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    LASER PROCESSING APPARATUS
    1.
    发明申请
    LASER PROCESSING APPARATUS 有权
    激光加工设备

    公开(公告)号：US20160151857A1

    公开(公告)日：2016-06-02

    申请号：US14953640

    申请日：2015-11-30

    Applicant: DISCO CORPORATION

    Inventor： Wataru Odagiri ,  Kouichi Nehashi ,  Joel Koerwer ,  Hironari Ohkubo ,  Shuichiro Tsukiji ,  Ryugo Oba ,  Kentaro Odanaka ,  Takashi Sampei

    IPC: B23K26/06 ,  H01L21/78 ,  B23K26/082 ,  H01L21/687 ,  B23K26/035 ,  B23K26/04

    CPC classification number: B23K26/0626 ,  B23K26/032 ,  B23K26/035 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/359 ,  B23K2101/40 ,  H01L21/67092 ,  H01L21/78

    Abstract: A laser beam irradiation unit of a laser processing apparatus includes a pulse laser oscillator, a condenser which converges and irradiates a pulse laser beam upon a workpiece held on a chuck table, a dichroic mirror disposed between the pulse laser oscillator and the condenser, a strobo flash irradiation unit which irradiates light on a route of the dichroic mirror and the condenser, a beam splitter disposed between the strobo flash irradiation unit and the dichroic mirror, and an image pickup unit disposed on the route of the light split by the beam splitter. A control unit renders the strobo flash irradiation unit and the image pickup unit operative in a timed relationship with the pulse laser beam oscillated from the pulse laser beam oscillator and irradiated upon the workpiece and detects a processed state on the basis of an image signal from the image pickup unit.

    Abstract translation: 激光加工装置的激光束照射单元包括脉冲激光振荡器，将夹持在夹盘上的工件上的脉冲激光束会聚并照射的冷凝器，设置在脉冲激光振荡器和冷凝器之间的分色镜， 闪光照射单元，其在分色镜和聚光器的路线上照射光，设置在闪光灯照射单元和分色镜之间的分束器和设置在由分束器分开的光的路线上的图像拾取单元。 控制单元使闪光灯照射单元和图像拾取单元以与从脉冲激光束振荡器振荡的脉冲激光束定时关系起作用并照射到工件上，并且基于来自所述脉冲激光束振荡器的图像信号检测处理状态 摄像单元

    LASER MACHINING APPARATUS
    3.
    发明申请
    LASER MACHINING APPARATUS 审中-公开
    激光加工设备

    公开(公告)号：US20160207145A1

    公开(公告)日：2016-07-21

    申请号：US15001447

    申请日：2016-01-20

    Applicant: DISCO CORPORATION

    Inventor： Takashi Sampei

    IPC: B23K26/08 ,  B23K26/402 ,  B23K26/362

    Abstract: A laser machining apparatus has a workpiece holding unit, a laser irradiation unit, a machining feed unit that moves the holding unit and the laser irradiation unit in a machining feed direction, an indexing feed unit that moves the holding unit and the laser irradiation unit in an indexing feed direction, and a control unit that controls the operation of each component. The time required to stop the laser irradiation unit relative to the holding unit can be denoted by ‘ta’ and that required to index the irradiation position of the laser beam at the next scheduled division line can be denoted by ‘tb.’ When tb>ta, the control unit initiates the stopping and indexing simultaneously after a machining step and takes advantage of remaining time (tb−ta) following the end of the stopping to start to accelerate the laser irradiation unit relative to the holding unit.

    Abstract translation: 激光加工装置具有工件保持单元，激光照射单元，在加工进给方向上移动保持单元和激光照射单元的加工进给单元，使保持单元和激光照射单元移动的分度供给单元 分度供给方向，以及控制各部件的动作的控制部。 激光照射单元相对于保持单元停止所需的时间可以由“ta”表示，并且在下一个调度的分割线处将激光束的照射位置设定的索引所需的时间可以表示为“tb” ta，控制单元在加工步骤之后同时启动停止和索引，并且利用停止结束之后的剩余时间（tb-ta）开始加速激光照射单元相对于保持单元的加速。

