成栅电极，将掺杂剂注入到衬底中并使用激光热退火激活掺杂剂。 在退火期间，激光器和衬底相对于彼此移动，并且激光器和衬底相对于彼此的运动在激活源极/漏极区域的一部分之间和在激活源极/漏极区域的另一部分之间不间断， 漏区。 来自激光器的每个脉冲可以分别照射源极/漏极区域的不同部分，并且激光器的斑点面积小于50毫米2。

    In-situ monitoring during laser thermal annealing
    5.
    发明授权
    In-situ monitoring during laser thermal annealing 有权
    激光热退火期间的原位监测

    公开(公告)号：US06656749B1

    公开(公告)日：2003-12-02

    申请号：US10013354

    申请日：2001-12-13

    申请人： Eric N. Paton ,  Robert B. Ogle ,  Bin Yu ,  Cyrus E. Tabery ,  Qi Xiang

    发明人： Eric N. Paton ,  Robert B. Ogle ,  Bin Yu ,  Cyrus E. Tabery ,  Qi Xiang

    IPC分类号： H01L2100

    CPC分类号： H01L21/02675 ,  H01L21/2026 ,  H01L21/268 ,  H01L22/12 ,  H01L22/20 ,  H01L29/6659

    摘要： A method of manufacturing a semiconductor device includes thermal annealing source/drain regions with a laser, measuring a depth of the source/drain regions, and adjusting a parameter of the laser used in the thermal annealing process. After the laser is adjusted, the source/drain regions are laser thermal annealed again until a desired depth of the source/drain regions is obtained. An apparatus for processing a semiconductor device includes a chamber, a laser, a measuring device, and a controller. The semiconductor device is positioned within the chamber for processing. The laser is used to laser thermal anneal the semiconductor device within the chamber. The measuring device measures a depth of source/drain regions in the semiconductor device when the semiconductor device is within the chamber, and the controller receives measurement information from the measuring device and adjusts parameters of the laser.

    摘要翻译： 制造半导体器件的方法包括：用激光热退火源极/漏极区域，测量源极/漏极区域的深度，以及调整在热退火过程中使用的激光器的参数。 在调整激光器之后，源极/漏极区域被再次激光热退火，直到得到所需的源极/漏极区域的深度。 一种用于处理半导体器件的装置，包括腔室，激光器，测量装置和控制器。 半导体器件位于腔室内用于处理。 激光器用于对腔室内的半导体器件进行激光热退火。 当半导体器件在腔室内时，测量装置测量半导体器件中的源极/漏极区域的深度，并且控制器从测量装置接收测量信息并调整激光器的参数。

    Reduced dopant deactivation of source/drain extensions using laser thermal annealing
    7.
    发明授权
    Reduced dopant deactivation of source/drain extensions using laser thermal annealing 有权
    使用激光热退火减少源/漏扩展的掺杂剂失活

    公开(公告)号：US06812106B1

    公开(公告)日：2004-11-02

    申请号：US10341366

    申请日：2003-01-14

    申请人： Qi Xiang ,  Robert B. Ogle ,  Eric N. Paton ,  Cyrus E. Tabery ,  Bin Yu

    发明人： Qi Xiang ,  Robert B. Ogle ,  Eric N. Paton ,  Cyrus E. Tabery ,  Bin Yu

    IPC分类号： H01L21336

    CPC分类号： H01L21/28194 ,  H01L21/26506 ,  H01L21/26586 ,  H01L21/268 ,  H01L29/517 ,  H01L29/66492 ,  H01L29/66545 ,  H01L29/66553 ,  H01L29/66606

    摘要： Dopant deactivation of source/drain extensions during silicidation is reduced by forming deep source/drain regions using a disposable dummy gate as a mask, forming metal silicide layers on the deep source/drain regions, removing the dummy gate and then forming the source/drain extensions using laser thermal annealing. Embodiments include angular ion implantation, after removing the dummy gate, to form spaced apart pre-amorphized regions, ion implanting to form source/drain extension implants extending deeper into the substrate than the pre-amorphized regions, and then laser thermal annealing to activate the source/drain extensions having a higher impurity concentration at the main surface of the substrate than deeper into the substrate. Subsequent processing includes forming sidewall spacers, a gate dielectric layer and then the gate electrode.

