公开(公告)号：US20250140703A1

公开(公告)日：2025-05-01

申请号：US19004605

申请日：2024-12-30

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroshi KUDO ,  Miyuki SUZUKI ,  Shohei YAMADA

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/12

Abstract: A through electrode substrate according to an embodiment of the present disclosure includes a substrate having a first surface, a second surface, and a through-hole that penetrates between the first surface and the second surface and a through electrode disposed inside of the through-hole. The through electrode includes a first portion that closes part of the through-hole adjacent to the first surface and a second portion disposed along the internal surface of the through-hole. The thinnest part of the first portion in a direction perpendicular to the first surface has a thickness of A, the thinnest part of the second portion has a thickness of B, and the diameter of the through-hole on the first surface has a length of C. The relationship A

公开(公告)号：US20190259696A1

公开(公告)日：2019-08-22

申请号：US16322741

申请日：2017-08-04

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Shinji MAEKAWA ,  Hiroshi KUDO ,  Takamasa TAKANO ,  Hiroshi MAWATARI ,  Masaaki ASANO

IPC: H01L23/498 ,  H01L21/48

Abstract: A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.

公开(公告)号：US20240096808A1

公开(公告)日：2024-03-21

申请号：US18264281

申请日：2022-01-31

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroshi KUDO ,  Takamasa TAKANO

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/48 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/5385 ,  H01L23/481 ,  H01L23/5381 ,  H01L23/5383 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A semiconductor package includes a first interposer that includes a first face and a second face, a second interposer that includes a third face and a fourth face, and that is arrayed with the first interposer in a first direction, a third interposer that includes a fifth face and a sixth face, and that is situated between the first interposer and the second interposer in the first direction, a first semiconductor element that overlaps the first face and the fifth face in plan view, and a second semiconductor element that overlaps the third face and the fifth face in plan view. The third interposer includes wiring that electrically connects the first semiconductor element and the second semiconductor element.

公开(公告)号：US20210035874A1

公开(公告)日：2021-02-04

申请号：US16306883

申请日：2017-06-02

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroshi KUDO ,  Takamasa TAKANO

IPC: H01L23/15 ,  H01L23/14

Abstract: A manufacturing method of a through electrode substrate includes: a step of preparing a substrate including a first surface and a second surface positioned oppositely to the first surface, and provided with a through hole; a step of providing a sealing layer blocking the through hole on the first surface of the substrate; an electrode forming step of forming a through electrode inside the through hole, the through electrode having a fist part extending along a sidewall of the through hole, and a second part connected to the first part and spreading along the sealing layer; and a step of removing the sealing layer.

公开(公告)号：US20220148973A1

公开(公告)日：2022-05-12

申请号：US17601960

申请日：2020-04-15

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroshi KUDO ,  Miyuki SUZUKI ,  Shohei YAMADA

IPC: H01L23/538 ,  H01L23/12 ,  H01L21/48

Abstract: A through electrode substrate according to an embodiment of the present disclosure includes a substrate having a first surface, a second surface, and a through-hole that penetrates between the first surface and the second surface and a through electrode disposed inside of the through-hole. The through electrode includes a first portion that closes part of the through-hole adjacent to the first surface and a second portion disposed along the internal surface of the through-hole. The thinnest part of the first portion in a direction perpendicular to the first surface has a thickness of A, the thinnest part of the second portion has a thickness of B, and the diameter of the through-hole on the first surface has a length of C. The relationship A

公开(公告)号：US20220059422A1

公开(公告)日：2022-02-24

申请号：US17516011

申请日：2021-11-01

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Hiroshi KUDO ,  Takamasa TAKANO

IPC: H01L23/15 ,  H01L23/14

Abstract: A manufacturing method of a through electrode substrate includes: a step of preparing a substrate including a first surface and a second surface positioned oppositely to the first surface, and provided with a through hole; a step of providing a sealing layer blocking the through hole on the first surface of the substrate; an electrode forming step of forming a through electrode inside the through hole, the through electrode having a first part extending along a sidewall of the through hole, and a second part connected to the first part and spreading along the sealing layer; and a step of removing the sealing layer.