    Laser machining apparatus
    4.
    发明授权
    Laser machining apparatus 有权

    公开(公告)号：US10532430B2

    公开(公告)日：2020-01-14

    申请号：US15001447

    申请日：2016-01-20

    Applicant: DISCO CORPORATION

    Inventor： Takashi Sampei

    IPC: B23K26/402

    Abstract: A laser machining apparatus has a workpiece holding unit, a laser irradiation unit, a machining feed unit that moves the holding unit and the laser irradiation unit in a machining feed direction, an indexing feed unit that moves the holding unit and the laser irradiation unit in an indexing feed direction, and a control unit that controls the operation of each component. The time required to stop the laser irradiation unit relative to the holding unit can be denoted by ‘ta’ and that required to index the irradiation position of the laser beam at the next scheduled division line can be denoted by ‘tb.’ When tb>ta, the control unit initiates the stopping and indexing simultaneously after a machining step and takes advantage of remaining time (tb−ta) following the end of the stopping to start to accelerate the laser irradiation unit relative to the holding unit.

    Laser processing apparatus and laser processing method
    5.
    发明授权
    Laser processing apparatus and laser processing method 有权

    公开(公告)号：US10406631B2

    公开(公告)日：2019-09-10

    申请号：US15988930

    申请日：2018-05-24

    Applicant: DISCO CORPORATION

    Inventor： Takashi Sampei ,  Yukiyasu Masuda

    IPC: B23K26/08 ,  H01L21/77 ,  B23K26/067 ,  B23K26/359 ,  B23K26/364 ,  B23K103/00 ,  B23K101/40

    Abstract: A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a wafer thereon in X directions, and first and second indexing feed units configured to indexing-feed the first and second condensers respectively in Y directions. While the wafer is being processed with the laser beam from the first condenser along a projected dicing line on the wafer in the X directions, the second condenser is indexing-fed and positioned on a next projected dicing line along which to process the wafer.

    METHOD OF DIVIDING PLATE-SHAPED WORKPIECES
    8.
    发明申请
    METHOD OF DIVIDING PLATE-SHAPED WORKPIECES 有权
    分层板形工作方法

    公开(公告)号：US20170076985A1

    公开(公告)日：2017-03-16

    申请号：US15264031

    申请日：2016-09-13

    Applicant: DISCO CORPORATION

    Inventor： Toshiyuki Yoshikawa ,  Takashi Sampei

    IPC: H01L21/78 ,  H01L21/66 ,  B23K26/38 ,  B23K26/08 ,  B23K26/03

    CPC classification number: H01L21/78 ,  B23K26/032 ,  B23K26/0823 ,  B23K26/0853 ,  B23K26/38 ,  B23K26/402 ,  B23K37/0235 ,  B23K37/0408 ,  B23K2101/40 ,  B23K2101/42 ,  B23K2103/50 ,  B23K2103/56 ,  H01L22/12 ,  H01L33/0095

    Abstract: Disclosed herein is a method of dividing rectangular plate-shaped workpieces into individual device chips including a detecting step wherein an annular frame to which a plurality of rectangular plate-shaped workpieces are stuck is held on a chuck table and the positions and angles of the projected dicing lines on each of the plate-shaped workpieces are detected, and a dividing step wherein a laser beam having a wavelength which is absorbable by the plate-shaped workpieces is applied from a laser beam applying unit to the plate-shaped workpieces while the chuck table and the laser beam applying unit are being relatively processing-fed and finely adjusted for each of the plate-shaped workpieces on the basis of the positions and angles detected in the detecting step, thereby dividing the plate-shaped workpieces into a plurality of device chips along the projected dicing lines.

    Abstract translation: 本发明公开了一种将矩形板状工件分割为单独的装置芯片的方法，包括检测步骤，其中将多个矩形板状工件卡在其上的环形框架保持在卡盘台上，并将投影的位置和角度 检测每个板状工件上的切割线，以及分割步骤，其中具有可由板状工件吸收的波长的激光束从激光束施加单元施加到板状工件，同时卡盘 基于在检测步骤中检测到的位置和角度，对每个板状工件进行相对加工和精细调整的工作台和激光束施加单元，从而将板状工件分成多个装置 芯片沿着预计的切割线。

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