    摘要翻译： 通过使用一次性虚拟栅极作为掩模形成深源极/漏极区域，在深度源极/漏极区域形成金属硅化物层，去除虚拟栅极，然后形成源极/漏极 扩展使用激光热退火。 实施例包括角度离子注入，在去除虚拟栅极之后，形成间隔开的非晶化区域，离子注入以形成比预非晶化区域更深地延伸到衬底中的源极/漏极延伸植入物，然后激光热退火以激活 源/漏扩展在衬底的主表面具有较高的杂质浓度，而不是深入衬底。 随后的处理包括形成侧壁间隔物，栅介质层，然后形成栅电极。

    Formation of deep amorphous region to separate junction from end-of-range defects
    8.
    发明授权
    Formation of deep amorphous region to separate junction from end-of-range defects 有权
    形成深非晶区域以将结点与端范围缺陷分离

    公开(公告)号：US06680250B1

    公开(公告)日：2004-01-20

    申请号：US10145740

    申请日：2002-05-16

    申请人： Eric N. Paton ,  Robert B. Ogle ,  Cyrus E. Tabery ,  Qi Xiang ,  Bin Yu

    发明人： Eric N. Paton ,  Robert B. Ogle ,  Cyrus E. Tabery ,  Qi Xiang ,  Bin Yu

    IPC分类号： H01L2144

    CPC分类号： H01L29/6659 ,  H01L21/26506 ,  H01L21/26513 ,  H01L21/268

    摘要： A method of manufacturing a MOSFET semiconductor device includes forming a gate electrode over a substrate and a gate oxide between the gate electrode and the substrate. Inert dopants are then implanted within the substrate to form amorphized source/drain regions in the substrate extending to a first depth significantly greater than the intended junction depth. The amorphized source/drain regions are implanted with source/drain dopants such that the dopants extend into the substrate to a second depth less than the first depth, above and spaced apart from the end-of-range defect region created at the first depth by the amorphization process. Laser thermal annealing recrystallizes the amorphous regions, activates the source/drain regions and forms source/drain junctions. Because the recrystallization front velocity towards the substrate main surface is greater than the dopant atom velocity in the liquid substrate during laser thermal annealing, the junctions are not pushed down to the amorphous/crystalline silicon interface. Thus, end-of-range defects are located in a region below and spaced apart from the junctions, and the defects are not located in the activated source/drain regions. Junction leakage as a result of the end-of-range defects is thereby reduced.

    摘要翻译： 一种制造MOSFET半导体器件的方法包括：在栅极电极和衬底之间在衬底上形成栅极电极和栅极氧化物。 然后将惰性掺杂剂注入衬底内以在衬底中形成非晶化的源极/漏极区域，延伸到明显大于预期结点深度的第一深度。 非晶化源极/漏极区域注入源极/漏极掺杂剂，使得掺杂剂延伸到衬底中的第二深度小于第一深度的第二深度，在第一深度之上，并且与在第一深度处产生的端部范围缺陷区域间隔开 非晶化过程。 激光热退火使非晶区再结晶，激活源极/漏极区并形成源极/漏极结。 因为朝向衬底主表面的再结晶前向速度大于激光热退火期间液体衬底中的掺杂剂原子速度，所以接合点不被推到非晶/硅晶界面。 因此，距离范围缺陷位于与接合点下方和间隔开的区域中，并且缺陷不位于活化的源极/漏极区域中。 因此，由于距离范围缺陷导致的结漏电减少。

    Low-temperature post-dopant activation process
    9.
    发明授权
    Low-temperature post-dopant activation process 有权
    低温后掺杂剂激活过程

