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    LASER PROCESSING APPARATUS
    2.
    发明申请
    LASER PROCESSING APPARATUS 有权
    激光加工设备

    公开(公告)号：US20160151857A1

    公开(公告)日：2016-06-02

    申请号：US14953640

    申请日：2015-11-30

    Applicant: DISCO CORPORATION

    Inventor： Wataru Odagiri ,  Kouichi Nehashi ,  Joel Koerwer ,  Hironari Ohkubo ,  Shuichiro Tsukiji ,  Ryugo Oba ,  Kentaro Odanaka ,  Takashi Sampei

    IPC: B23K26/06 ,  H01L21/78 ,  B23K26/082 ,  H01L21/687 ,  B23K26/035 ,  B23K26/04

    CPC classification number: B23K26/0626 ,  B23K26/032 ,  B23K26/035 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/359 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/78

    Abstract: A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.

    Abstract translation: 激光加工装置的激光束照射单元包括脉冲激光振荡器，将夹持在夹盘上的工件上的脉冲激光束会聚并照射的冷凝器，设置在脉冲激光振荡器和冷凝器之间的分色镜， 闪光照射单元，其在分色镜和聚光器的路线上照射光，设置在闪光灯照射单元和分色镜之间的分束器和设置在由分束器分开的光的路线上的图像拾取单元。 控制单元使闪光灯照射单元和图像拾取单元以与从脉冲激光束振荡器振荡的脉冲激光束定时关系起作用并照射到工件上，并且基于来自所述脉冲激光束振荡器的图像信号检测处理状态 摄像单元

    PROCESSING METHOD OF PACKAGE WAFER
    3.
    发明申请
    PROCESSING METHOD OF PACKAGE WAFER 审中-公开

    公开(公告)号：US20180061711A1

    公开(公告)日：2018-03-01

    申请号：US15677677

    申请日：2017-08-15

    Applicant: DISCO CORPORATION

    Inventor： Yuta Yoshida ,  Hironari Ohkubo

    IPC: H01L21/78 ,  H01L21/302 ,  H01L21/56 ,  H01L23/12

    CPC classification number: H01L21/78 ,  H01L21/302 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/561 ,  H01L21/681 ,  H01L22/20 ,  H01L23/12 ,  H01L23/3114 ,  H01L23/544

    Abstract: A processing method of a package wafer includes a mold resin removal step of exposing grooves filled with a mold resin of the package wafer in a peripheral surplus region, a holding step of holding the package wafer in such a manner that the grooves are exposed, an orientation adjustment step of causing the grooves to be parallel to a processing-feed direction in which processing feeding of a chuck table is carried out when dividing grooves are formed, a coordinate registration step of imaging both ends of the plural grooves exposed at a peripheral edge and registering coordinate information of both ends or a single side of the grooves from taken images, and a dividing groove forming step of calculating the positions of the dividing grooves to be formed along the grooves based on the registered coordinate information of the grooves and forming the dividing grooves along the grooves.

    Processing apparatus
    5.
    发明授权
    Processing apparatus 有权

    公开(公告)号：US12236619B2

    公开(公告)日：2025-02-25

    申请号：US17805172

    申请日：2022-06-02

    Applicant: DISCO CORPORATION

    Inventor： Hironari Ohkubo

    IPC: G06K9/00 ,  G06T3/4038 ,  G06T7/00 ,  G06T7/32 ,  H01L21/67

    Abstract: A control unit of a processing apparatus detects a linear region corresponding to a first planned dividing line from an intersection region of the first planned dividing line and a second planned dividing line, obtains an angle between the linear region and an X-axis direction, and positions the linear region corresponding to the first planned dividing line in the X-axis direction. A linear region corresponding to a next first planned dividing line is detected and an interval between the first planned dividing lines is set. A second planned dividing line interval setting section detects two linear regions corresponding to second planned dividing lines, the linear regions being adjacent to each other, and an interval is set between the second planned dividing lines. A device image enclosed by a pair of first planned dividing lines and a pair of second planned dividing lines is generated and stored.