公开(公告)号：US20220328353A1

公开(公告)日：2022-10-13

申请号：US17752062

申请日：2022-05-24

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Shinji MAEKAWA ,  Hiroshi KUDO ,  Takamasa TAKANO ,  Hiroshi MAWATARI ,  Masaaki ASANO

IPC: H01L21/768 ,  H01L21/3205 ,  H01L23/13 ,  H01L23/14 ,  H01L23/48 ,  H01L23/532 ,  H05K1/11 ,  H01L23/522 ,  H01L23/12 ,  H05K3/40

Abstract: A through electrode substrate includes a substrate provided with a through hole; a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on a first surface of the substrate and connected to the sidewall portion; an inorganic film that at least partially covers the first portion of the through electrode from the first side and is provided with an opening positioned on the first portion; and a first wiring structure including at least a first wiring layer having an insulation layer that is positioned to the first side of the inorganic film and includes at least an organic layer provided with an opening communicating with the opening of the inorganic film, and an electroconductive layer connected to the first portion of the through electrode through the opening of the inorganic film and the opening of the insulation layer.

公开(公告)号：US20220028772A1

公开(公告)日：2022-01-27

申请号：US17497261

申请日：2021-10-08

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Shinji MAEKAWA ,  Hiroshi KUDO ,  Takamasa TAKANO ,  Hiroshi MAWATARI ,  Masaaki ASANO

IPC: H01L23/498 ,  H01L21/48 ,  H05K3/46 ,  H01L23/15

Abstract: A through electrode substrate includes a substrate provided with a through hole, a through electrode positioned in the through hole, and a first wiring structure including at least a first wiring layer positioned on a first surface of the substrate, and a second wiring layer positioned on the first wiring layer. The first wiring layer and the second wiring layer respectively have an insulation layer and an electroconductive layer. A first insulation layer of the first wiring layer includes at least an organic layer. At least one wiring layer of the first wiring structure includes an inorganic layer having insulation properties, the inorganic layer being positioned to a first side of the organic layer of the first insulation layer of the first wiring layer.

公开(公告)号：US20210175121A1

公开(公告)日：2021-06-10

申请号：US17178659

申请日：2021-02-18

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Shinji MAEKAWA ,  Hiroshi KUDO ,  Takamasa TAKANO ,  Hiroshi MAWATARI ,  Masaaki ASANO

IPC: H01L21/768 ,  H01L21/3205 ,  H01L23/13 ,  H01L23/14 ,  H01L23/48 ,  H01L23/532 ,  H05K1/11 ,  H01L23/522 ,  H01L23/12 ,  H05K3/40

Abstract: A method of manufacturing a through electrode substrate, the method includes: preparing a substrate including a first surface positioned on a first side, and a second surface positioned on a second side opposite to the first side, the substrate being provided with a through hole; forming a through electrode having a sidewall portion extending along a sidewall of the through hole, and a first portion positioned on the first surface of the substrate and connected to the sidewall portion; forming an organic film inside the through hole; forming an inorganic film at least partially covering the first portion of the through electrode from the first side; forming an insulation layer positioned to the first side of the inorganic film; and forming an electroconductive layer passing through the inorganic film and the insulation layer so as to be connected to the first portion of the through electrode.

公开(公告)号：US20190287853A1

公开(公告)日：2019-09-19

申请号：US16325911

申请日：2017-08-21

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Shinji MAEKAWA ,  Hiroshi KUDO ,  Takamasa TAKANO ,  Hiroshi MAWATARI ,  Masaaki ASANO

IPC: H01L21/768 ,  H01L23/532 ,  H01L21/3205 ,  H01L23/48 ,  H01L23/13 ,  H01L23/14

Abstract: A through electrode substrate includes: a substrate including first and second surfaces respectively on a first side and a second side opposite to the first, the substrate having a through hole; and a through electrode. The through electrode has a sidewall portion along the through hole sidewall, and a first portion the first surface and connected to the sidewall portion. The through electrode substrate includes: an organic film inside the through hole; an inorganic film that at least partially covers the through electrode first portion from the first side and has an opening on the first portion; and a first wiring layer having an insulation layer to the inorganic film first side and includes an organic layer with an opening communicating with the inorganic film opening, and an electroconductive layer connected to the through electrode first portion through the inorganic film opening and the insulation layer opening.