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公开(公告)号:US11506849B2
公开(公告)日:2022-11-22
申请号:US17349398
申请日:2021-06-16
Applicant: Delta Electronics, Inc.
Inventor: Kuang-Yao Chen , Kao-Chi Chen , Wei-Chan Hsu , Gow-Zin Yiu
Abstract: The disclosure relates to an optical transceiver and a manufacturing method thereof. The optical transceiver includes a substrate, a thermal-conductive substrate, a first metal wiring structure, a light-transceiving element and an optical fiber array. The substrate has an opening, and the thermal-conductive substrate is embedded within the opening. The first metal wiring structure is integrally formed on the substrate and the thermal-conductive substrate through an electroplating or a wire-printing process. The light-transceiving element is disposed on the thermal-conductive substrate and is electrically connected to the first metal wiring structure. The optical fiber array is arranged on the thermal-conductive substrate for communication with the light-transceiving element.
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公开(公告)号:US20220252801A1
公开(公告)日:2022-08-11
申请号:US17349398
申请日:2021-06-16
Applicant: Delta Electronics, Inc.
Inventor: Kuang-Yao Chen , Kao-Chi Chen , Wei-Chan Hsu , Gow-Zin Yiu
Abstract: The disclosure relates to an optical transceiver and a manufacturing method thereof. The optical transceiver includes a substrate, a thermal-conductive substrate, a first metal wiring structure, a light-transceiving element and an optical fiber array. The substrate has an opening, and the thermal-conductive substrate is embedded within the opening. The first metal wiring structure is integrally formed on the substrate and the thermal-conductive substrate through an electroplating or a wire-printing process. The light-transceiving element is disposed on the thermal-conductive substrate and is electrically connected to the first metal wiring structure. The optical fiber array is arranged on the thermal-conductive substrate for communication with the light-transceiving element.
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公开(公告)号:US09182558B2
公开(公告)日:2015-11-10
申请号:US13907183
申请日:2013-05-31
Applicant: DELTA ELECTRONICS, INC.
Inventor: Hong-Bin You , Gow-Zin Yiu , Chia-Kai Weng
IPC: G02B6/42
CPC classification number: G02B6/4284 , G02B6/4261
Abstract: A communication module includes a housing member, an electronic module, and a slidable mechanism. The housing member includes at least one fastening and releasing region, which is disposed on an external surface thereof. The fastening and releasing region has a first slant. The electronic module is partially disposed within the housing member. The slidable mechanism includes at least one extension arm with a second slant. The extension arm is accommodated within the corresponding fastening and releasing region. The second slant is aligned with the first slant, and a slope of the second slant is larger than a slope of the first slant.
Abstract translation: 通信模块包括壳体构件,电子模块和可滑动机构。 壳体构件包括设置在其外表面上的至少一个紧固和释放区域。 紧固和释放区域具有第一倾斜。 电子模块部分地设置在壳体构件内。 可滑动机构包括具有第二倾斜的至少一个延伸臂。 延伸臂容纳在相应的紧固和释放区域内。 第二斜面与第一斜面对准,第二斜面的斜率大于第一斜面的斜率。
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公开(公告)号:US20140153195A1
公开(公告)日:2014-06-05
申请号:US13907183
申请日:2013-05-31
Applicant: DELTA ELECTRONICS, INC.
Inventor: Hong-Bin You , Gow-Zin Yiu , Chia-Kai Weng
IPC: G02B6/42
CPC classification number: G02B6/4284 , G02B6/4261
Abstract: A communication module includes a housing member, an electronic module, and a slidable mechanism. The housing member includes at least one fastening and releasing region, which is disposed on an external surface thereof. The fastening and releasing region has a first slant. The electronic module is partially disposed within the housing member. The slidable mechanism includes at least one extension arm with a second slant. The extension arm is accommodated within the corresponding fastening and releasing region. The second slant is aligned with the first slant, and a slope of the second slant is larger than a slope of the first slant.
Abstract translation: 通信模块包括壳体构件,电子模块和可滑动机构。 壳体构件包括设置在其外表面上的至少一个紧固和释放区域。 紧固和释放区域具有第一倾斜。 电子模块部分地设置在壳体构件内。 可滑动机构包括具有第二倾斜的至少一个延伸臂。 延伸臂容纳在相应的紧固和释放区域内。 第二斜面与第一斜面对准,第二斜面的斜率大于第一斜面的斜率。
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