    Laser processing apparatus
    6.
    发明授权
    Laser processing apparatus 审中-公开

    公开(公告)号：US10668569B2

    公开(公告)日：2020-06-02

    申请号：US15148495

    申请日：2016-05-06

    Applicant: DISCO CORPORATION

    Inventor： Kentaro Odanaka ,  Hironari Ohkubo ,  Zentaro Kawasaki

    IPC: B23K26/364 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08 ,  B23K101/40

    Abstract: Disclosed herein is a laser processing apparatus including a controller. The controller includes a target pattern detecting section performing matching between patterns formed in each device imaged and a key pattern to thereby detect a target pattern included in each device, a spacing detecting section detecting the spacing in a Y direction between the target pattern and an ablation groove formed along each division line by ablation, and a map creating section creating a map showing the spacing in the Y direction between each target pattern and the ablation groove for the plural devices arranged along the ablation groove.

    WAFER PROCESSING METHOD
    7.
    发明申请
    WAFER PROCESSING METHOD 有权

    公开(公告)号：US20170186646A1

    公开(公告)日：2017-06-29

    申请号：US15388062

    申请日：2016-12-22

    Applicant: DISCO CORPORATION

    Inventor： Hironari Ohkubo ,  Taku Iwamoto

    IPC: H01L21/78 ,  H01L21/66 ,  H01L23/544 ,  H01L21/304

    CPC classification number: H01L21/78 ,  B28D5/0058 ,  B28D5/022 ,  H01L21/3043 ,  H01L21/6836 ,  H01L22/12 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453

    Abstract: A wafer processing method including the steps of storing information on the intervals and positions of metal patterns formed on part of division lines on a wafer into a storage unit of a cutting apparatus, detecting the division lines, forming a cut groove along each division line by using a cutting blade, imaging an area including the cut groove at any position where the metal patterns are not formed, by using an imaging unit included in the cutting apparatus, according to the information on the intervals and positions of the metal patterns previously stored, during the step of forming the cut grooves, and measuring the positional relation between the position of the cut groove and a preset cutting position. Accordingly, kerf check can be performed without being influenced by burrs produced from the metal patterns in cutting the wafer, so that the wafer can be cut with high accuracy.

    Wafer processing method
    8.
    发明授权
    Wafer processing method 有权

    公开(公告)号：US11462439B2

    公开(公告)日：2022-10-04

    申请号：US17064187

    申请日：2020-10-06

    Applicant: DISCO CORPORATION

    Inventor： Hironari Ohkubo ,  Keita Obara ,  Shinya Honda

    IPC: H01L21/268 ,  H01L21/66 ,  H01L21/683 ,  H01L23/544 ,  H01L21/78 ,  G06T7/73 ,  G06T7/00

    Abstract: A wafer processing method includes a pattern region detecting step, an evaluation region setting step, and an evaluation region deploying step. The pattern region detecting step is a step of detecting a period and positional information in which a substantially identical image appears in an imaged image and detecting a pattern region corresponding to one period. The evaluation region setting step is a step of detecting a position in which no metallic pattern is formed on planned dividing lines and setting the position as an evaluation region for evaluating quality of a processed groove. The evaluation region deploying step is a step of recording the position of the evaluation region in the pattern region and deploying the evaluation region at similar positions in different pattern regions.

    LASER PROCESSING APPARATUS
    10.
    发明申请
    LASER PROCESSING APPARATUS 审中-公开
    激光加工设备

    公开(公告)号：US20160332260A1

    公开(公告)日：2016-11-17

    申请号：US15148495

    申请日：2016-05-06

    Applicant: DISCO CORPORATION

    Inventor： Kentaro Odanaka ,  Hironari Ohkubo ,  Zentaro Kawasaki

    IPC: B23K26/364 ,  B23K26/03 ,  B23K26/00

    Abstract: Disclosed herein is a laser processing apparatus including a controller. The controller includes a target pattern detecting section performing matching between patterns formed in each device imaged and a key pattern to thereby detect a target pattern included in each device, a spacing detecting section detecting the spacing in a Y direction between the target pattern and an ablation groove formed along each division line by ablation, and a map creating section creating a map showing the spacing in the Y direction between each target pattern and the ablation groove for the plural devices arranged along the ablation groove.

    Abstract translation: 这里公开了一种包括控制器的激光加工装置。 所述控制器包括目标图案检测部分，其执行在所成像的每个设备中形成的图案与键图案之间的匹配，从而检测包括在每个设备中的目标图案;间隔检测部分，检测目标图案和消融之间的Y方向上的间隔 通过烧蚀沿着每个分割线形成的凹槽，以及映射创建部分，其形成沿着消融槽布置的多个器件的每个目标图案和消融凹槽之间的Y方向上的间隔的映射。

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