SPIRAL SHIELDING ON A HIGH SPEED CABLE

    公开(公告)号:US20220037057A1

    公开(公告)日:2022-02-03

    申请号:US16983489

    申请日:2020-08-03

    申请人: DELL PRODUCTS, LP

    IPC分类号: H01B11/18 H01B13/26 H01B13/00

    摘要: A dual axial cable includes first and second signal conductors and a shield. The first and second signal conductors transmit a differential signal. The shield includes a foil wrap spirally wrapped around the first and second conductors to form a plurality of foil wrap sections. Each of the foil wrap sections overlaps an adjacent foil wrap section. The periodicity of a pitch of each of the overlaps varies along a length of the dual axial cable.

    System and method for optimizing the design of circuit traces in a printed circuit board for high speed communications

    公开(公告)号:US11068778B2

    公开(公告)日:2021-07-20

    申请号:US15152073

    申请日:2016-05-11

    申请人: DELL PRODUCTS, LP

    IPC分类号: G06N3/08 G06F30/394

    摘要: A method includes training an artificial neural network with training data that comprises a sets of design parameter values for design parameters for circuit traces in a high speed communication link, determining an output formula that relates a sets of design parameters to a corresponding output parameter for the circuit traces in response to training the artificial neural network, running the output formula using a second set of design parameter values to obtain a corresponding set of output parameters for the circuit traces, determining that the corresponding set of output parameters differ from a set of modeled output parameters by less than a predefined percentage, and fabricating a circuit trace in a printed circuit board based upon the output formula in response to determining that the corresponding set of output parameters differ from the set of modeled output parameters by less than the predefined percentage.

    Printed Circuit Board Having Vias Arranged for High Speed Serial Differential Pair Data Links

    公开(公告)号:US20190289710A1

    公开(公告)日:2019-09-19

    申请号:US15923494

    申请日:2018-03-16

    申请人: DELL PRODUCTS, LP

    IPC分类号: H05K1/02 H05K1/11 G06F13/42

    摘要: A printed circuit board includes a differential signal via pairs to route differential signal between layers of the printed circuit board. A first differential signal via pair is oriented in a first orientation and a second differential signal via pair is oriented perpendicular to the first orientation. The second differential signal via pair is located such that a midpoint of a first line segment drawn between centers of first and second vias of the second differential signal pair intersects a first ray drawn from a center of a first via of the first differential signal via pair through a center of a second via of the first differential signal via pair. Further, the second differential signal via pair is located such that the midpoint of the first line segment is at a characteristic via-to-via pitch distance for the printed circuit board from the center of the second via of the first differential signal via pair.

    System and Method to Dynamically Increase Memory Channel Robustness at High Transfer Rates

    公开(公告)号:US20190227885A1

    公开(公告)日:2019-07-25

    申请号:US15876866

    申请日:2018-01-22

    申请人: DELL PRODUCTS, LP

    IPC分类号: G06F11/14 G06F3/06 G06F11/10

    摘要: A dynamic random access memory (DRAM) device includes an on-die termination (ODT) controller including an input to receive an ODT signal from a memory controller, and ODT circuitry to terminate an interface circuit, the interface circuit to provide a data signal between the memory controller and the DRAM device. The ODT controller is configured in a first impedance switching mode to terminate the interface circuit at a first impedance level in response to a first state of the ODT signal, to terminate the interface circuit at a second impedance level in response to a second state of the ODT signal, and to terminate the interface circuit at a third impedance level in response to a change in the ODT signal from the first state to the second state, the third impedance level being between the first impedance level and the second impedance level.

    System and method to enhance feed-forward equalization in a high-speed serial interface

    公开(公告)号:US10298420B1

    公开(公告)日:2019-05-21

    申请号:US15926525

    申请日:2018-03-20

    申请人: DELL PRODUCTS, LP

    IPC分类号: H04L25/03 H04L7/00

    摘要: A high-speed serial data interface includes a transmitter and a receiver. The transmitter includes a feed-forward equalization (FFE) module. The FFE module has a main tap and at least one secondary tap. In a first mode, a sum of absolute values of a main tap compensation value and a secondary tap compensation value of each one of the at least one secondary tap is equal to one. In a second mode, the main tap compensation value has a unity gain equal to one, and each secondary tap compensation value is greater than or equal to the secondary tap compensation value in the first mode divided by the main tap compensation value in the first mode.

    Surface mount connector pad
    9.
    发明授权

    公开(公告)号:US10292266B2

    公开(公告)日:2019-05-14

    申请号:US15963625

    申请日:2018-04-26

    申请人: DELL PRODUCTS, LP

    IPC分类号: H05K1/02 H05K1/11 H05K1/18

    摘要: A circuit board includes first and second lines of surface mount pads, and a trace. The surface mount pads within the first line extend from a first edge of the circuit board toward a second edge of the circuit board. The surface mount pads within the second line extend from the first edge of the circuit board toward the second edge of the circuit board, and the surface mount pads within the second line are further from a third edge of the circuit board as compared to the surface mount pads within the first line. The trace is located on a top surface of the circuit board, and extends from the third edge to a fourth edge of the circuit board. The spacing between first adjacent surface mount pads within the first line enables the trace to be routed between the first adjacent surface mount pads with less crosstalk between signals on the trace and signals on the surface mount pads within the first line.