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公开(公告)号：US20230391905A1
公开(公告)日：2023-12-07
申请号：US18267768
申请日：2021-11-18
Applicant: DIC Corporation
Inventor： Ryuichi MATSUOKA , Lichen YANG , Hiroyoshi KANNARI
IPC: C08F136/22
CPC classification number: C08F136/22
Abstract: An object is to provide a cured product superior in heat resistance (high glass transition temperature) and dielectric properties (low dielectric properties) by using a curable resin having a specific structure and superior in storage stability. Specifically, a curable resin represented by general formula (1) below and having a hydroxyl group concentration of 0.005 to 3800 mmol/kg is provided.
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公开(公告)号：US20240052093A1
公开(公告)日：2024-02-15
申请号：US18021381
申请日：2021-06-24
Applicant: DIC Corporation
Inventor： Ryuichi MATSUOKA , Lichen YANG , Hiroyoshi KANNARI
IPC: C08G63/193 , C08G63/199 , C08G63/672 , C08G63/81 , C08G64/06 , C08G64/30 , C08K5/14 , C08K5/5313 , C08K5/523 , C08K5/5333 , C08L67/03 , C08L69/00 , C09D167/03 , C09D169/00 , C08J5/24 , H05K1/03
CPC classification number: C08G63/193 , C08G63/199 , C08G63/672 , C08G63/81 , C08G64/06 , C08G64/307 , C08K5/14 , C08K5/5313 , C08K5/523 , C08K5/5333 , C08L67/03 , C08L69/00 , C09D167/03 , C09D169/00 , C08J5/24 , H05K1/0366 , C08J2367/03 , C08J2369/00 , H05K2201/0145
Abstract: An object is to provide a cured product and the like with excellent fire retardancy, heat resistance, and dielectric properties by using a curable resin having a specific structure and a curable resin composition containing the curable resin, a radical polymerization initiator, and a fire retardant. Specifically provided are a curable resin represented by General Formula (1) and a curable resin composition containing the curable resin, a radical polymerization initiator (B), and a fire retardant (C):
in the formula, Ra and Rb each independently represent an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon number of 1 to 12; k indicates an integer of 0 to 3; X represents a hydrocarbon group; and Y represents General Formula (2) or (3) below:
in the formula, Z represents an alicyclic group, an aromatic group, or a heterocyclic group.
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公开(公告)号：US20230272156A1
公开(公告)日：2023-08-31
申请号：US18008944
申请日：2021-05-13
Applicant: DIC Corporation
Inventor： Ryuichi MATSUOKA , Lichen YANG , Hiroyoshi KANNARI
CPC classification number: C08G61/025 , C08G61/10 , C08L65/02 , C08L65/04 , C08G2261/126 , C08G2261/1646 , C08G2261/312 , C08G2261/592 , C08G2261/76 , C08L2201/08 , C08L2203/162 , C08L2203/206
Abstract: An object is to provide a cured product having excellent heat resistance and dielectric properties (low dielectric properties) and prepregs, circuit boards, build-up films, semiconductor sealing materials, and semiconductor devices having these pieces of performance by using a curable resin having a specific structure. Specifically, provided is a curable resin having a structural unit (1) represented by General Formula (1) below and a terminal structure (2) represented by General Formula (2) below. In Formulae (1) and (2) above, the details of R1, R2, R3, k, and X are as described herein.
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公开(公告)号：US20230242691A1
公开(公告)日：2023-08-03
申请号：US18007742
申请日：2021-05-20
Applicant: DIC Corporation
Inventor： Lichen YANG , Ryuichi MATSUOKA , Hiroyoshi KANNARI
IPC: C08F136/22 , C08J5/24 , C09D147/00 , C08L47/00
CPC classification number: C08F136/22 , C08J5/24 , C09D147/00 , C08L47/00 , C08J2347/00
Abstract: An object is to provide a cured product, for example, that is made with a curable resin composition containing a curable resin having a particular structure, a radical polymerization initiator, and a flame retardant and therefore is superior in flame retardancy, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties). Specifically, there are provided a curable resin represented by general formula (1) below and a curable resin composition containing this curable resin, a radical polymerization initiator (B), and a flame retardant (C). (In general formula (1) above, Y is a substituent represented by general formula (2) below, and the details of the substituents and the numbers of substituents presented in general formulae (1) and (2) above are as described in the text.)
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公开(公告)号：US20230159695A1
公开(公告)日：2023-05-25
申请号：US17917232
申请日：2021-03-11
Applicant: DIC Corporation
Inventor： Lichen YANG , Ryuichi MATSUOKA , Hiroyoshi KANNARI
IPC: C08G61/02
CPC classification number: C08G61/02
Abstract: Provided is a cured product having excellent heat resistance and dielectric properties (low dielectric properties) by using a curable resin characterized by having an indane skeleton. Specifically, provided are a curable resin having an indane skeleton represented by the following formula, a resin composition containing the same, and a cured product thereof.
X is a (meth)acryloyl group; Ra and Rb are each an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon atom number of 1 to 12; j is an integer of 1 to 3; k and 1 are each an integer of 0 to 4; n is an average number of repeating units, being 0.5 to 20; and m is an integer of 0 to 2.