    公开(公告)号：US06902966B2

    公开(公告)日：2005-06-07

    申请号：US09983625

    申请日：2001-10-25

    申请人： Bin Yu ,  Robert B. Ogle ,  Eric N. Paton ,  Cyrus E. Tabery ,  Qi Xiang

    发明人： Bin Yu ,  Robert B. Ogle ,  Eric N. Paton ,  Cyrus E. Tabery ,  Qi Xiang

    IPC分类号： H01L21/28 ,  H01L21/20 ,  H01L21/265 ,  H01L21/268 ,  H01L21/336 ,  H01L29/417 ,  H01L29/78 ,  H01L21/00

    CPC分类号： H01L29/665 ,  H01L21/268

    摘要： A method of manufacturing a MOSFET semiconductor device comprises forming a gate electrode over a substrate and a gate oxide between the gate electrode and the substrate; forming source/drain extensions in the substrate; forming first and second sidewall spacers; implanting dopants within the substrate to form source/drain regions in the substrate adjacent to the sidewalls spacers; laser thermal annealing to activate the source/drain regions; depositing a layer of nickel over the source/drain regions; and annealing to form a nickel silicide layer disposed on the source/drain regions. The source/drain extensions and sidewall spacers are adjacent to the gate electrode. The source/drain extensions can have a depth of about 50 to 300 angstroms, and the source/drain regions can have a depth of about 400 to 1000 angstroms. The annealing is at temperatures from about 350 to 500° C.

    摘要翻译： 一种制造MOSFET半导体器件的方法包括：在栅极电极和衬底之间形成衬底上的栅电极和栅极氧化物; 在衬底中形成源极/漏极延伸部; 形成第一和第二侧壁间隔物; 在所述衬底内注入掺杂剂以在所述衬底中邻近所述侧壁间隔物形成源/漏区; 激光热退火激活源/漏区; 在源极/漏极区域上沉积镍层; 并退火以形成设置在源/漏区上的硅化镍层。 源极/漏极延伸部和侧壁间隔物与栅电极相邻。 源极/漏极延伸部可以具有约50至300埃的深度，并且源极/漏极区域可以具有约400至1000埃的深度。 退火温度在约350-500℃

    Polysilicon tilting to prevent geometry effects during laser thermal annealing
    10.
    发明授权
    Polysilicon tilting to prevent geometry effects during laser thermal annealing 失效
    多晶硅瓷砖，以防止激光热退火过程中的几何效应

    公开(公告)号：US06867080B1

    公开(公告)日：2005-03-15

    申请号：US10460165

    申请日：2003-06-13

    申请人： Eric N. Paton ,  Robert B. Ogle ,  Cyrus E. Tabery ,  Qi Xiang ,  Bin Yu

    发明人： Eric N. Paton ,  Robert B. Ogle ,  Cyrus E. Tabery ,  Qi Xiang ,  Bin Yu

    IPC分类号： H01L21/20 ,  H01L21/268 ,  H01L21/28 ,  H01L21/321 ,  H01L21/8234 ,  H01L21/338 ,  H01L21/331 ,  H01L21/94

    CPC分类号： H01L21/28176 ,  H01L21/2026 ,  H01L21/268 ,  H01L21/28035 ,  H01L21/321 ,  H01L21/823437 ,  Y10S438/926

    摘要： A method is provided for eliminating uneven heating of substrate active areas during laser thermal annealing (LTA) due to variations in gate electrode density. Embodiments include adding dummy structures, formed simultaneously with the gate electrodes, to “fill in” the spaces between isolated gate electrodes, such that the spacing between the gate electrodes and the dummy structures is the same as the spacing between the densest array of device structures on the substrate surface. Since the surface features (i.e., the gate electrodes and the dummy structures) appear substantially uniform to the LTA laser, the laser radiation is uniformly absorbed by the substrate, and the substrate surface is evenly heated.

    摘要翻译： 提供了一种用于消除激光热退火（LTA）期间基板有源区的不均匀加热的方法，这是由于栅电极密度的变化。 实施例包括添加与栅电极同时形成的虚拟结构以“填充”隔离栅电极之间的空间，使得栅电极和虚拟结构之间的间隔与器件结构最密集阵列之间的间隔相同 在基板表面上。 由于表面特征（即，栅电极和虚拟结构）对于LTA激光器而言基本上均匀，激光辐射被基板均匀地吸收，并且基板表面被均匀地加热。